- 更多网络例句与相互扩散相关的网络例句 [注：此内容来源于网络，仅供参考]
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The mutual diffusion coeffcients between diluent and nonsolvents were calculated and discussed relating to membrane formation.
膜结构的不同和稀释剂与冷却介质之间的相互扩散速度、冷却介质的传热系数有关。
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The analysis results show that the mother band and solidified layer are bonded through the transition layer formed by element diffusion.
经分析得知母带与凝固层的界面结合是靠元素相互扩散形成过渡区实现的。
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In both sides of the bonded interface, the interdiffusion of components was evident.
结合界面两侧元素相互扩散的趋势明显。
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Experimental results demonstrate that Ti-Cu-Ti interlayer has good reaction ability with ceramics as well as accelerate element interdiffusion.
试验结果表明，Ti-Cu-Ti中间层与陶瓷具有良好的反应能力，促进元素的相互扩散。
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After heat treatment at 1100C in air, the elements of the substrate and the bond coat diffuse and the diffusion of Ni is an uphill diffusion. The layer of r " phase and the layer of A12O3 or NiAl2O4 were formed at the interface of the substrate and the bond coat and at the interface of the bond/top coat, respectively. The thickness of the r " phase and the oxide layer increases with the increase of the time of the heat treatment.
经1100℃热处理，基体和底层中元素发生了相互扩散，并在界面析出γ'相，γ'的存在使界面的结合为冶金结合；在底层／面层界面由于底层被氧化和Al与ZrO_2氧化还原反应形成Al_2O_3等氧化物，Y'和氧化物的厚度随热处理时间延长而增加。
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Flow of fluid, including liquid and mixture gas of vapor and air, is presented with Darcys law. Capillary transportation of liquid and diffusive transportation of vapor and air are considered in heat and mass transfer in porous media during drying.
液体和气体在多孔介质中的流动遵循达西定律，同时考虑了液体传输时的毛细效应和蒸汽与空气分子的相互扩散效应。
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The invention relates to a method for preventing a top metal layer of packaging chips from fracturing under high temperature, which avoids the fracture of the top metal layer caused by the inter-diffusion of a gold ball, an aluminum welding pad and a top layer metal by introducing a lower metal layer to the joint between the top layer wire and the aluminum welding pad and driving a metal plug to the joint between the top metal layer and the lower metal layer and a metal plug to the joint between the lower metal layer and the aluminum welding pad.
一种防止封装芯片上的顶层金属层在高温下断裂的方法，通过在顶层金属线和铝焊垫之间连接处引入下层金属层，并在顶层金属层和下层金属层之间的连接处以及下层金属层和铝焊垫之间的连接处打金属插塞，避免了因金球、铝焊垫以及顶层金属相互扩散造成的顶层金属层断裂。
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The effects of electroplated Ni layer and electroless plated Ni-P layer on the diffusion behavior in Sn-Ag/Cu solder joint were studied. The results by EPMA analysis showed that the electroless plated Ni-P layer acted as a good diffusion barrier between Sn-Ag solder and Cu substrate. However, the electroplated Ni layer can not hinder the inter-diffusion and reaction between molten Sn-Ag solder and Cu substrate when reflowing, and there was a layer of IMC (Cu6Sn5) at interface of Sn-Ag/C u solder joint.
摘 要：研究了电镀Ni层和化学镀Ni-P合金层对Sn-Ag/Cu焊点扩散行为的影响，电子探针分析表明：化学镀Ni-P合金层能很好地阻止Sn-Ag/Cu焊点在焊接过程中的Cu，Sn互扩散和相互反应；而电镀Ni层则不能阻止Sn-Ag/Cu焊点在焊接过程中的Cu，Sn互扩散和相互反应，界面反应产物仍以Cu6Sn5为主。
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There are some questions such as forest fire model selection, forest fire model updating, verifying simulation accuracy and so on in traditional forest fire spreading system. Study purpose is to build an innovative forest fire spreading simulation system based on DDDAS in this paper. The system can increase precision of forest fire spreading simulation by model base, model selection, model updating and so on. It can provide a strategic decision for forest fire save and new technologies demonstration for other related field of research. The research encompasses several major topics:(1) This paper brings up the term of dynamic data driven forest fire spreading simulation system and supplies new research approach and thought for forest fire spreading simulation study. The system framework was brought.
本研究针对传统林火模拟过程中存在的模型手动选择难度大、模型修正数据获取效率低、模拟精度验证困难等问题，以DDDAS为林火蔓延模拟研究的技术范式，提出林火蔓延模拟全新的技术框架体系，解决模拟系统建设过程中的模型库建设与管理、模型适宜性选择、模型自适应修正、模拟过程实时验证等关键技术，建立林火扩散模拟和实际林火发展之间相互协作、共生的林火扩散动态模拟系统；提高林火蔓延模拟精度，将林火蔓延模拟真正应用到林火扑救指挥过程当中，在实践上为林火扑救指挥提供决策支持，在理论上为相关领域的空间扩散模拟研究提供新的思路和技术范式。
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As another important kind of fourth order equation, the Cahn-Hillaird equation was originally proposed by Cahn and Hilliard in 1958 as a model of spinodal decomposition for a binary mixtures.
最初是由Cahn 和 Hilliard于1958年在研究热力学中两相物质之间相互扩散现象时提出的。
- 更多网络解释与相互扩散相关的网络解释 [注：此内容来源于网络，仅供参考]
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coefficient of mutual diffusion：相互扩散系数
coefficient of linear extension线伸长系数 | coefficient of mutual diffusion相互扩散系数 | coefficient of pivoting friction枢轴摩擦系数
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interdiffusion：相互扩散
intercrystalline barrier 晶间势垒 | interdiffusion 相互扩散 | interelectrode 极间的
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interdiffusion：相互扩散=>相互拡散
interdiffuse 互扩散,互相扩散 | interdiffusion 相互扩散=>相互拡散 | interdiffustion coefficient 相互扩散系数
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interdiffusion coefficient：相互扩散系数
interdiffusion | 相互扩散,互扩散,相互弥散 | interdiffusion coefficient | 相互扩散系数 | interdiffusion process | 相互扩散过程
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interdiffusion process：相互扩散过程
interdiffusion coefficient | 相互扩散系数 | interdiffusion process | 相互扩散过程 | interdigital | 交叉指型
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interdigital：指状组合型的
interdiffusion 相互扩散 | interdigital 指状组合型的 | interdigitation 交错对插
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interdigital：指间的,指状组合型
interdiffustion coefficient 相互扩散系数 | interdigital 指间的,指状组合型 | interdigital circuit 交叉指形电路
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interdigital：指间的
interdiffusion 相互扩散 | interdigital 指间的 | interdigital 指状组合型
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interdigital emitter：叉指形发射极
interdiffusion 相互扩散 | interdigital emitter 叉指形发射极 | interdigitated structure 交叉指型结构
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interdiffuse：互扩散,互相扩散
interdiction fire 拦阻射击 | interdiffuse 互扩散,互相扩散 | interdiffusion 相互扩散=>相互拡散