- 更多网络例句与电解沉积相关的网络例句 [注：此内容来源于网络，仅供参考]
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Plasma electrolytic deposition is a new technology in surface engineering.
等离子体电解沉积是一门新兴的材料表面处理技术。
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A typical representative of such a polymetal layer printing master blank contains a steel plate whereon a copper layer (7 to 10 μ thick) and a chromium layer (2 to 3 μ thick) with mat aspect are electrolytically deposited, which chromium layer in its turn is coated with the photosensitive coating suited for preparing the resist.
1991年参加过多金属层印刷主空白的典型代表，包含了钢板地上一铜层（7至10μ厚）和铬层（2至3μ厚垫方面）的电解沉积，反过来的铬层涂有准备的抵制适合光敏涂料。
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TIN PLATTING FOR GENERAL USE OTHER THAN P.C. BOARDS- Tin platting and description Tin plate is a layer of electrodeposited tin on a metal surface.
锡为 P.C。之外的一般使用航空通讯平台董事会-锡绘制的地籍图和描述锡碟子在一个金属制的表面上是使电解沉积的锡层。
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The process is based on the electrolytic deposition at the cathode of LME Grade A purity copper from a purified sodium chloride-sodium bromide electrolyte.
我翻成：处理的过程基于LME评定的A级纯铜阴极的电解沉积——它从氯化钠，氯化溴的电解质中提纯而来。
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A good biocompatible Fe3O4-PDDA poly(diallyldimethylammonium chloride) membrane has been prepared by a novel cathodically electrolytic deposition method.
利用阴极电解沉积方法在玻碳电极表面制备了具有生物兼容性的Fe3O4-PDDA杂化膜。
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Fe3O4-PDDA film ; cathodically electrolytic deposition ; myoglobin ; direct electron transfer
Fe3O4-PDDA杂化膜；阴极电解沉积；肌红蛋白；直接电子传递
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The nucleation processes and the influence of experimental conditions on the current efficiency and surface morphology of aluminum electrodeposits were studied on Al electrodes from 2:1 molar ratio AlCl3/Et3NHCl ionic liquid.
测定了不同摩尔比的AlCl3/Et3NHCl离子液体在不同温度下的电导率，考察了离子液体AlCl3/Et3NHCl摩尔比为2/1中Al电极上铝沉积的晶核成核过程，以及恒电位电解沉积铝的工艺条件对电流效率和沉积铝表面形貌的影响。
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In the case of decorative zinc electroplatings, a further enhancement of the appearance of such substrates in addition to the corrosion resistance imparted is achieved by the passivate film which ranges from a clear bright to a light blue bright appearance simulating that of a chromium deposit or alternatively, a clear light-yellow appearance simulating that obtained by use of prior art hexavalent chromium solutions.
可选择的治疗方法，可进一步遏制卤化物包括氟离子、氯化物和溴化物离子进一步增加了硬度钝化膜以及一个或多个兼容为实现高效润湿剂接触基板对待。现在的发明特别地可适用但是不限制在碱而产生酸非氰化物的锌的治疗使电解沉积传授对被对待的基体改良的腐蚀抵抗和装饰的外表。
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The prevalent strengthening methods employed usually lead to a pronounced decrease in conductivity.
文章介绍了采用脉冲电解沉积技术制备出具有高密度孪晶片层结构的纯铜薄膜。
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A process for making an electronic device which comprises applying a nonaqueous plate-resistant ink by ink jet printing to selected areas of a dielectric substrate, optionally laminated with an electrically conductive metal, exposing the plate resistant ink to actinic and/or particle beam radiation to effect polymerisation, adding one or more metal layers by electrolytic or electroless deposition, the upper layer of which is an etchresistant metal, removing the polymerised plate-resistant ink with alkali and finally removing the electrically conductive metal which are optionally directly laminated to the dielectric substrate and not protected by an upper layer of etch-resistant metal by chemical etching wherein the plate-resistant ink is substantially solvent-free and comprises: A 30 to 90 parts acrylate functional monomers free from acid groups comprising mono- or higher functionality wherein 5 to 95% by weight are mono-functional monomers; B 1 to 30 parts acrylate functional monomer containing one or more acid groups; C 0 to 20 parts polymer or prepolymer; D 0 to 20 parts radical initiator; E 0 to 5 parts colorant; F 0 to 5 parts surfactant; and where the ink has a viscosity of not greater than 30 cPs at 40 DEG C and all parts are by weight.
