查询词典 blue chips

Main memory is contained on chips called RAM chips that use CMOS technology , Common RAM technologies are dynamic RAM and static RAM .

主存储器包含在被称为RAM的芯片当中，RAM芯片是使用CMOS技术制成的，常见的RAM技术是动态RAM 和静态RAM 。

The selection of fire retardant agent, performance analyzing of fire retardant and anti-static polyester chips, influence of polymerization temperature on polyester's tinct and viscosity, influence of adding time on polymerization process as well as chips drying and spinning process were further studied.

对阻燃剂的选择、阻燃－抗静电聚酯切片性能、聚合温度对聚酯色泽和黏度的影响、添加时机对聚合过程的影响及切片干燥和纺丝工艺进行了较深入的探讨。

The selection of fire retardant agent, performance analyzing of fire retardant and anti-static polyester chips, influence of polymerization temperature on polyester's tinct and viscosity, influence of adding time on polymerization process as well as chips drying and spinning process .

选用有机阻燃剂-无机抗静电剂路线，选择合适的聚合、纺丝和后加工工艺，成功地纺制出性能优良的阻燃-抗静电涤纶短纤维。

You may overdose on potato chips or tortilla chips once in a while, but would you consider yourself to be a food addict?

你可能过量或马铃薯片饼片偶尔，但是你认为你是食物痴？

AlTiN coating has inconspicuous anti-wear effect on carbide.(3) With the introduce of graphite chips bwteen the frictional surface, the effect of graphite chip on the sliding friction and wear behavior of frictional pair was studied. The results show that graphite chips can reduce the coefficient of friction and frictional temperature, and make the coefficient of friction decrease with the decrease of normal load and rise of sliding speed.

在硬质合金微铣刀高速铣削石墨的刀具磨损和破损研究方面，分析了石墨高速铣削过程中的摩擦学条件，揭示了涂层和非涂层硬质合金微铣刀高速铣削石墨的刀具磨损和破损形态及其机理，研究结果表明涂层早期剥落是涂层的早期破损形式，&抛光&磨粒磨损是涂层硬质合金微铣刀在稳定磨损期的主要磨损机理。

The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

该方法包括以下步骤：在硅衬底上形成可剥离树脂层；在所述可剥离树脂层上形成布线衬底；将半导体芯片安装在所述布线衬底上；通过用密封树脂密封所述多个半导体芯片来形成半导体器件；通过从密封树脂侧将这些半导体器件切分但是保留硅衬底来使这些半导体器件个体化；将每个个体化半导体器件在所述硅衬底和可剥离树脂层之间从硅衬底上剥离；并且通过形成穿过可剥离树脂层的孔或者通过除去可剥离树脂层来使布线衬底上的端子暴露。

Finally, the MLCC (Multi-Layer Ceramic Capacitor) chips after different duration of reoxidation process were utilized to analyze dielectric performance and oxidation of Ni inner electrodes. The results showed that the formation of NiO would result in the discontinuity of Ni electrode and further degrade the capacitance and IR of the chips.

最后，本研究将制作完成的多层电容元件，经过不同补氧时程的处理，结果显示镍电极的氧化，会造成电极的不连续情况，以及降低电容和绝缘电阻值。

By way of answer Huang noted,"We use an industry standard process, how we manufacture the chip is identical to a lot of companies and this particular bump underfill material has been used to manufacture billions and billions of chips, not billions of chips."

他使用如下的陈述作为回答。&我们使用工业标准的工艺，我们生产芯片的方式与很多公司毫无二致，而出问题的填充材料也用来生产了数百亿，而不仅仅是数十亿的芯片&

A method of arraying self-scanning light-emitting element array chips is provided, in which it is possible to remove defective chips completely.

提供一种可完全除去不良芯片的发光元件阵列芯片的布置方法。

We want to buy Snacks, Confectionaries, Potato Chips Snacks, Potato Chips Confectionaries

我们要采购点心，糖果点心，马铃薯薯条点心

Objective To investigate the relationship between ovum fertilization rate and sperm morphology, acrosome reaction in IVF and to explore the influence of parameters of sperm on fertilization rate.

目的 研究体外受精(in vitro fertilization，IVF)中精子形态、顶体反应与卵子受精率之间的关系，分析精子各参数在IVF受精率方面的参考意义。

A: I hear Mr. White wants to run for the Presidency!

我听说怀特先生要参加总统竞选！