查询词典 chip

PART ONE INVESTIGATION OF THE MOLECULAR MECHANISM OF THE IMMUNO-MODULATION EFFECT OF HALR USING AFFYMETRIX CHIP Objective: Augmenter of liver regeneration is a nonspecific factor that can stimulate hepatocytes proliferation.

第一部分运用基因芯片技术研究hALR的免疫调控作用的分子机制目的：肝再生增强因子(Augmenter of liver regeneration， ALR)是一种非特异性、具有热稳定性、不同于以往已知的促肝细胞增殖的肝细胞再生因子。

Design drawings for hardware and software of single chip computer automatic control system were given.

给出了单片机自动控制系统的硬件和软件设计图。

An on-chip Automatic Gain Control circuit controls the gain of this preamplifier from -15 to 24 dB.

片上自动增益控制电路控制，从这个前置放大器增益-15至24分贝。

Under these constraints, it is useful to estimate the average power consumption before the chip is fabricated.

对功耗分析方面来讲主要是最大功耗和平均功耗两个方面的估计问题。

Changed the chip shot to make it more challenging and also to improve the feel of it--more backspin, better trajectory.

改变了切杆，使其更具挑战性，并提高它的感觉-更多的下旋，更好的轨迹。

The high-accuracy electronic balance is made up of bridge type strength sensor, basic voltage circuit, AD7730, ARM single chip.

高精度电子称由桥式力传感器、基准电压电路、AD7730和32位ARM单片机组成。

Japan's main Samsung, Japan Bando, Germany than Austria, the United States Gates, Italy SAMPLA, Netherlands DERCO, varieties are: conveyor belt, using Teflon oven conveyor belt, V-belt, timing belts, speed zone, on-chip baseband, with a round steel and steel deduction and the deduction of such mechanical and electrical spare parts, the operating company, I really merged with the world.

主要有日本三星、日本阪东、德国奥比、美国盖茨、意大利SAMPLA、荷兰DERCO等，品种有：输送带、烘箱用铁氟龙输送带、三角带、同步带、变速带、片基带、圆带以及钢扣和钢扣机之类机电零配件，我公司的经营真正做到了与世界并轨。

The chip multilayer bandpass filter in this paper is suitable for SMT.

制备出的片式多层带通滤波器适用于表面贴装技术。

This paper presents a fast design of Chebyshev bandpass filter based on 8th-order continuous-time active filter MAX274 chip.

本文提出了基于八阶连续时间有源滤波器芯片MAX274的快速实现Chebyshev带通滤波器的设计方案。

The simulation indicates that dielectric constant warp is key factor to the design and preparation of chip mulilayer bandpass filter. The simulations were shown to be in good agreement with the experimental results.

模拟仿真表明：低烧材料的相对介电常数偏差是器件设计制备中的关键要素，仿真优化结果与LTCC试验样品的测试结果吻合较好。

The split between the two groups can hardly be papered over.

这两个团体间的分歧难以掩饰。

This approach not only encourages a greater number of responses, but minimizes the likelihood of stale groupthink.

这种做法不仅鼓励了更多的反应，而且减少跟风的可能性。