一种制备电子装置的方法，所述方法包括以下步骤：通过喷墨印刷在任选层压了一种或多种导电金属的介电底材的选定区域涂覆非水的阻沉积油墨，将所述阻沉积油墨暴露在光化辐射和/或微粒束辐射中以完成聚合，通过电解沉积或无电沉积增加一层或多层金属层，其中最上层的金属层为一种或多种阻蚀刻金属，用碱除去聚合的阻沉积油墨，最后通过化学蚀刻将任选直接层压在所述介电底材上并且不被一种或多种阻蚀刻金属的上层保护的导电金属除去，其中所述阻沉积油墨基本不含溶剂，并且包含以下组分：A30-90份不含酸基团的丙烯酸酯功能性单体，所述单体包括单官能或多官能单体，其中5-95％重量为单官能单体；B1-30份包含一个或多个酸基团的丙烯酸酯功能性单体；C0-20份聚合物或预聚物；D0-20份自由基引发剂；E0-5份着色剂；和F0-5份表面活性剂；其中所述油墨的粘度在40℃下不高于30cPs，并且所有的份数以重量计。
- 更多网络解释与电解沉积相关的网络解释 [注：此内容来源于网络，仅供参考]
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Electroless Deposition：无电镀,化学镀 (台) 无电电镀,化学镀,非电解电镀
Electro - deposited Photoresist 电着光阻,电泳光阻 (台) 电沉积光致抗蚀剂 | Electroless Deposition 无电镀,化学镀 (台) 无电电镀,化学镀,非电解电镀 | Electro - phoresis 电泳动,电渗,电子构装 (台) 电泳
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Electrodeposition：电沉积
电沉积(electrodeposition)是金属或合金从其化合物水溶液、非水溶液或熔盐中电化学沉积的过程. 是金属电解冶炼、电解精炼、电镀、电铸过程的基础. 这些过程在一定的电解质和操作条件下进行,金属电沉积的难易程度以及沉积物的形态与沉积金属的性质有关,
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Electrodeposition：电解沉积
electrodeposited coating 电镀层 | electrodeposition 电解沉积 | electrodes circle diameter 电极圆直径
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electrodeposition analysis：电沉积分析
electrodeposition 电解沉积,电附着=>電着,電析 | electrodeposition analysis 电沉积分析 | electrodeposition method 電着法
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electroplating：电解沉积
electrophysiology 电气生理学 | electroplating 电解沉积 | electroplating 电镀
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electrolytic degreasing：电解脱脂
electrolytic corrosion 电解腐蚀 | electrolytic degreasing 电解脱脂 | electrolytic deposit 电解沉积物
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Electrodeposited coating：电镀层
electrodeposited alloy 电解沉积合金 | electrodeposited coating 电镀层 | electrodeposition 电解沉积
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electrodeposited alloy：电解沉积合金
electrodeposit 电镀层 | electrodeposited alloy 电解沉积合金 | electrodeposited coating 电镀层
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electrodeposited copper powder：电解铜粉,电(沉)积铜粉
electrodeposited coating || 电镀层,电解沉积层 | electrodeposited copper powder || 电解铜粉,电(沉)积铜粉 | electrodeposition || 电解沉积,电淀积,电解镀层,电镀
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electrodepositing：电解沉积
electrodepositednickel 电积镍 | electrodepositing 电解沉积 | electrodeposition 电镀