查询词典 bump ball

On the basis of the summarization of MCM-Cs main features and its assembly and packaging technologies, the paper puts stress on relatively deepgoing studies in practically advanced MCM-C assembly process technologies as gold ball wire bonding, IC chip gold ball stud bump making, IC flip chip bonding and underfilling, in high reliability MCM-C packaging process technologies as integral LTCC substrate packaging, hermetically metal sealing, and also in the basic technological process of MCM-C assembly and packaging. Later on, it presents the effectively engineering development of two high level actual module products--a high-density monolithic processor system MCM-C , a high-speed data collecting and processing system MCM-C. Lastly, it briefly introduces various common methods of quality inspection and reliability test of MCM-C assembly and packaging in engineering practice.

论文在综述MCM-C的主要特点及其组装封装技术的基础上，重点对金丝球引线键合、IC芯片金球凸点制作、IC芯片倒装焊与下填充等实用先进MCM-C组装工艺技术和LTCC基板与外壳及PGA引线的一体化封装、气密性金属封装等高可靠MCM-C封装工艺技术以及MCM-C组装封装基本工艺流程展开了较深入的研究，有效完成了高密度单片机系统MCM-C和高速数据采集控制系统MCM-C等两种高水平实际产品的工程化研制工作，扼要介绍了工程实践中MCM-C组装封装工艺常用的质量检验方法和可靠性试验方法。

For instance, we are commonly used remote bump, shine belt, brush edge, double lever the ball is waited a moment.

比如，我们常用的远距离撞击、闪带、擦边、双杆球等等。

Another group plays basketball - they bump the ball aimlessly for hours on end.

另外一群在玩篮球——他们漫无目的地连续几个小时在练习运球。

I advised Chris to bump the ball upward to lengthen and delay the swing in order to release the ball from a position that afforded greater thrust.

我请Chris稍为往上推球，加长及延缓摆荡，使离手时位置是在能够提供球最大能量的区域。

In the back of the printed substrate produced by the display means to replace the pin ball bump, substrate in the printing of a positive LSI chip assembly, and then molded resin or potting sealing methods.

在印刷基板的背面按陈列方式制作出球形凸点用以代替引脚，在印刷基板的正面装配LSI芯片，然后用模压树脂或灌封方法进行密封。

Drive out the 10 pin. I advised Chris to bump the ball upward to lengthen and delay the swing in order to release the ball from a position that afforded greater thrust.

虽然 early swing 的 release 不会有什麼不顺的感觉，但球的离手点稍稍过了强力的杠杆区会减少球的击瓶力度而留下10号瓶。

After trading several more racks, on the final game, Sakai attempted to shoot the 3 ball, bringing the cue ball three rails around the table to bump the 9 ball into the nearest pocket.

后几个交易更衣架，就最后的游戏，酒井企图拍三球，使主球三轨周围表撞9球到就近的口袋中。

Frank kick the ball into the middle, when i want bump the ball into the net, an ugly guy gave me a hug and I falled down, I was really angry , when I wanted to fist him with Drogba, the referee pointed to the penalty area.

我真的很生气，当我想和德罗巴一起揍他的时候裁判指向了点球点。

The factors, pitch of the Bump, pitch of solder ball, chip size , PCB size, PCB thickness, substrate thickness, and Cu thickness of the thermal via are choice for optimization study.

考虑的因子主要是以尺寸为研究的对象，它们是上层锡球的间距、下层锡球的间距、晶片大小、PCB 大小、PCB 厚、基板厚、热通孔铜层厚等七个因子。

The high heel concentrates the force on the heel and the forefoot," Dr. Gastwirth said. Heels contribute to hammertoes, neuromas (pinched nerves near the ball of the foot), bunions and "pump bump (a painful bump on the back of the heel), as well as toenail problems.

Gastwirth博士说，&高跟鞋会把力量集中在脚跟以及前脚掌上，&高跟鞋可能会导致槌状趾，神经瘤，以及&pump bump&（一种在后脚跟处的痛苦的肿块），当然同样会造成脚趾甲的问题。

The absorption and distribution of chromium were studied in ryeusing nutrient culture technique and pot experiment.

采用不同浓度K2CrO4(0，0.4，0.8和1.2 mmol/L)的Hoagland营养液处理黑麦幼苗，测定铬在黑麦体内的亚细胞分布、铬化学形态及不同部位的积累。

By analyzing theory foundation of mathematical morphology in the digital image processing, researching morphology arithmetic of the binary Image, discussing two basic forms for the least structure element: dilation and erosion.

通过分析数学形态学在图像中的理论基础，研究二值图像的形态分析算法，探讨最小结构元素的两种基本形态：膨胀和腐蚀；分析了数学形态学复杂算法的基本原理，把数学形态学的部分并行处理理念引入到家实际应用中。