查询词典 bondings

Higher substrate temperature can lead to decrease of bond angle disorder of C bonds; It can also promote the outdiffusion of the implanted C atoms and the formation of C-C bondings.

较高的基片温度可以导致C键键角无序化程度的降低；也可以促进注入的C原子向表面的扩散及C-C键的形成。

We have observed gaseous diatomic molecule on the semiconductor surface with the chemical-physics dynamic mechanism of the chemical adsorption on the dangling bond. We explored on the phenomena in how gas molecules dissolve, how the atoms move, and on how they replace the bondings during the chemical adsorption process on the surface.

本论文主要在研究气态双原子分子化学吸附於半导体表面悬键上的化学物里动力学机制，并探讨气体分子在表面化学吸附过程中的分子裂解、原子移动、取代键结等现象。

Hydrogen bondings can dissociate with the increase of the temperature.

这些氢键将会显著地影响弹性体的形态和性能。

The results show that the films are characterized by the amorphous microstructure and mainly composed of Si C bondings, C C bondings as well as a small mount of oxide impurity consorted with Si; the content of the C C bondings decreased after annealing in vacuum, meanwhile the Si C bondings content increased, annealing in vacuum is beneficial to the formation of SiC; after annealing at 800 in air, a thin dense layer of SiO2 formed on the surface, which prevented the oxygen from contacting with the film and effectively protected the inner SiC from oxidizing.

结果表明，薄膜主要以非晶为主，由Si--C键， C--C键和少量Si的氧化物杂质组成；在真空条件下经高温退火后，薄膜C--C键的含量减少，而Si--C键的含量增加，真空退火有利于SiC的形成；在800℃空气中退火后，薄膜表面生成一层致密的SiO2薄层，阻止了氧气与薄膜内部深层的接触，有效保护了内部的SiC。

The C bondings are changeable with depth.

这些C键的数量和特征是随深度而变的。②。

The highest T_p in the cooling process is close to that in the heating process,indicating no additional hydrogen bondings.

特别是在降温过程中T_p与加热时的基本一致，表明聚集过程中没有形成附加氢键。

High resolution solution NMR is applied to study the hydrogen bondings in thepolyether polyurethane zwitterionomers and polyurea samples.

利用溶液高分辩核磁共振方法对离子化聚醚聚氨酯和聚脲样品中的氢键进行了研究。

At substrate temperature of 200℃, larger C〓 dose seems to induce more C-C bondings on both specimen surfaces and deep in the buried regions.

当基片温度为200℃时，较大的C〓剂量可以导致更多的C-C键。

The hydroxyl oxygen atoms O(5) and O(6) with O(3) and O(4) of adjacent unit form the intermolecular hydrogen bondings.

分子中的酚羟基氧原子 O(5 )和 O(6 )均与另一个不对称单位的羰基氧原子 O(3 )和 O(4)形成了分子间氢键，这表明分子在晶胞内堆积时，除了范德华力以外还靠氢键来维系。

The ligands donate the lone pair electrons to the central metal to form the covalent bondings, called coordination bondings.

配体提供原子对与金属原子形成的共价键称为配位键。

The absorption and distribution of chromium were studied in ryeusing nutrient culture technique and pot experiment.

采用不同浓度K2CrO4(0，0.4，0.8和1.2 mmol/L)的Hoagland营养液处理黑麦幼苗，测定铬在黑麦体内的亚细胞分布、铬化学形态及不同部位的积累。

By analyzing theory foundation of mathematical morphology in the digital image processing, researching morphology arithmetic of the binary Image, discussing two basic forms for the least structure element: dilation and erosion.

通过分析数学形态学在图像中的理论基础，研究二值图像的形态分析算法，探讨最小结构元素的两种基本形态：膨胀和腐蚀；分析了数学形态学复杂算法的基本原理，把数学形态学的部分并行处理理念引入到家实际应用中。