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CMOS chip相关的网络例句

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与 CMOS chip 相关的网络例句 [注:此内容来源于网络,仅供参考]

A novel layout of IC transformer is proposed to achieve both high turn ratio and coupling coefficient in this paper. In order to discuss the coupling coefficient, the layouts are designed with different turn ratio. The thesis is mainly includes of three experiment topics. The multi-stack structure is proposed to achieve prior goal in first topic. Two groups of proposed devices are designed to maintain identical self- inductances in transformer's primary and secondary coils. Total six devices are fabricated in foundry 90-nm CMOS technology. Using the 9 and 5 metal layers in primary and secondary coils in a specific layout, measurement results show that the transformer has the largest benefit using the bottommost return layer in layout design. In one word, the adoption of more metal layers to construct different turn ratio transformer shows not only improving the N value but also saving the chip area in this experiment.

中文摘要本文是针对不同圈数比变压器探讨其耦合量的变化,并且期望其变压器能同时达到高圈数比及高耦合系数的特性,本论文主要可分为三个实验主题,首先第一个主题提出以90nm CMOS制程技术实现的多层金属层的布局方式,并以相同的一、二次侧自感值分为两组,利用不同返回层来达到不同的圈数比,且从量测结果可以得知,在变压器布局设计上使用最底金属层来作返回层会得到较好的特性,最后从此实验得知一结论,利用合适的多层金属架构达到不同的圈数比,不仅可以改善圈数比,还可以缩小晶片面积。

After shaping, in order to count, the abtained singal will access to the external interrupt of SCM, and will be deposited in the chip AT24C02 of serial CMOS E2PROM which is supported by transmission protocol of I2C bus and brownout protection. In order to facilitate future show, the measured data will be deposited into history.

获得的信号经整形后接入单片机的外部中断进行计数,并且将计数值存入支持I2C总线数据传送协议的串行CMOS E2PROM芯片AT24C02中进行存储和掉电保护,测得的数据均被存入历史记录,以方便日后查看。

Come so, toshiba can be finished in this group interior make chip from factory of big division of labor, make the coherent production of camera module to electron of cliff hand Toshiba, enhance the competition ability of career of CMOS image sensor thereby.

如许一来,东芝在本集团内部就能够实现从大分工厂制造芯片,到岩手东芝电子制造相机模块的连贯出产,从而增强CMOS图像传感器事业的竞争力。

This paper presents a novel solution for application in natural light illumination based on standard CMOS technology, which can elide the extraocular illuminating devices for image enhancement. A 16×16 prototype chip was fabricated in standard 0.6 μm CMOS technology.

本文提出了一种应用于自然光照条件下的CMOS工艺的人工视网膜修复方案,省去了目前此类方案中使图像增强的眼外照明设备,在0.6 μm标准CMOS工艺下制造了16×16阵列及测试单元的样片。

Based on CMOS technology and using Composer and Spectre tools of Cadence EDA, a type of single-chip controller is designed for the fly-back switching power supply of AC/DC. It works at 70KHz with current mode pulse width modulation; and the max duty is 75 percent.

本论文基于高压CMOS工艺,用Cadence EDA中的Composer包及Spectre仿真工具,设计了一种反激式AC/DC开关电源控制芯片。

Designed a CMOS chip for the communications subsystem of the 6095 Graphics Terminal.

为 6095 图形终端的通讯子系统设计了一个 CMOS 芯片。

However, the CMOS image sensors can provide stronger anti-radiation capacity than CCD as well as Single Chip Integrating with image sensors array, drive and control circuit, signal processing circuit, A/D conversion circuit and Completely Digital Interface Circuit. The CMOS image sensors also possess high quantum efficiency, wide spectral response, good response uniformity, low supply voltage and low request of clock. At the same time, the small bulk, high reliability, low power consumption and low cost are the prominent advantages of the CMOS image sensors too, thus CMOS image sensor has more exploiture foreground in X-ray real-time radioscopy imaging system.

由于CMOS 图像传感器比CCD 具有更强的抗辐射能力,还具有将图像传感器阵列、驱动和控制电路、信号处理电路、模数转换电路、全数字接口电路等实现单片集成以及量子效率高、光谱响应宽、响应均匀性好、工作电压低、对时钟脉冲要求低、体积小、重量轻、功耗低、高可靠、低成本等优点,因此在X 射线实时检测中更具有开发前景。

A phase-lock circuit composed of special phase-lock CMOS chip CD4046 and frequency dividing chip CD4040 is designed,with a simple extemal integral loop f

用CMOS专用数字锁相芯片CD4046(内部集成有鉴相器和压控振荡器)和分频芯片CD4040构成了实际锁相电路。

In light of the fact that there are occasionally tramcar accidents in incline transport in mining, a CMOS chip-based digital detection and intelligent anti-skid system is developed.

针对采矿斜巷运输中偶尔发生矿车跑车事故的实际问题,研制出了一种基于CMOS芯片的数字检测、智能防跑系统。

The laser diode and the chip of the laser diode driver and the 4∶1 multiplexer,which are realized in different materials and processes,are fabricated on one same ceramic substrate using a film circuit to make up one opto-electronic integrated circuit,i.e.,an OEIC.The chip and the diode are realized with a 0.35μm CMOS process and with wet etching,polymer planar, and lift-off technologies, respectively.The module is encapsulated with a wing shell.

该发射机采用薄膜电路和激光焊接耦合技术将高速集成电路和光电子器件进行混合集成,其中高速集成电路是采用0.35μm硅CMOS工艺实现的单片4∶1复接器加激光驱动器芯片,光电子器件是采用湿法腐蚀、聚合物平坦和lift-off等技术实现的激光器芯片,最终混合集成模块采用蝶形管壳进行封装,体积小、性能优良。

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