查询词典 alloy

Aluminous car is to use 6061 alloy profile and 5083 alloy plank or 6061 alloy plank to make.

铝车辆是用6061合金型材和5083合金板材或6061合金板材制造。

The primary phases of Al-10% Cu, Al-20% Cu Al-40% Cu alloy are nearly equiaxed spherical or rose spherical by semi-solid processing. Compared with the coarse arborization of Al-10% Cu, Al-20% Cu Al-40% Cu alloy of conventional casting, the structure of alloy is extremely improved and the appropriate grain size for the engineering application is obtained.

结果表明：利用半固态加工，可以使Al-10%Cu、Al-20%Cu、Al-40% Cu合金的初生相呈近等轴的球状或蔷薇球状，与普通铸造Al-10% Cu、Al-20% Cu、Al-40%Cu合金较粗大的树枝状相比，合金的组织得到显著的改善，达到了工程应用晶粒大小。

Furthermore, the metallic glass samples are prepared by vacuum injection method and the rationality of above-mentioned relationships and RBF models is directly verified. It is shown that there are extremum phenomena between the Rc andΔd ,Δe and v respectively. However, the positions of the extremum are different from different alloy systems and the extremum phenomena may be related to the optimum composition region and the optimum additive quantity. More elements in the alloy are in favor of the improvement of the GFA. And as for the high GFA alloy, the atomic percentage, atomic radius difference and atomic electronegativity difference are harmoniously matched.

d、Δe和v与临界冷却速度Rc的关系中都出现极值现象，对于不同的合金体系，极值出现的位置不同；金属玻璃的最优成分范围以及各种添加元素的最佳添加量行为，可能与此极值现象相关；合金中包含的组元数目多有利于提高其玻璃形成能力，玻璃形成能力强的合金，其各个组元的原子百分含量、组元原子半径差及其电负性差之间的搭配是很和谐的；融合建模的合金系之间包含的主要组元数量和种类越相近，所建立的模型的可靠程度越高，其预测结果与实测结果越吻合。

The results show: the strongest bond is the Al-Al bond in the segregated cell without containing vacancy, where the Al atomic covalence radius is greater than that of Li atom in the cell; while the strongest bond is the Al-Li bond in the segregated cell containing vacancy, and the Al atomic covalence radius in the cell is less than that of Li atom. Since the difference of electronagativity between the Al and Li atoms is obvious, it is inclined to formed the Al-Li segregated cell of short range order structure in the condition of vacancy present. The short range order structure containing vacancy is probably the embryo or precursor structure of the metastable phase δ′(Al3Li). Because the strongest covalent bond in the Al-Li-vacancy segregated cell in alloy formed in quenching is the main strength reason for supersaturated solid solution of alloy. The bond net of succeeding precipitation of δ′(Al3Li) has the picture of anisotropic Al-Al bonding and the bond intensity enhanced. Since the δ′(Al3Li) is coherence with matrix, the bond net strength is enhanced by the precipitation of δ′(Al3Li) and so strengthen the alloy.

计算结果表明：不包含空位的偏聚晶胞的键络最强键为Al—Al键，其中Al原子的共价半径较Li原子的共价半径要大；而含空位的偏聚晶胞的最强键为Al—Li键， Al原子的共价半径要比Li原子的共价半径要小；在空位存在的情况下，由于Al原子与Li原子的电负性相差明显，促使Al和Li原子结合，倾向形成Al-Li短程序结构偏聚区，这种含空位的短程序结构很可能就是δ′(Al3Li)亚稳相的前兆结构和生长胚胎；由于Al-Li-空位有序偏聚晶胞的Al—Li键络比基体键络要强许多，因此，淬火过程中合金生成的Al-Li-空位偏聚晶胞对合金过饱和固溶体起主要强化作用；后续析出的δ′(Al3Li)亚稳相键络各项异性显著，键络强度明显提高；由于Al3Li与基体共格，其大量均匀弥散析出起到提升基体整体键络强度，同样对合金产生强化作用。

The results show: the strongest bond is the Al-Al bond in the segregated cell without containing vacancy, where the Al atomic covalence radius is greater than that of Li atom in the cell; while the strongest bond is the Al-Li bond in the segregated cell containing vacancy, and the Al atomic covalence radius in the cell is less than that of Li atom. Since the difference of electronagativity between the Al and Li atoms is obvious, it is inclined to formed the Al-Li segregated cell of short range order structure in the condition of vacancy present. The short range order structure containing vacancy is probably the embryo or precursor structure of the metastable phase δ'(Al3Li). Because the strongest covalent bond in the Al-Li-vacancy segregated cell in alloy formed in quenching is the main strength reason for supersaturated solid solution of alloy. The bond net of succeeding precipitation of δ'(Al3Li) has the picture of anisotropic Al-Al bonding and the bond intensity enhanced. Since the δ'(Al3Li) is coherence with matrix, the bond net strength is enhanced by the precipitation of δ'(Al3Li) and so strengthen the alloy.

