非封装的

基本解释 (translations)

unpackaged

与非封装的相关的网络例句 [注：此内容来源于网络，仅供参考]

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

GUILDER MODEL BUILDER— During the 1930s Mr. Walter C. Guilder, of Wilmington, Vermont, an engineer, former toolmaker and model-boat enthusiast designed his plain-turning (non-screwcutting)"Guilder Model Builder " miniature lathe of 3" swing and 5" between centers to be as useful as possible for the home hobbyist who required several power tools in one tiny package.

荷兰盾模型的建设者-在20世纪30年代Walter先生长荷兰盾，威明顿，佛蒙特州，工程师，前模具和模型船爱好者设计的，他平原-转折（非screwcutting ）"荷兰盾模型Builder的"微型车床3 "回旋和5 "之间的中心一样有用可能为首页爱好者谁需要几个电动工具在一个微小的封装。

To provide effective and efficient solutions to the scheduling problems in discrete job shop with multiple cells each having flexible process routings, this dissertation presents a Holon-based autonomic and coordinated intelligent scheduling technique, which is integrated with reinforcement-learning-based contract net protocol and modified filtered-beam-search algorithms, based on the recent researches in Agent or Holon-based decentrated production scheduling. The proposed intelligent scheduling technique is studied based on the key techniques of Agent or Holon-based autonomic and coordinated scheduling, i.e., encapsulation of entities, the control architectures, coordinated mechanism and core autonomic algorithms.

本论文在充分吸收近十余年间基于Agent或Holon的非集中式生产调度最新研究成果基础上，以具有生产加工柔性的、多单元、离散作业型制造车间为研究对象，围绕基于Holon的协商与自治调度关键技术(实体封装、控制体系结构、协商机制和核心算法)展开研究，提出了基于Holon概念模型的、集成强化学习机制的合同网协议和改进过滤定向搜索算法的自治与协商智能调度技术，以提供实用有效的求解方法、改善柔性制造车间适应内部动态环境和外部市场快速变化的能力。

An encapsulated Shoc Pad in the heal and a durable non-marking rubber sole make the Psyclone Leather as supportive as it is comfortable, while the Microban?

封装卫生垫在医治和持久的非橡胶唯一的标识使Psyclone皮革作为支持，因为它是舒适，而盾？

C Supports both Firmware Hub and LPC Memory Read and Write Cycles Auto-detection of FWH and LPC Memory Cycles C Can Be Used as FWH for Intel 8xx, E7xxx, and E8xxx Series Chipsets C Can Be Used as LPC Flash for Non-Intel Chipsets Flexible, Optimized Sectoring for BIOS Applications C 16-Kbyte Top Boot Sector, Two 8-Kbyte Sectors, One 32-Kbyte Sector, Three 64-Kbyte Sectors C Or Memory Array Can Be Divided Into Four Uniform 64-Kbyte Sectors for Erasing Two Configurable Interfaces C FWH/LPC Interface for In-System Operation C Address/Address Multiplexed Interface for Programming during Manufacturing FWH/LPC Interface C Operates with the 33 MHz PCI Bus Clock C 5-signal Communication Interface Supporting Byte Reads and Writes C Two Hardware Write Protect Pins: TBL for Top Boot Sector and WP for All Other Sectors C Five General-purpose Input Pins for System Design Flexibility C Identification Pins for Multiple Device Selection C Sector Locking Registers for Individual Sector Read and Write Protection A/A Mux Interface C 11-pin Multiplexed Address and 8-pin Data Interface C Facilitates Fast In-System or Out-of-System Programming Single Voltage Operation C 3.0V to 3.6V Supply Voltage for Read and Write Operations Industry-Standard Package Options C 32-lead PLCC C 40-lead TSOP

0第0页，本页显示记录0-0，共0条记录分0页显示C支持两种固件中心和LPC内存读取和写入周期自动的FWH和LPC的记忆圈C检测可以用于英特尔8xx系列，E7xxx，E8xxx系列芯片组和C可以用作FWH与至于非英特尔芯片组的BIOS应用柔性优化扇区开放16字节热门引导扇区，两个8 - Kbyte的，一个32字节部门，3个64 - Kbyte的C或存储阵列，线性预测编码闪光可分为四个统一为两个可配置的接口擦除的FWH / LPC接口为64 - Kbyte的行业，系统运行C地址/地址多路复用在制造过程中用于编程接口的FWH /线性预测编码界面C与33 MHz的PCI总线时钟 5信号通信接口进行操作，支持字节读取和写入引导扇区的顶部和WP C两硬件写保护引脚：任务型为所有其他部门 5个通用输入的系统设计的灵活性识别的多种设备选型部门登记销锁定为个别部门读取和写保护的A /阿复用界面C 11引脚复用引脚地址和8引脚的数据界面C促进快速系统内或外的系统编程的单电压3.0V至3.6V的操作供应的读取和写入操作业界标准的封装选项电压 32 -引脚PLCC 40引脚的TSOP

The SIPEX is packaged in Apex's PSOP1 non-hermetic surface mountable dual in line package.

该Sipex的打包在Apex的PSOP1非密封表面贴装双列直插封装。

That means that if you want to make a nonprimitive object on the heap to represent that primitive type, you use the associated wrapper.

这意味着假如想让堆内一个非主要对象表示那个主类型，就要使用对应的封装器。

That if you want to make a nonprimitive object on the heap to represent that primitive type, you use the associated wrapper.

内'。''一个非主要对象表示那个主类型，就要使用对应的封装器。

With a few simple and unintrusive provisions this powerful machinery can be extended to also work for wrapped C++ objects.

只需加入一些简单的、非侵入的处理，就可以扩展这个威力巨大的系统，使它也能用于封装的C++对象。

与非封装的相关的网络解释 [注：此内容来源于网络，仅供参考]

associate：关联

802.11规定,"关联"(associate)和"非关联"(dissociate)消息同以太网端口的"连接"和"未连接"相等价. 从而能够对何时进行身份验证加以控制. IEEE 802.1X 定义了一种封装计划,以在LAN环境中实现EAP数据包在申请者(Supplicant)和认证者(Authenticator)之间的传输.

finalization：终止化

任何封装了非托管资源的类型,例如文件、网络链接、套接字、互斥体等,都必须支持一种称作终止化(Finalization)的操作. 终止化操作允许一种资源在它所占用的内存被回收之前首先执行一些清理工作.

surface roughness：表面粗度

位上的阻隔物、对两电极端部的上下表面施以研磨及表面粗度(surface roughness)加工、将扁平条状金属基板冲切成数个块状金属电阻、所有块状金属电阻的非电镀部位上施以"封装"包覆以及对封装后块状金属电阻上的两个电极端部表面施以镀锡滚镀,

stencil printing：镂空版印刷

该生产线可以整合多个领域的样本设备,这些领域包括材料处理和传送、镂空版印刷(stencil printing)、元件贴装、选择性焊锡、回流焊接、X射线检测、机器人点对点焊接、再加工、非平面化、封装、激光打标和微控制器编程等.

unpacked cargo：无包装的货物,非包装货

unpackaged chip 未封装芯片 | unpacked cargo 无包装的货物,非包装货 | unpacked decimal 非压缩十进制,分离十进制表示,三行区十进数

unefficient：无效的

unedible 非食用的;不可食用的 | unefficient 无效的 | unencapsulated 未密封的;未用塑料封装的