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To accelerate the widespread of Synchronous Chip Seal and improve the operation quality of Synchronous Chipsealer, key techniques which influence the operation quality is studied detailedly, including the control of distributing quality, the dynamics characteristics of hydraulic system and the spray characteristics of asphalt nozzle of Synchronous Chipsealer.1 The factors which influence Synchronous Chip Seal quality are studied. Fiducial probability of simultaneous distribution density is advised to be used in evaluating the distribution bias and standard deviation of asphalt and aggregates simultaneously, which is more advanced than the single index evaluation method used before.2 The volume efficiency formula of asphalt pump is revised after analyzing the data of volume efficiency with mathematical statistics, which is helpful to match the asphalt spray system and control the flow out of asphalt pump accurately. With equation deduction and experiment, dynamic of hydraulic system used in Synchronous Chipsealer is studied, which lay the theory foundation on improving the stability and efficiency from design and controlling.4 Simulation on hydraulic system used in Synchronous Chipsealer is done with AMESim; the results indicate that multi-circle parallel connected hydraulic system with constant pressure power is better than that with load-sensing pressure power at present, because the latter will oscillate when the multi circles work at the same time. This conclusion has been proved during the debug of Synchronous Chipsealer.5 Asphalt nozzle characteristics, such as flat jet shape, flow distribution, are studied with experiment, the results indicate that cross quality of asphalt distributing is not increased linearly follow the increase of fan overlap level, the best point usually exists between two whole overlap level, asphalt distributing quality is better than±4% at the 2.5 overlap level, meets the superior specified in standard; The distribution quality of Synchronous Chipsealer can be increased by spray asphalt of different flow rang with nozzle of different diameter

为了加快同步碎石封层技术的推广，提高同步碎石封层设备的作业质量，本文对同步碎石封层设备作业质量的影响因素与控制方法、液压系统的动力学特性和沥青喷嘴的喷洒特性等关键技术进行了深入细致的研究：1研究了影响同步碎石封层作业质量的因素，提出了采用联合密度分布置信概率对同步碎石封层中沥青洒布量和碎石撒布量的系统偏差和标准差指标进行综合评价的方法，克服了传统评价方法只能对单一指标进行评价的缺陷；2采用数理统计的方法，研究了沥青泵的容积效率特性，修正了沥青泵容积效率公式，为沥青喷洒系统的匹配和沥青泵出口流量的精确控制提供了依据；采用数理方程推导与试验相结合的方法，研究了同步碎石封层设备液压系统的动力学特性，为从设计和控制的角度提高同步碎石封层设备液压系统的稳定性和效率奠定了理论基础；3运用AMESim软件对采用负载敏感控制和恒压控制的两种同步碎石封层设备液压系统进行仿真，结果表明：负载敏感控制的并联液压系统在多回路同时工作时，由于液压泵排量控制参考压力不稳定，容易引发液压系统振荡，恒压控制的并联液压系统是目前技术条件下比较理想的同步碎石封层设备工作装置驱动方案；该结论亦通过同步碎石封层设备装机试验得到了验证。4采用试验的方法对沥青喷嘴的喷洒特性进行了研究，结果表明：沥青洒布的横向精度并不是随着喷洒扇面重叠度的增加线性增加，其最高点通常出现在二个重叠度之间的"半重叠位置"，"2.5重叠"洒布时，沥青的横向洒布精度≤±4%，可以达到国家相关标准中的优级标准；同步碎石封层设备还可以根据不同洒布量情况下的流量需求，采用不同通径的喷嘴进行喷洒，提高沥青洒布精度。

They may be working piece of another advantage of the casing, is used in when you need to quickly shoot can be as early as the chip-chests, completed shooting the film, when finished in a roll of casing, the photographer can detach a movie-chests, and immediately put on a new cartridges and shooting miss the crucial moment, in case of shooting Assistant, the surprint rediscussion of the film took out a volume of the new film, this procedure can be repeated; in addition, most of the 120 SLR computers may also have a different format, such as on-chip Bronica SQ-A, he will have 6-by-6, 6 × 4." and " 5,135 quanjing 135a standards of film cartridges.