计算结果表明：不包含空位的偏聚晶胞的键络最强键为Al-Al键，其中Al原子的共价半径较Li原子的共价半径要大；而含空位的偏聚晶胞的最强键为Al-Li键，Al原子的共价半径要比Li原子的共价半径要小；在空位存在的情况下，由於Al原子与Li原子的电负性相差明显，促使Al和Li原子结合，倾向形成Al-Li短程序结构偏聚区，这种含空位的短程序结构很可能就是δ'(Al3Li)亚稳相的前兆结构和生长胚胎；由於Al-Li-空位有序偏聚晶胞的Al-Li键络比基体键络要强许多，因此，淬火过程中合金生成的Al-Li-空位偏聚晶胞对合金过饱和固溶体起主要强化作用；后续析出的δ'(Al3Li)亚稳相键络各项异性显著，键络强度明显提高；由於Al3Li与基体共格，其大量均匀弥散析出起到提升基体整体键络强度，同样对合金产生强化作用。

Sb can combine with Cu and P to form a low melting point compound which lowers the melting point of binary Cu-8P eutectic alloy by nearly 200℃. Bi and Cu can create compounds with low melting point(270℃) distributing at the boundaries and that is the reason why the melting point of (Cu-8P)-Bi is lower than that of binary Cu-8P eutectic alloy. The eutectic cluster can be refined with the addition of Fe, and that is the reason why the addition of Fe can decrease the melting point of Cu-8P alloy. Two means of decreasing the melting point of Cu-8P are found.

一定量的Sb与Cu， P形成低熔点相，从而大幅降低了Cu-8P合金的熔点，使其熔点降低近200℃；加入少量Bi后， Bi与Cu在共晶团晶界上形成熔点为270℃左右的低熔点化合物，且Bi的加入明显细化Cu-8P合金共晶团，从而使Cu-8P合金的熔点降低；加入Fe能明显细化Cu-8P合金的共晶团，使层片间距由8μm减为2μm以下，并使共晶团由层片状向短棒状转变，虽然Fe与Cu形成熔点为806℃的高温相，但Fe的细化作用使得Cu-8P合金的熔点降低，但降低幅度不大。

Using Mo powder,Fe-B alloy powder,and Fe powder as raw materials,and adding Cr,Ni and C alloy and agent polyvinyl butyral,Mo_2FeB_2 hard alloy was clad on a Q235 steel substrate to form a new type of cladding material with excellent wear and cor- rosion resistance property by means of vacuum liquid phase sintering technique.

以Mo粉、Fe-B合金粉、Fe粉为基本原料，掺加适量合金元素Cr，Ni，C，以及有机粘结剂聚乙烯醇缩丁醛，采用真空液相烧结法在Q235钢基体表面制备Mo_2FeB_2硬质合金覆层，获得了力学性能良好且耐磨抗蚀的新型硬质合金覆层材料。

The results show that the flow stress decreases with increasing deforming temperature and increases with increasing strain rate. The flow stress of the alloy during hot compression deformation can be described by constitutive equation in hyperbolic sine function with a hot deformation activation energy of 196.27 kJ/mol. Partial recystallization takes place in the alloys deformed at a high temperature or at a low strain rate, and large number of dislocations and subgrains are observed in the alloy. The elongated grains observed in the samples coarsen with increasing temperature and decreasing strain rate. Correspondingly, the subgrain size increases and the dislocation density decreases. The main soften mechanism of the alloy transforms from dynamic recovery to dynamic recrystallization.

结果表明：Al-Cu-Mg-Ag耐热铝合金在热压缩变形中的流变应力随着温度的升高而减小，随着应变速率的增大而增大；该合金的热压缩变形流变应力行为可用双曲正弦形式的本构方程来描述，其变形激活能为196.27kJ/mol；在变形温度较高或应变速率较低的合金中发生部分再结晶，并且在合金组织中存在大量的位错和亚晶；随着温度的升高和应变速率的降低，合金中拉长的晶粒发生粗化，亚晶尺寸增大，位错密度减小，合金的主要软化机制逐步由动态回复转变为动态再结晶。

In this study, copper alloy adding Ti-Zr and Al-Zr was the target and made the cupper alloy ingots by vacuum arc remelter. After rolling and heat treatment, the two-inch round target was cut by wire electrical discharge machining. DC sputtering deposited cupper alloy thin films on silicon base materials and optical glasses to discuss the thin film microstructures、compositions、practical performances and optical characteristics.

中文摘要本研究以自行设计之铜基合金靶材，在铜基材料中添加钛锆与铝锆等微量金属，以真空电弧熔炼制作铜合金方锭，经滚压加工及热处理后，以线切割机切成两吋之圆型靶材，再进行直流溅镀沉积铜合金薄膜於矽基板和光学玻璃基板上，探讨不同成分比例下之薄膜显微结构、成分组织、实用性能与光学特性。

Alloy membrane is used to separating hydrogen isotope,but after operating tritium,decay product 3He resorts in alloy membrane,forms helium bubble s and affects the macroscopical properties of alloy membrane.

PdY8.5Ru0.19合金是用于氢同位素分离的膜材料，但涉氚操作后，衰变3He会滞留在合金膜中并形成氦泡，影响其宏观性能。

More direct, directer ; most direct, directest

径直的，笔直的

Do you know how to use a chain saw?

你知道如何使用链锯吗？