查询词典 bump

In this paper, the bump patterns for flip-chip packages are discussed first, then an experiment is setup to study the dispensing phenomena for different bump patterns, and the CAE software is used to analyze and identify with experiment mutually. From these thorough comparisons and analytical analysis, the existence of channel could slow down the flow, the high density of bump could speed up the flow, and it could avoid the air trap by modified the bump and channel's arrangement on flip-chip package. Then flows in rectangular microchannels driven by capillary force and gravity are discussed; furthermore, the theoretical model of flow in microchannel driven by capillary force and gravity is formulated from the Navier-Stokes equations.

本文首先针对覆晶底部充填进行相关理论推导、实验与模拟，探讨不同凸块配置模型所造成的波前不平滑现象对底部充填流动的影响；即依据相关参数建立模型进行底部充填实验，同时以CAE(Computer-Aided Engineering)模流分析软体进行模拟，在完成理论探讨、实验与模拟分析之后，交叉比较理论、实验与模拟分析结果，归纳出影响底胶充填流动之因素，由结果显示在凸块密集度较高的区域，凸块可以帮助流动，但是在凸块区后方的沟槽区域则因为凸块区所提供之流量不足，所以会造成波前落后的现象，另外藉由修改凸块与沟槽配置的关系，可以有效的控制波前形状的变化情形，避免产生包风现象。

Right secret anguish issueing an abdomen reachs right bump issueing an abdomen 9, examination of clyster of agent of barium of the travel before art shows appendix is rigid or not develop 6, caecal hemicycle is slash 1, the oppressive, ministry that answer blind occupies the bump outside antrum a 2 exemple;B exceed an examination to reach bursa sex bump at explore of right flank ministry 2, solid sex is inhomogenous bump 1, the others shows without unusual;CT examination shape of bursa of west region issueing an abdomen is occupied 6 times 2, appendix is thick 1 long, local bowel wall adds the ministry that answer blind thick 1, sex of right fruit issueing an abdomen is occupied 1, the others did not see 4 times unusual.

右下腹隐痛及右下腹肿块9例，术前行钡剂灌肠检查显示阑尾僵直或不显影6例，盲肠半圆形迹1例，腔外肿块压迫、回盲部占位2例；B超检查于右侧腹部探及囊性肿块2例，实性不均匀肿块1例，其余6例无异常；CT检查显示右下腹区囊状占位2例，阑尾粗长1例，回盲部局部肠壁增厚1例，右下腹实性占位1例，其余4例未见异常。

If the height of bump is higher, the radius of bump is smaller, and the thickness of wire , substrate and chip is thicker, the strain of package without underfill is smaller. If the height of bump is shorter, the radius of bump is bigger, the thickness of wire is thinner, and the thickness of substrate and chip is thicker, the strain of package with underfill is smaller.

在应变方面，较高的凸块高度，较小的凸块半径，较厚的线路、基板和晶片厚度将对未填胶构装体有较小的应变值；另外较矮的凸块高度，较大的凸块半径，较薄的线路，较厚的基板和晶片厚度将对填胶构装体有较小的应变值。

For the COG joint subjected to thermal storage test at 80 oC for 1000hours, the resistance raises from 0.48 to 1.26Ω while in the sample, the resistance raises from 0.73 to 1.52Ω; all test results fit the reliability requirements. But the reason of increment is not only NCF material degradation cause, but also the bump is elastically. Therefore elastic bump resile caused the resistance to increase after pressing. Consequently I used another two samples which is not thermal aging compared to test samples, the results were show bump resistances increasing about 65%, its come form elastic bumps itself.

COG试片经过80oC约1000小时之后观察电阻上升情形，一片约从0.48Ω上升至1.26Ω另一片从0.73Ω到1.52Ω也符合可靠范围内，但是上升的原因不完全是胶材劣化导致，因为凸块本身具有弹性，所以在压合之后还会回弹造成电阻上升，因此会使用另两片未热时效的试片来比较，得知结果大概65％的电阻上升是来自本身具弹性导致。

In addition, because of the interleaving of top and bottom nappes, there is no bump in the air, the finite width of spillways can be fully utilized, and flood discharging atomization caused by bump of nappes can be weakened.

而且，表、深孔水舌在空中交错穿插，不发生空中碰撞，可充分利用有限的溢流宽度，并减少因水舌空中碰撞而导致的泄洪雾化的增强。

From say on the whole, bump deep increase as what bump force and increase, anti-impact gear is bumped in resistance when, steel tube rises to basically be sucked can action, the suction of angle iron can be worth the 1/5 that is steel tube about.

从总体上说，撞深随着撞击力的增加而增加，防撞装置在反抗撞击时，钢管起到主要吸能的功能，角钢的吸能值约为钢管的1/5。

The influence of the size of pad and solder bump, the volume of eutectic solder and reflow temperature on the geometry of duplex SnPb solder joint with high Pb solder bump and eutectic SnPb fillet was simulated by finite element method with the software of SURFACE EVOLVER.

应用SurfaceEvolver软件，对含高铅焊料芯片凸点和共晶SnPb焊料形成的复合焊点的形态进行了有限元模拟，考察了焊盘大小、芯片凸点尺寸、焊料体积、焊接温度等焊点的设计及工艺参数对焊点形态的影响。

In this world, we can bump into very many good matters, but also can bump into very many misdemeanors, before today, they all passed.

在这个世界上，我们会碰到很多好事儿，也会碰到很多坏事而，今天以前，他们都过去了。

If direct apply mechanically, it is easy bump into a word to bump into a " with others ", 2 it is the method that can not allow you to master depict, when well-turned phrase of " good word this " is not beside you when, you still are not written give good sentence.

假如直接套用，一是轻易和别人"撞词撞句"，二是并不能让你把握描写的方法，当"好词佳句本"不在你身边的时候，你还是写不出好句子。

When the accident, tan Zhuo Youna is gone to north, go on zebra crossing, ought rely on the racing bike of boreal westing, sail at full speed unexpectedly the yellow solid line in pass by, standing by the highroad on the zebra crossing south, bump flew Tan Zhuo, make its fly 45 meters tall, throw the place that falls in 20 meters of above, passerby thinks even bump into a bumper that those who fly is a car only.

事发时，谭卓由南往北，走在斑马线上，本该靠北西行的跑车，竟飞速驶过路中的黄实线，在靠近大路南边的斑马线上，撞飞了谭卓，使其飞起四五米高，并摔落在20米开外的地方，有路人甚至以为撞飞的只是汽车的一根保险杠。

More direct, directer ; most direct, directest

径直的，笔直的

Do you know how to use a chain saw?

你知道如何使用链锯吗？