查询词典 blue chip

This is a disign that it pass to test " train axle bush temperature ", understand train can whom and safe operation design control detection system under in one-chip computer , Thesis this is it rely mainly on one-chip computer to explain emphatically, LED lattice show chip and walk into electrical machinery central systems.

此设计通过对&火车轴瓦温度&的测试，了解火车是否能安全运行而设计的在单片机控制下的检测系统，本论文着重阐述了以单片机为主体， LED 动态显示芯片及 A/D 转换芯片的核心系统。

Predicting the up-curl chip breaking of three-dimensional groove inserts;2. The database of judging chip break is founded, which is based on the characteristic of chip breaking curve.

通过切削试验，获得了刀具主偏角、切削速度和工作材料牌号对切屑的极限进给量和极限背吃刀量的影响规律及其经验公式，并根据切屑折断曲线建立了判断切屑是否折断知识库和切屑折断预报系统。

The array chip takes a flexible transparent polyimide thin membrane as the base, the lower surface can form a cross comb-shaped array multimicroelectrode, the electrode group is composed of two comb-shaped microelectrode array electrodes which are mutually crossed but not contacted with the electrical structures not being connected, and the microchannel between the both internal electrodes of the electrode group serves as the service passage; the array chip is inversely buckled on the fusion pool, and the cross comb-shaped array multimicroelectrode on the array chip correspondes to the cell electric fusion pool and falls in the cell electric fusion pool.

阵列芯片以柔性透明聚酰亚胺薄膜为基底，下表面通过蚀刻形成交叉梳状阵列化微电极组，电极组由两个相互交叉、互不接触、电气结构上互不连接的梳状微电极阵列电极构成，电极组内部微电极之间的微通道为工作通道；阵列芯片倒扣于融合池上，其上的交叉梳状阵列化微电极组与细胞电融合池相对应，落于细胞电融合池中。

This invention relates to a circular small UHF antenna with high dielectric constant and its processing method, among which, the UHF antenna characterizes that 1,it is composed of a radiation plate, a feed point and a medium chip, 2, the radiation plate is closely adhered to the top surface of the medium chip, the bottom surface is the metal ground face, the chip and the radiation plate is rectangle or square, 3, the feed point is at the 1/3 place of the diagonal line of the rectangular or square radiation plate apart from the top point.

本发明涉及一种高介电常数圆极化小型超高频天线及其制作方法。UHF天线特征在于(1)所述的超高频天线是由辐射贴片、馈电点和介质基片组成；(2)辐射贴片紧贴在介质基片的上表面，介质基片的下表面为金属接地面；介质基片和辐射贴片呈矩形或正方形；(3)馈电点位于矩形或正方形的辐射贴片的对角线离顶点的1/3处。其制作方法是采用ε≥38高均匀性陶瓷基片，再结合丝网印刷技术完成厚膜焙银后形成辐射贴片，然后再圆极化。具有制作工艺成熟、体积小及使用灵活等特点。

Baseband signal can control by serial each that one-chip computer produce phase place , DDS of generator control and bring in realizing, and the phase locking ring of the integration can produce the signal carrier within AD9856 chip, its frequency is set up through the interface of the outside one-chip computer.

基带信号可以由单片机产生的串行码元控制DDS发生器的相位控制端来实现，而AD9856芯片内部集成的锁相环可以产生载波，其频率也是通过外部单片机的接口来设置。

If at this point the mouse on a control chip output identified as bright signal, B tube output for the secret signal, mouse and so on signal processing, and chip processing will cause the receiving component to receive tube B and mouse chip output voltage of light determine the minimal threshold dark changes.

若此时鼠标芯片对甲管输出识别为亮信号，乙管输出为暗信号，鼠标依此对信号进行处理，而芯片的处理必引起接收组件中甲乙接收管的输出电压及鼠标芯片对亮暗判别阀值的微小的变化。

Encapsulant was driven by capillary force into the space between the chip and substrate. Underfill technique can protect the electrical device and prevent the device from destroying because of external force. Underfill has many defects including the fill time is too long, the situation of short shot and air trap are caused easily, the yield of product of Flip-Chip is not highest and the products are universal. Therefore, there are many factors being studied in this paper to sum up the influence of underfill of Flip-Chip process cause by model parameters.

