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assembly-line相关的网络例句

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与 assembly-line 相关的网络例句 [注:此内容来源于网络,仅供参考]

Main Products: Engine assembly of import and export of water pipes, automotive fuel tube assembly, automotive steering gear, steering ball, rod assembly, brake pipe joints, such as an automobile chassis parts and pieces of steel pipe.

主要产品:发动机进出口水管总成,汽车加油管总成,汽车转向器,转向球头,拉杆总成,制动管路接头等一列汽车底盘零部件以及钢管件。

The trade union committee of an enterprise owned by the whole people shall be the working body of the workers representative assembly and shall be responsible for the daily affairs of the representative assembly and for inspecting and supervising the implementation of resolutions of the representative assembly.

全民所有制企业的工会委员会是职工代表大会的工作机构,负责职工代表大会的日常工作,检查、督促职工代表大会决议的执行。

PROMESS NC assembly systems contain electronic press (also known as feeding, clothing cylinder, NC Press) torque and power module, designed to meet the "100% Precision assembly, 100% quality assurance" in the assembly At the same time to 100% of the quality inspection.

PROMESS的数控装配系统包含电子压机(又名饲服电缸、数控压机)和动力扭矩模块,其设计是为了满足在"100%精密装配,100%的质量保证"在装配的同时进行100%的质量检验。

Firstly, we briefly introduce the assembly model, analyze and evaluate the typical assembly model. Secondly, we propose a new-layered assembly model which is based on discrete face. At last, we briefly discuss how to use the DENEB system to abstract the information from the CAD model and how to add constrain information to the DENEB model.

首先,对装配模型进行了简要介绍,并对当前典型的装配模型及其特点进行了介绍和分析;其次,结合本文提出的装配规划算法提出了基于离散面片的层次化装配模型;最后,简要介绍了如何通过DENEB系统对CAD模型中的信息进行抽取以及如何添加约束信息。

And the Monte Carlo optimization approach is used to simulate the assembly accuracy. The accuracy based design method of robot assembly unit is studied and the configuration tolerance of valve peg-hole assembly unit is derived.

采用蒙特卡洛法进行了机器人装配的精度模拟,研究了基于精度的机器人装配单元的设计方法,并以气门轴孔装配单元为实例得到系统配置的公差要求。

The influence of different assembled condition such as assembly method, concentration of zirconium source and pH value on the effectiveness of assembly were evaluated via DSC-TG, FT-IR, Uv-vis and SAXRD et al. It showed that the assembly effectivness of uncalcined 3 Si/Zr_10# sample was best.c The optical characteristic, which including light-conduction in infrared band and polarity in visible band, of dip-coating film and membrane assembled zirconia after processing parameters of assembly optimized were observed via FT-IR and Uv-vis. The polarity was characterized by polarizing angle through calculation from light-transmittance, light-reflectance and fresnel coefficient. qualitative analysis showed that the polarity of Si/Zr_10 # dip-coating film assembled was best.d Adopting zirconium oxychloride as zirconium source, CTAB as template, employing different CTAB adding sequence, two mesoporous zirconia samples were prepared. The template effect of two samples was discussed. It showed that the effect of the sample which CTAB adding sequence was same as mesoporous silica film was better. The light-conduction in infrared band of these samples was also studied, which offered comparison to the polarity of zirconium dioxide assembled within mesopore.

结果显示:组装条件优化后的uncalcined 3 Si/Zr_10#厚膜样组装效果最好,其组装液对应的pH值最利于该锆源离子模板交换组装; c选用FT-IR、Uv-vis对组装条件优化后纳米氧化锆/介孔氧化硅厚膜、纳米氧化锆/介孔氧化硅薄膜包括红外导光性、可见光区内的偏光性在内的光学特性进行了分析,其中偏光性以膜层透光性、反光性及菲涅耳系数计算出的偏振角即布儒斯特角表征,定性分析显示,Si/Zr_10#ZrO_2/介孔氧化硅厚膜偏光性最好; d以氧氯化锆ZrOCl_2·8H_2O为锆源,CTAB为模板剂,采用不同的模板剂加入顺序,探索性地制备两介孔氧化锆样,分析了两介孔氧化锆样的模板效果,得出模板剂加入顺序同介孔氧化硅薄膜时介孔氧化锆样的模板效果较好,并分析了所得样品的导光性,为锆氧粒子引起的附加光学特性分析提供了参考和对比。

This dissertation presents a new theory and method of assembly unit partition based on the knowledge. Research of the key techniques of assembly unit partition includes the assembly knowledge acquisition and representation, the main assembly unit partition and the unassembled partition.

系统地提出了基于知识的航空产品装配单元划分的理论与方法,对装配工艺知识的获取、知识的表示、主体装配单元划分、未组合件划分等关键技术进行了深入的研究。

On the basis of the summarization of MCM-Cs main features and its assembly and packaging technologies, the paper puts stress on relatively deepgoing studies in practically advanced MCM-C assembly process technologies as gold ball wire bonding, IC chip gold ball stud bump making, IC flip chip bonding and underfilling, in high reliability MCM-C packaging process technologies as integral LTCC substrate packaging, hermetically metal sealing, and also in the basic technological process of MCM-C assembly and packaging. Later on, it presents the effectively engineering development of two high level actual module products--a high-density monolithic processor system MCM-C , a high-speed data collecting and processing system MCM-C. Lastly, it briefly introduces various common methods of quality inspection and reliability test of MCM-C assembly and packaging in engineering practice.

论文在综述MCM-C的主要特点及其组装封装技术的基础上,重点对金丝球引线键合、IC芯片金球凸点制作、IC芯片倒装焊与下填充等实用先进MCM-C组装工艺技术和LTCC基板与外壳及PGA引线的一体化封装、气密性金属封装等高可靠MCM-C封装工艺技术以及MCM-C组装封装基本工艺流程展开了较深入的研究,有效完成了高密度单片机系统MCM-C和高速数据采集控制系统MCM-C等两种高水平实际产品的工程化研制工作,扼要介绍了工程实践中MCM-C组装封装工艺常用的质量检验方法和可靠性试验方法。

The products include front and rear axle assembly, transmission assembly, brake assembly, track and saddle assembly and chassis and so on, altogether more than 1000 kinds of parts.

产品包括前后桥总成、变速箱总成、制动器总成、牵引鞍座总成和汽车底盘等各种零配件 1000 余种。

Our company main production: iron bridge shell assembly, welding bridge-shell and axle assembly, flywheel ring assembly, planet-assembly, automotive brake assemblies and reducer shell, shell, and so clutch Class chassis products, mainly for the FAW Group, the firewood, Green gas, special Liu, Zhu Jichang, such as supporting the Yellow Sea, in supporting the production capacity to more than 100,000 copies.

我公司主要生产:铸铁桥壳总成、冲焊桥壳及桥总成、飞轮齿环总成、行星架总成、汽车制动器总成及减速器外壳、离合器外壳等底盘类系列产品,主要为一汽集团、大柴、青汽、柳特、黄海等主机厂配套,年生产配套能力可超过10万辆份。

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