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The characteristics and process features of Italy NOY PET/PA fine denier yarn spinning equipment were introduced. The difference in chip drying, transferring and spinning system was emphasized in contrast to normal equipment. The requirement for process parameters such as chip drying, spinning temperature and velocity and quenching conditions etc.

介绍意大利 NOY工程公司配置的涤纶两用细旦纺丝机的设备特征及工艺特点，着重指出了该设备在切片干燥、输送和纺丝系统上与常规设备的差异，并结合生产实例对涤纶细旦纺丝在切片干燥、纺丝温度、纺丝速度和侧吹风条件等工艺上的要求作了探讨。

The core chip of the system is a singlechip PIC16F877A, and it collects pulse wave data and processes data based on oscillometric method, at last the value of body's blood pressure and heart rate are calculated by the chip.

系统以单片机PIC16F877A为核心芯片，基于振荡法原理对人体的脉搏波进行数据采集处理，并最终计算出人体的高低血压值、心率值和体温值。

In chapter four, after analyzing the RF qualification, I design the receive scheme of RF and IF parts, and accomplish the choosing of chip and design of peripheric connection of chip.

第四章在分析CDMA基站仿真系统射频技术指标和要求的基础上，设计了射频、中频发射接收方案，并完成了芯片的选择和芯片外围连接设计。

This paper offers a design scheme using single chip microcomputer AT89S51 and periphery chip LM331, MAX7219, among which, the MCU is a instrument designed for gaining and controlling data from linear strain displacement sensor under constant voltage and presser sensor located at plank. It is pithily in structure and excellent in reliability.

文中介绍利用单片机AT89S51和外围芯片LM331、MAX7219的设计方案，其中微处理器单元是用来从恒电势的线性应变位移传感器和装在支架上的压力传感器的电信号中获取及处理数据的设备，安装在轻的铝合金外壳中，按用途需要设计而成，它结构简洁、可靠性高。

Presignal processors: finishing head for processing the data signals from the chip, the chip such as the problem may be not be able to correctly identify the phenomenon of hard disk failure.

前置信号处理器：用于加工整理磁头芯片传来的数据信号，该芯片如出现问题可能会出现不能正确识别硬盘的故障现象。

They may be working piece of another advantage of the casing, is used in when you need to quickly shoot can be as early as the chip-chests, completed shooting the film, when finished in a roll of casing, the photographer can detach a movie-chests, and immediately put on a new cartridges and shooting miss the crucial moment, in case of shooting Assistant, the surprint rediscussion of the film took out a volume of the new film, this procedure can be repeated; in addition, most of the 120 SLR computers may also have a different format, such as on-chip Bronica SQ-A, he will have 6-by-6, 6 × 4." and " 5,135 quanjing 135a standards of film cartridges.

随时可不不装不不装片匣的另一个弊端，是用在需给飞快不断拍摄时可预早在众个片匣不不装妥胶卷，当拍摄完片匣洋的一卷时，拍照师可以不不装下片匣不独立即不不装上另一片匣，减众在拍摄洋错失重给工夫的可能性，如有拍摄帮手的话，则可把已曝平的胶卷取不入再换上一卷陈胶卷，这样的历程可以屡屡举行；此外，不小局部120独镜反平机也有差别片幅的片匣，如Bronica SQ-A，便有6×6，6×4.5，135&全景&及135尺量量的片匣。

And other peripheral product: Epson Chip Resetter; Epson Auto Reset Chip; The printer ink, water transfer ink, Sublimation ink and heat press machineMug heat press machine, Plate heat press machine, Hat heat press machine, and Plain heat press machine.

及其他周边产品：爱普生芯片resetter ；爱普生自动复位芯片；打印机油墨，水转移油墨，升华油墨及热压机（杯热压机，热板机，帽子，热压机，朴素的热压机。

By using an empirical potential of free energy on dsDNA which was obtained experimentally by Strey, a relation between total energy of chip and some factors, such as nanogeometric, physical. chemical characteristics of DNA, geometric dimension, macroscopical mechanical properties of chip, etc was formulated under the consideration of mechanical energy of microcantilever beam, electrostatic energy, configuration entropy, and osmotic energy of gene-layer.

首先，在考虑微悬臂梁机械能和基因层静电能、构型熵、渗透能的情况下，借助Strey通过实验得到的双链DNA自由能的经验势，建立了DNA纳观几何、物理、化学特征以及芯片几何尺寸、宏观力学性能等因素与基因芯片总能量之间的关系。

The servo controller regards TI Company DSP chip TMS320LF2407A as the main chip,has adopted standard ISA bus structure,has high -integration and high-agility,has accomplished in real-time complex boolean calculation and control algo- rithms during motion control,and can be used to realize high-speed and high-accuracy servo control for mul- tiple axis.

O前言以DSP为核心的多轴伺服控制器越来越广泛地应用在运动控制系统中，上位机只需对被控对象实施总体的控制和管理，而位置反馈信号的采集，闭环控制计算及控制量的输出均由伺服控制器完成，具有运算速度快，支持复杂的运动算法的特点，能实现高速度、高精度的位置伺服或轨迹

And research shows that high thermal conductivity composite can decrease the temperature difference of underfill between chip and substrate, so that it can improve the temperature distribution of the flip chip, decrease the thermal stress of underfill and increase packaging reliability.

表明高导热系数的底充胶可明显降低在芯片和基板之间的温度差，降低底充胶的热应力，进而提高电子封装的可靠性。

The split between the two groups can hardly be papered over.

这两个团体间的分歧难以掩饰。

This approach not only encourages a greater number of responses, but minimizes the likelihood of stale groupthink.

这种做法不仅鼓励了更多的反应，而且减少跟风的可能性。