查询词典 chip of silicon

The material for the encapsulation of the chip is anodic bonding of silicon and glass.

芯片的封装采用硅和玻璃的阳极键合而成。

Finally, in the Clipper chip there are a number of silicon features, of which the most important is a fusible link system.

最后， 在大剪刀薄片中有一些矽特征，一个熔解的联编系统是哪最重要的。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

According to IS theory as well as die bond requirement in reality, Au/In was chosen by virtue of appropriate equilibrium diagram and high reaction rate from a variety of binary alloy systems as die bond media. To match CET of chip material of silicon, alloy 42 (Iron-Nickel) rather than copper—2 kinds of lead-frame materials in most common usage, was selected as substrate.

根据等温凝固原理和芯片焊接的实际需要，从多组二元合金中选出了共熔点低、反应速度快的金和铟作为焊接材料；并以硅片作为芯片，从目前最常用的框架材料—铜和铁镍四十二合金中，选出了与硅的热膨胀系数相近的铁镍四十二合金作为衬底材料。

An array of permalloy core solenoids is micromachined as microactuators on (100) silicon wafer. Then anisotropic etching of silicon in KOH solution forms the U-grooves beside the microactuators. The micromachining difficulties from the coexistence of 3-D MEMS devices and deep grooves on chip are overcome successfully. Then two fibers and permalloy piece are assembled onto the wafer together with the microstructures finishing the prototype of the new type MEMS VOA. Third, the inductance, resistance and Q value of the microfabricated solenoids are measured in the frequency range of 1-40 MHz.

第二，新开发了使用SU-85的正胶、负胶复合微加工工艺，在（100）硅片上加工了新型可变光衰减器的铁芯MEMS螺线管型电磁微执行器阵列；用KOH水溶液对（100）硅片进行湿法刻蚀，在电磁微执行器旁边微加工了V形槽结构组合，开发了单片集成三维MEMS器件和深槽的微加工关键技术；然后经过微装配制作出了电磁驱动的光纤偏移型MEMS可变光衰减器的样机。

This is the silicon chip—a little chip of silicon crystal.

这就是硅芯片-一种用硅晶体制成的芯片。

A silicon chip is a very small piece of silicon with electronic circuits on it which is part of a computer or other piece of machinery.

指内含集成电路的硅片，体积很小，常常是计算机或其他设备的一部分。

The growth of integrated circuit growth, production of silicon chip and development of solar cell, also greatly impetus the growth of silicon material..

我国集成电路的增长、硅片生产和太阳能电池的发展，也大大带动硅材料的增长。

Read and write of flash disk as USB host.According to the request of this subject, the system hardware and software for the slave device, and the communication interface to the master PC are developed. Detailed works are as follows: in order to implement the measurement principle in the system, flow-liquid levelmethod is used;velocity of flow is measured through rotor Kinemometer;water level is surveyedvia RS485 interface and pressure sensor;the C8051F060 chip which is in high performance andintegration, produced by Silicon Laboratories Company as master chip is used to capture and measure the width of impulses, so singals of flow velocity are collected and disposed;the 4×4 matrix keyboard and LCD are used in the part of man-machine interface which are easy to input, legible to read, various to display, comfy to be accepted and plain to show measure and inquiry results;FRAM memory FM3164 is used to carry out the non-volatile memory of data and accurate real-time clock.;SL811HST chip is used as USB host which can read and write flash disk,thereby a kind of adscititious mass storage is accomplished .

根据研制任务的要求，课题期间主要完成了下位机系统硬件和软件，设计了与上位机的通讯界面，所做的具体工作包括：测量原理在系统中的实现，采用了流速—水位计算法，通过旋桨式流速仪来测量流速，通过RS485接口与压力变送器通讯测量水位；主控制芯片采用了Silicon Laboratories公司的高性能、高集成度C8051F060芯片，利用其捕捉测脉宽的特性，实现了流速信号的采集和处理；人机接口部分采用了4×4矩阵键盘和LCD显示，输入方便，读数清晰，显示多样化，信息量大，易于被用户接受，更直观地显示测量及查询结果；通过采用铁电存储器FM3164实现了数据的非易失性存储和精确的实时时钟；通过采用SL811HST芯片，实现了USB主机的功能，可读写U盘，从而实现了单片机的外挂式海量存储。

MTB type automatic tiering silicon chip machine is a three-workstation tiering chip machine with water-bed sliding table which is designed and manufactured according to demands of silicon chip manufacturing enterprise; 75 silicon chips can be lined at one set up; special basket fixture can be used for fast changing of 6''/8'' silicon slice, it's easy to operate reliably.

MTB 型硅片自动排片机是根据太阳能硅片生产企业实际生产需要设计改进、制造的水床式三工位硅片排片机；一次排片75片。特有的花篮定位治具能适应6吋/8吋硅片的快速转换，操作简单，工作可靠。

Breath, muscle contraction of the buttocks; arch body, as far as possible to hold his head, right leg straight towards the ceiling (peg-leg knee in order to avoid muscle tension).

呼气，收缩臀部肌肉；拱起身体，尽量抬起头来，右腿伸直朝向天花板（膝微屈，以避免肌肉紧张）。

The cost of moving grain food products was unchanged from May, but year over year are up 8%.

粮食产品的运输费用与5月份相比没有变化，但却比去年同期高8％。