随时可不不装不不装片匣的另一个弊端，是用在需给飞快不断拍摄时可预早在众个片匣不不装妥胶卷，当拍摄完片匣洋的一卷时，拍照师可以不不装下片匣不独立即不不装上另一片匣，减众在拍摄洋错失重给工夫的可能性，如有拍摄帮手的话，则可把已曝平的胶卷取不入再换上一卷陈胶卷，这样的历程可以屡屡举行；此外，不小局部120独镜反平机也有差别片幅的片匣，如Bronica SQ-A，便有6×6，6×4.5，135"全景"及135尺量量的片匣。

Accordingly, we studied the influence of BmIce in apoptosis of BmE-SWU1 through Hoechst dying.The main results are as follows:1 The analysis results of silkworm genome chip dataThe genome chip data in different silkworm tissues indicated that at the third day instar 5, the highest expressive quantity of BmIce appeared in intestine, the second highest one appeared in blood, and the lowest one in Malpighian tubes.

此外，利用家蚕全基因组芯片数据，分析了BmIce基因表达谱，并对BmIce基因在不同因子诱导下家蚕BmE-SWU1细胞中的表达量进行了荧光定量PCR分析，同时对不同表达量的BmIce基因对BmE-SWU1细胞凋亡的影响进行了Hoechst核染观察。

They may be working piece of another advantage of the casing, is used in when you need to quickly shoot can be as early as the chip-chests, completed shooting the film, when finished in a roll of casing, the photographer can detach a movie-chests, and immediately put on a new cartridges and shooting miss the crucial moment, in case of shooting Assistant, the surprint rediscussion of the film took out a volume of the new film, this procedure can be repeated; in addition, most of the 120 SLR computers may also have a different format, such as on-chip Bronica SQ-A, he will have 6-by-6, 6 × 4." and " 5,135 quanjing 135a standards of film cartridges.

随时可不不装不不装片匣的另一个弊端，是用在需给飞快不断拍摄时可预早在众个片匣不不装妥胶卷，当拍摄完片匣洋的一卷时，拍照师可以不不装下片匣不独立即不不装上另一片匣，减众在拍摄洋错失重给工夫的可能性，如有拍摄帮手的话，则可把已曝平的胶卷取不入再换上一卷陈胶卷，这样的历程可以屡屡举行；此外，不小局部120独镜反平机也有差别片幅的片匣，如Bronica SQ-A，便有6×6，6×4.5，135&全景&及135尺量量的片匣。

On the basis of the summarization of MCM-Cs main features and its assembly and packaging technologies, the paper puts stress on relatively deepgoing studies in practically advanced MCM-C assembly process technologies as gold ball wire bonding, IC chip gold ball stud bump making, IC flip chip bonding and underfilling, in high reliability MCM-C packaging process technologies as integral LTCC substrate packaging, hermetically metal sealing, and also in the basic technological process of MCM-C assembly and packaging. Later on, it presents the effectively engineering development of two high level actual module products--a high-density monolithic processor system MCM-C , a high-speed data collecting and processing system MCM-C. Lastly, it briefly introduces various common methods of quality inspection and reliability test of MCM-C assembly and packaging in engineering practice.

论文在综述MCM-C的主要特点及其组装封装技术的基础上，重点对金丝球引线键合、IC芯片金球凸点制作、IC芯片倒装焊与下填充等实用先进MCM-C组装工艺技术和LTCC基板与外壳及PGA引线的一体化封装、气密性金属封装等高可靠MCM-C封装工艺技术以及MCM-C组装封装基本工艺流程展开了较深入的研究，有效完成了高密度单片机系统MCM-C和高速数据采集控制系统MCM-C等两种高水平实际产品的工程化研制工作，扼要介绍了工程实践中MCM-C组装封装工艺常用的质量检验方法和可靠性试验方法。

This is a disign that it pass to test " train axle bush temperature ", understand train can whom and safe operation design control detection system under in one-chip computer , Thesis this is it rely mainly on one-chip computer to explain emphatically, LED lattice show chip and walk into electrical machinery central systems.

