查询词典 bonging

Through proper surface treatment, the metal can direct bonging with rubber in the course of heating and pressurizing vulcanization sometimes, however, to certain extent it has limitation.

经过适当表面处理的金属，有时即可直接与橡胶在加热加压的硫化过程中实现粘合，但是，这有一定的局限性。

The results show the hydrogen bonding is formed between acetone and water molecules and the strength of hydrogen bonging is related to the concentration of acetone.

由此说明丙酮与水分子间形成了氢键，而且氢键的强弱与丙酮水溶液的浓度有关。

XPS analysis indicates that there are strong chemical bonging interactions between the silver and the polymer groups.However,silver present on the surface mainly exists as native metal in the form of face-centered-cubiccrystal.

1 3 5XPS表明银与聚合物之间有很强烈的化学成键作用，但是其主要以面心立方晶型的单质银的形式存在于薄膜表面。

The influences of the technological parameters of vacuum diffusion bonding of logging ceramic probe(Al2O3 ceramic to 45 steel) such as temperature,pressure and time on the shear strength of the bonging seam were studied by the orthogonal optimization test .

利用正交优化试验方法，研究了测井探头Al2O3陶瓷电极座与45钢基体真空扩散焊温度、压力和时间等工艺参数对焊缝抗剪强度的影响，并总结出相应的关系式，然后分析了温度、压力和时间等工艺参数对焊缝抗剪强度的独立影响和交互影响。

We mainly discussed the bonging configurations and element of the SiOx/a-C:F/SiOx multiple-layered films, and the difference from one-layered films before and after annealing.

本文重点分析了SiO_x／a-C：F／SiO_x多层膜的结构与成分，并与单层的a-C：F薄膜比较了退火前后结构与介电性质的不同。

Reliability and security are critical for acrylic,pure acrylic and chlorobutyl latex modified mortars applied in actual bonding civil engineering.In order to solve these problems,varied bonding curing systems were adopted and a case that simulated the actual bonging project was implemented.

针对丙烯酸、纯丙和氯丁3种聚合物乳液砂浆在实际工程中粘结应用的可靠性和粘结性差的问题，研究了各种粘结养护制度下的粘结性能和本体抗压抗折强度，同时通过拟工程应用的室外实验来评估粘结可靠性。

Bonging mechanism of coating/matrix and interface bonging of WC-Co/NiCrBSi were studied. Wear mechanism of the composite brazing coating at different wear conditions were proposed.

研究了涂层中WC-Co／NiCrBSi界面、涂层／基体界面连接机制并提出不同磨损条件下复合钎焊涂层表面磨损规律。

On the base of it, a novel design of MCE chip system is presented.2. Due to the inert to most chemicals, fused silica is chosen as the substrate and fabricated the chip using photolithography, wet etching and bonging technique. The inner side of micro-channel is smooth and straight.

根据微通道电泳芯片原理以及相应的应用要求设计芯片，采用微机械加工技术，选择优质石英为芯片材料制作芯片，并对制作工艺参数进行了优化，完成的芯片微通道内壁光滑，边界平整，完全满足实验要求；对微通道内壁进行修饰处理，有效地减少了内壁对样品的吸附，同时大大降低了电渗流的影响； 3。

It indicated that the multiple-layered films were mainly composed by C-F, C=C and Si-O bonging, a little Si-C and Si-F bonding were also existed because of history effect. The bondgap were calculated as 2.7eV. The dielectric constant of the multiple-layered films was close relative to the thickness of the covering layer-SiOx, so the thickness had better be reduce. The bonding configurations of multiple-layered films had no evident changes after 400癈 annealing, the thickness raise very little and the dielectric constant increase 8%. Compared with one-layered a-C:F films prepared in the same conditions, the SiOx/a-C:F/SiOx multiple-layered films had a better thermal stability.

结果表明，多层膜主要由C-F，C=C，Si-O键构成，由于器壁的历史效应，薄膜中还存在少量Si-C和Si-F键；多层膜的光学带隙经计算约为2.7eV；多层膜的介电常数与包层SiO_x厚度有很大关系，应尽可能减小SiO_x厚度；在经历200-400℃的N_2氛围中退火后，多层膜的红外结构没有发生太大的变化：膜厚度稍微增大，介电常数只增加了8％，与同样制备条件下沉积的单层a-C：F薄膜相比具有较好的热稳定性。

In the United States, chronic alcoholism and hepatitis C are the most common ones.

在美国，慢性酒精中毒，肝炎是最常见的。

If you have any questions, you can contact me anytime.

如果有任何问题，你可以随时联系我。