查询词典 chip

If the height of bump is higher, the radius of bump is smaller, and the thickness of wire , substrate and chip is thicker, the strain of package without underfill is smaller. If the height of bump is shorter, the radius of bump is bigger, the thickness of wire is thinner, and the thickness of substrate and chip is thicker, the strain of package with underfill is smaller.

在应变方面，较高的凸块高度，较小的凸块半径，较厚的线路、基板和晶片厚度将对未填胶构装体有较小的应变值；另外较矮的凸块高度，较大的凸块半径，较薄的线路，较厚的基板和晶片厚度将对填胶构装体有较小的应变值。

Capillary phenomena was studied and discussed by the scholars about 200 years ago, but the progress was slow due to the limited equipments and manufacture precision of the microchannel.In recent years, because of the rapid development of MEMS and micromachining, many applications of the capillary flow is widely developing in some modern processes, such as underfilling of flip chip, flow in microfluidic chip or biochip, and a variety of other fields.

摘要 毛细现象大约在200年前便断断续续被欧美学者所研究讨论，但由於当时微细加工受到仪器设备和制造精度的限制，因此发展极为缓慢；近年来由於微机电系统与微细加工之精进，许多具有微流道的应用设备，陆续被制作问世，加上光学显微镜与影像撷取设备的普遍，对於研究此课题的推展极有助益；且随著微生医、覆晶底胶充填与微流体系统等领域之受到重视，毛细现象导致的充填问题、驱动原理及液体流动的控制，都变得相当的重要；本研究基於如此的动机与目的，进行微流道内液体之毛细流动现象及时间的探讨。

On the basis of the summarization of MCM-Cs main features and its assembly and packaging technologies, the paper puts stress on relatively deepgoing studies in practically advanced MCM-C assembly process technologies as gold ball wire bonding, IC chip gold ball stud bump making, IC flip chip bonding and underfilling, in high reliability MCM-C packaging process technologies as integral LTCC substrate packaging, hermetically metal sealing, and also in the basic technological process of MCM-C assembly and packaging. Later on, it presents the effectively engineering development of two high level actual module products--a high-density monolithic processor system MCM-C , a high-speed data collecting and processing system MCM-C. Lastly, it briefly introduces various common methods of quality inspection and reliability test of MCM-C assembly and packaging in engineering practice.

论文在综述MCM-C的主要特点及其组装封装技术的基础上，重点对金丝球引线键合、IC芯片金球凸点制作、IC芯片倒装焊与下填充等实用先进MCM-C组装工艺技术和LTCC基板与外壳及PGA引线的一体化封装、气密性金属封装等高可靠MCM-C封装工艺技术以及MCM-C组装封装基本工艺流程展开了较深入的研究，有效完成了高密度单片机系统MCM-C和高速数据采集控制系统MCM-C等两种高水平实际产品的工程化研制工作，扼要介绍了工程实践中MCM-C组装封装工艺常用的质量检验方法和可靠性试验方法。

The standard curve was constructed by using gene chip after the methylated and unmethylated DNA were mixed at different ratio. Then treated samples of U266 cells were dotted on gene chip, obtained results were compared with standard curve to get the quantitative results.

采用基因芯片的方法，将完全未甲基化的DNA和完全甲基化的DNA混合后制成标准曲线，将U266细胞株样本处理后点在芯片上与标准曲线进行比较后得出定量检测的结果。

The operation methods and operation main points of SQL 950 submerged granulator were introduced including the start and stop operation of the granulator, the flow distribution of the three streams of water, the operation cycle of the desalinized water plate exchanger, the easy occlusion of the nozzle, the chip stacking of the long chip accumulator and clogged with conveying waterpipe, the easy overload and untight seal of the centrifugal drier.

介绍了SQL 950型水下切粒机的操作方法及操作要点，包括切粒的开机操作，停机操作，3股水的流量分配，脱盐水板式换热器运行周期，喷嘴易堵塞，长料收集器粒子堆积堵塞输送水管，离心干燥机易过载和密封不严的处理。

On the base of it, a novel design of MCE chip system is presented.2. Due to the inert to most chemicals, fused silica is chosen as the substrate and fabricated the chip using photolithography, wet etching and bonging technique. The inner side of micro-channel is smooth and straight.

根据微通道电泳芯片原理以及相应的应用要求设计芯片，采用微机械加工技术，选择优质石英为芯片材料制作芯片，并对制作工艺参数进行了优化，完成的芯片微通道内壁光滑，边界平整，完全满足实验要求；对微通道内壁进行修饰处理，有效地减少了内壁对样品的吸附，同时大大降低了电渗流的影响； 3。

In case of 8-bit pull-up resistors/termination resistors, if footprint area needed for 8 chip resistors(1608 size) is considered as 100%, area requirement is only 8 for 2 chip network resistors CN1J4 (with 4 elements) and 45% for one CND1J10 (with bussed 8 elements).

如果八个分离的上拉/终端电阻（1608封装）的管脚布线面积认为是100%的话，8的电阻只需要两片网络电阻 CN1J4(4个电阻)，而用 CND1J10（8的电阻）的话，面积只是分离电阻的45%。

A multiplayer chip LC resonator was fabricated using planar inductor and parallel plate capacitor. Because lumped inductor has small Q value and there is stray parameter effect in high permittivity substrate, the Q value of chip LC resonator is not high. Resonators based on λ/4 stripline with end short circuited were designed and fabricated. Input and output pads, coupled to the stripline using gap-coupling capacitor, are in the same layer with the center conductive strip. This new structure is very convenient for manufacturing in comparison with the conventional structure.

采用间隙电容耦合结构实现的谐振频率为1.8GHz四分之一波长终端短路带状线单端口谐振器的Q值最大值为225，谐振频率为1GHz双端口谐振器的Q值为83，谐振频率和Q值与耦合间隙、带状线的厚度和耦合引线长度有关；二分之一波长带状线谐振器的Q值和四分之一波长相比较尺寸较大，由于导电带较长，造成金属的损耗增加，从而导致谐振器的Q值较低；带状线结构的谐振器频率调节困难，本文提出了改变接地端的宽度实现谐振频率的微调方法，可实现频率调节量约1.5%。

The detector first combines the technology of single chip with the technology of artificial neural network , colligates the strongpoint of single chip and artificial neural network , overcomes the difficulty of linearization between gas sensor output and gas concentration.

该仪器首次将单片机与人工神经网络相结合用于气体浓度检测，综合了单片机和人工神经网络的优点，克服了传统仪器气体传感器输出与气体浓度难以线性化等缺点。

Because of the previous slowly enciphering of enciphering chip, we present a new method to accelerate enciphering, which designs chip based on an improving Matrix Coverage algorithm.

文章基于目前公钥密码加密芯片加密速度慢的缺点提出了一种新的方案，即根据一种改进的二次背包算法设计加密芯片。

The split between the two groups can hardly be papered over.

这两个团体间的分歧难以掩饰。

This approach not only encourages a greater number of responses, but minimizes the likelihood of stale groupthink.

这种做法不仅鼓励了更多的反应，而且减少跟风的可能性。