此设计通过对&火车轴瓦温度&的测试，了解火车是否能安全运行而设计的在单片机控制下的检测系统，本论文着重阐述了以单片机为主体， LED 动态显示芯片及 A/D 转换芯片的核心系统。

The array chip takes a flexible transparent polyimide thin membrane as the base, the lower surface can form a cross comb-shaped array multimicroelectrode, the electrode group is composed of two comb-shaped microelectrode array electrodes which are mutually crossed but not contacted with the electrical structures not being connected, and the microchannel between the both internal electrodes of the electrode group serves as the service passage; the array chip is inversely buckled on the fusion pool, and the cross comb-shaped array multimicroelectrode on the array chip correspondes to the cell electric fusion pool and falls in the cell electric fusion pool.

阵列芯片以柔性透明聚酰亚胺薄膜为基底，下表面通过蚀刻形成交叉梳状阵列化微电极组，电极组由两个相互交叉、互不接触、电气结构上互不连接的梳状微电极阵列电极构成，电极组内部微电极之间的微通道为工作通道；阵列芯片倒扣于融合池上，其上的交叉梳状阵列化微电极组与细胞电融合池相对应，落于细胞电融合池中。

In 1989, we familiar to ear 80486 chipses be released by the INTEL, the great place of this kind of chip lies in the boundary that it broke 1,000,000 transistors actually, integrating 1,200,000 transistors.80486 clock frequencies raise a 33 MHzs, 50 MHzs gradually from the 25 MHzs.80486 is 80386 help processor with mathematics,80387 and 1 high speed of 8 KBses saves an integration slowly in a chip, and in the 80 X86 the serieses for the very first time adopted a RISC technique, can carry out an instruction in a clock period.

1989年，我们大家耳熟能详的80486芯片由INTEL推出，这种芯片的伟大之处就在于它实破了100万个晶体管的界限，集成了120万个晶体管。80486的时钟频率从25MHz逐步提高到33MHz、50MHz.80486是将80386和数学协处理器80387以及一个8KB的高速缓存集成在一个芯片内，并且在80X86系列中首次采用了RISC技术，可以在一个时钟周期内执行一条指令。

Baseband signal can control by serial each that one-chip computer produce phase place , DDS of generator control and bring in realizing, and the phase locking ring of the integration can produce the signal carrier within AD9856 chip, its frequency is set up through the interface of the outside one-chip computer.

基带信号可以由单片机产生的串行码元控制DDS发生器的相位控制端来实现，而AD9856芯片内部集成的锁相环可以产生载波，其频率也是通过外部单片机的接口来设置。

Encapsulant was driven by capillary force into the space between the chip and substrate. Underfill technique can protect the electrical device and prevent the device from destroying because of external force. Underfill has many defects including the fill time is too long, the situation of short shot and air trap are caused easily, the yield of product of Flip-Chip is not highest and the products are universal. Therefore, there are many factors being studied in this paper to sum up the influence of underfill of Flip-Chip process cause by model parameters.

覆晶接合技术为先进电子讯号连接技术中的一种，具有高I/O数、电子讯号路径短以及尺寸小等优点，而采用覆晶接合之电子元件大部分均以底部充填技术进行封装；底部充填是一种以毛细作用为驱动力在晶片与基板之间的间隙充填底胶的封装技术，可以确保晶片不受到外力的影响而损及封装体，但此技术具有充填时间长、容易产生短射与包风等缺点，使得覆晶封装制程良率不高，间接影响覆晶封装产品的普及率，因此本文将依各种可能之参数模型对覆晶封装底部充填制程的影响，以供业界参考。

On the other hand, the more important thing is because the urban housing is a kind of heterogeneity products.

另一方面，更重要的是由于城市住房是一种异质性产品。

Climate histogram is the fall that collects place measure calm value, cent serves as cross axle for a few equal interval, the area that the frequency that the value appears according to place is accumulated and becomes will be determined inside each interval, discharge the graph that rise with post, also be called histogram.

气候直方图是将所收集的降水量测定值，分为几个相等的区间作为横轴，并将各区间内所测定值依所出现的次数累积而成的面积，用柱子排起来的图形，也叫做柱状图。