覆晶接合技术为先进电子讯号连接技术中的一种，具有高I/O数、电子讯号路径短以及尺寸小等优点，而采用覆晶接合之电子元件大部分均以底部充填技术进行封装；底部充填是一种以毛细作用为驱动力在晶片与基板之间的间隙充填底胶的封装技术，可以确保晶片不受到外力的影响而损及封装体，但此技术具有充填时间长、容易产生短射与包风等缺点，使得覆晶封装制程良率不高，间接影响覆晶封装产品的普及率，因此本文将依各种可能之参数模型对覆晶封装底部充填制程的影响，以供业界参考。

Anterior horn and then grinding, increasing chip capacity space (for the shape of chip capacity and processing characteristics, especially with a tool to compare the Japanese brands and found that much better than those of their cutting effect, the specific part in the second straight shank cutter for a brief introduction), to avoid an increase in milling tool when rapid accumulation of the phenomenon of chip.

然后修磨前角，增大容屑槽空间(针对容屑槽形状以及加工特性，特地与某日本品牌刀具作比较，发现远远优于其切削效果，具体在第二部分直柄立铣刀作简单介绍)，避免在加大走刀量快速铣削时出现切屑堆积现象。

The real2time target t rack processing system is designed which is const ruc2 ted by t he high performance DSP chip set TMS320C6416 as the core digital p rocessor , t he huge rep rogrammable logic chip set CPLD as t he system logic cont rol and the field reprogrammable array FPGA as t he image p reprocessing chip set to sampled video digital image.

为了解决算法复杂性及满足工程实时性，设计了以高性能的DSP 芯片TMS320C6416 为核心处理器，结合大规模可编程逻辑器件 CPLD 进行逻辑控制以及现场可编程门阵列FPGA 对采集的视频数字图像做预处理的实时目标识别跟踪处理平台。

The second experiment is to fabricate white light LED from red and green phosphors pumped by blue light LED. The blue light LED we used in our experiment has the wavelength range between 450 and 452.5 nm, and the chip size is 17 mil *14 mil. There are two kinds white light LED we fabricated in the experiment. There are three blue light LED chips bonded in single package of both kinds package. The different of the both packages is mixed phosphor of encapsulation. One of the experimental devices was encapsulated YAG phosphor mixed silicone to fabricate white light. The other is red and green phosphor mixed encapsulation. The compared and focused parameter was luminous efficiency. YAG phosphor pumped white light has the luminous efficiency 72 lm/W, CRI 70, CIE(0.32, 0.33), CCT 5622°K at the operating current 60mA. On another hand, red and green phosphor pumped white light LED has the luminous efficiency 55 lm/W, CRI 90, CIE(0.31, 0.32), CCT 6479°K at the operating current 60mA. We fabricated the red and green phosphor pumped white light LED, and proved that it could has much higher CRI under similar compared conditions, CIE xy and CCT.

第二个实验是使用蓝光LED晶粒来制作白光元件，蓝光LED晶粒波段范围在450 ~ 452.5 nm，晶粒大小为17*14 mil，以三颗蓝光LED晶粒搭配YAG萤光粉(黄绿光 540 nm)制成白光元件，再以另外三颗蓝光LED晶粒搭配红色萤光粉(613 nm)混合绿色萤光粉(519 nm)制成的白光元件进行发光效率比较；搭配YAG萤光粉的白光元件在注入60 mA的电流时所量测到最大的发光效率是在72 lm/W，演色性数值大约为70，CIE色度座标为(0.32， 0.33)，色温是在5622 °K；而搭配红色萤光粉混合绿色萤光粉的白光元件在注入60 mA的电流时，最大的发光效率在55 lm/W，演色性数值大约为90，CIE色度座标为(0.31， 0.32)，色温在6479 °K；证明了蓝光LED晶粒搭配红色萤光粉混合绿色萤光的白光元件演色性指数可以高达90 以上的结果。

Alternatively, the con- trollers can use the synchronous rectifier itself or loss- less inductor current-sensing methods to provide overload protection with lower power dissipation.

另外，康威特罗勒斯可以使用同步整流器本身或亏损减少电感电流检测方法，以提供低功耗过载保护。

Mr. Dauber's other Schatz hangs in his home movie studio.

多伯把沙兹的另一件作品挂在家里的电影室。