查询词典 SI

In this paper,based on comprehensive information,combined with that bauxite is commouly characterized by diaspore,higher Al and Si,lower Fe, the Series-combination with Ore Mixing technology is put forward as the alumina production process.

本文在综合资料的基础上，结合我国铝土矿多为一水型硬铝石，具有高铝、高硅、低铁的特点，提出配矿串联法生产氧化铝工艺。

Facing this mean procedure, will future be angry the diastrophism body is extremely Ottmann, the challenge vacation dream compared to superior Si.

面对这种卑鄙的做法，未来非常生气地变身为奥特曼，挑战假梦比优斯。

In contrast to N and Si, no major difference in cell growth rate and metal uptake was found for diatom cells maintained at different P concentrations Fig.

与此相反，以氮，硅，没有发生重大差异，细胞生长率和金属的吸收被发现的硅藻细胞保持在不同P浓度（图2）。

The separation of Al and Si in the clean production process for potassium dichromate was studied.

摘 要：研究铬盐清洁生产工艺中铝硅的脱除。

A Fourier transform infrared spectrophotometer, a solid state Si-NMR, a scanning electron microscope, an X-ray diffractometer, a thermogravimetric analyzer and a differential calorimeter were used to measure the structural and thermal properties of the WPU/silica hybrids.

研究中使用粒径分析仪、黏度仪与界面电位分析仪分析复合物乳液特性，利用傅立叶转换红外线光谱仪、固态核磁共振光谱仪、表面扫描电子显微镜、X-ray绕射光谱、热重量分析仪、示差扫描热卡计探讨混成复合物的结构、热性质与结晶情形，同时也利用万能拉力机、动态机械热分析仪探讨混成复合物的机械性质。

Based on theσs1/8 -T curve and X-ray diffraction analysis, the changes in volume fraction,saturation magnetization and Curie temperature of α-Fe phase and residual amorphous phase with annealing temperatures as well as the correlation between them were determined.

研究了Fe(72.7)Cu1Nb2V(1.8)Si(13.5)B9非晶合金在不同温度（763—883K）退火1h后的热磁曲线借助于碰分析的方法，由σs1/B－T曲线并通过X射线衍射分析确定了合金中α－Fe相和剩余非晶相的体积分数、饱和磁化强度及Curie温度随退火温度Ta的变化及其相互关系。

Using SEM, TEM and X-ray diffractometer, the microstructures in the laser alloy zone were investigated.

摘 要：利用5kW CO2 激光器，对Al-Si合金表面的等离子涂层进行熔覆处理。

NOS VAMOS A CHINA EN EL JULIO, SI NO QUIERES EL DINERO AHORA, TE ARREPENTIRAS.

我们7月份要回中国了，你现在不要钱，你必定会后悔。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

Direct Correspondence of Display Data RAM to LCD Pixel Display Data RAM2,500 bits LCD Drivers25-common and 100-segment Selectable Duty and Bias Ratio ; 1/25 Duty 1/6 Bias or 1/15 Duty 1/5 Bias Direct connection to 8-bit Microprocessor interface for both of 68 and 80 type MPU Serial Interface (SI, SCL, A0, CS) Useful instruction set Display ON/OFF, Display Start Line Set, Page Address Set, Column Address Set, Status Read, Write Display Data, Read Display Data, Normal or Inverse ON/OFF Set, Static Drive ON/Normal Display, EVR Register Set, Read Modify Write, End, Reset, Internal Power Supply ON/OFF, Driver Output ON/OFF, Power Save and ADC select.

直接显示数据RAM的对应像素液晶显示数据RAM2，500位液晶Drivers25，共同和100段可选择的职务和偏差率； 1 / 25的责任1 / 6的偏见或1 / 15的责任1 / 5偏见的直接连接至8位微处理器的接口为68和80型微控制器的串行接口（司，沙田至中环线时，A0，CS）的相关指令集显示开/关，显示开始行设置，页面地址设置，列地址设置，状态读取，写入显示数据，读取数据显示，正常或逆开/关设置，静态驱动器/正常显示，腔内注册设置，读取修改写入，完，复位，内部电源开/关，开/关，节能和ADC选择驱动器输出。

Breath, muscle contraction of the buttocks; arch body, as far as possible to hold his head, right leg straight towards the ceiling (peg-leg knee in order to avoid muscle tension).

呼气，收缩臀部肌肉；拱起身体，尽量抬起头来，右腿伸直朝向天花板（膝微屈，以避免肌肉紧张）。

The cost of moving grain food products was unchanged from May, but year over year are up 8%.

粮食产品的运输费用与5月份相比没有变化，但却比去年同期高8％。