电沉积

基本解释 (translations)

electrodeposit  ·  electrodeposition  ·  electrodeposited  ·  electrodeposits

词组短语

electrolytic deposition

与电沉积相关的网络例句 [注：此内容来源于网络，仅供参考]

Crystal size of the iron based alloy foil is less than 10μm, while the crystal size of the nickel based alloy foil is about 2μm. Results show that the electrodeposited Fe-Ni foil has better magnetic properties than conventional milled Permalloy 1J79 foil.

实验表明：电沉积铁基合金箔晶粒小于10 μm，电沉积镍基合金箔晶粒大小在2 μm左右；电沉积Fe-Ni合金箔是一种性能良好的软磁材料，其基本磁性能优于传统熔铸-轧制坡莫合金1J79。

Through the analysis of the alloy electroplating solution in gradients, the process variables and their relationship between content of manganese in the alloy coating, the optimum process has been obtained, the additive to improve the cathode current efficiency was found; it was found that the deposits with a manganese content 40～60% exhibit excellent corrosion resistance; the corrosion resistance of zinc-manganese alloy coating will be even better after"phosphated"and passivated.

研究发现Na〓SeO〓能显著提高锌锰合金电沉积电流效率。首次用循环伏安法、恒电势电解法、恒电流阶跃法研究了Na〓SeO〓提高电流效率的作用机理。研究发现Na〓SeO〓在锌锰共沉积的条件下在阴极是分两步还原，即：首先在-0.9V处被还原为单质硒，然后在-1.25V处被还原为多硒阴离子。证明了多硒和多硒阴离子都在阴极存在特性吸附

The possibility for preparing nanocrystalline materials by jet-electrodeposition technique is also analyzed. Corresponding the research in the article, a set of unsubmerged single circular jets equipment was designed. In chapter 2, jet-electrodeposition was carried out both under direct current condition and pulse current condition. A series of samples for nanocrystalline nickel coating were prepared under different deposition parameters.

在第二章中，采用喷射电沉积技术分别使用直流和脉冲两种波形的电流进行电沉积，改变电沉积工艺参数制备了一系列的纳米晶镍镀层样品，使用X射线衍射、扫描电镜、透射电镜、维氏硬度计等仪器对镀层微观结构和性能进行了分析和表征，主要考察了在直流喷射电沉积和脉冲喷射电沉积方式下，沉积参数如电流密度、电镀液喷射速度等对镀层微观结构和显微硬度的影响。

Physical,chemical and mechanical characteristics of metal electrodepositing film depend on its structure and organization,which are influenced by many factors.

电沉积金属膜层的物理、化学性质以及力学性能与其组织结构密切相关，而沉积金属膜层的组织结构受诸多电沉积工艺条件的影响。

Now electrodeposited thermoelectric film arouses the interest of the researchers, not only for the fitting of micro-electronics, but also the guidance to the electrodepositing nanowire.

对于薄膜温差电材料电沉积的研究也引起了科学家的广泛兴趣，薄膜材料不仅适应了目前微电子系统的发展趋势，而且对电沉积纳米线的研究具有指导意义。

Electrochemical behaviors of Copper, Tin and Copper-Tin in electrodepositing Copper-Tin alloy from noncyanide bath have been studied using cyclic voltammetry.

运用循环伏安法，研究了无氰电沉积铜锡合金溶液中Cu、Sn的单独电沉积及其它们共电沉积的电化学行为。

The property of mechanical erosion for different refectories at room temperature has been studied through experiment.

在金属电沉积过程中，通过装置的电流随沉积时间的变化情况，从分形维数的角度对实验获得的金属铜、金属锌电沉积产物形貌与电解实验所使用的电解液浓度、外加电压以及实验温度等条件的相互关系进行了研究。

Process and mechanism of electrodeposited Zn-Fe-Si02 composite coatings were studied, including some contents as follow: Potential-pH plots of Zn-H2O and Fe-H2O systems were drawn, and the thermomechanical analysis was made. Results showed that the region of zinc and iron's codeposition was wide, which provided theoretic basis for electrodepositing Zn-Fe alloy. But the balance potential of zinc was greatly different from iron's, so in order to make zinc and iron codepositing, some complexant must be added into electroplating solution.

本文研究了电沉积Zn-Fe-SiO_2复合镀层的工艺和机理，主要包括以下几个方面：绘制了Zn-H-2O系和Pe-H_2O系的电位-pH图，并对其进行了热力学分析，结果表明，锌和铁发生共沉积的区域很大，这就对电沉积Zn-Fe合金的可能性提供了理论依据，但是锌和铁的平衡电位差别较大，所以，必须在镀液中添入一定量的配合剂才能使锌铁产生共沉积。

The results show that the grain sizes of nickel platings prepared under different electrodeposition time slightly fluctuate at 21 nm.

结果表明，不同电沉积时间下制得的镍镀层晶粒尺寸在21 nm小幅波动；随着电沉积时间的延长，纳米晶镍镀层的显微硬度存在先增大后缓慢降低的趋势，最大值为472 HV0.01，对应的电沉积时间为16 m in；纳米晶镍镀层的微观形貌为累积长大的胞状结构，电沉积时间为1~4 m in时，胞状结构表面密布着粒径为90 nm左右的二次纳米镍颗粒；本试验制得的纳米晶镍镀层失稳长大的起始温度为283.7℃，峰值温度为311.4℃。

A process for making an electronic device which comprises applying a nonaqueous plate-resistant ink by ink jet printing to selected areas of a dielectric substrate, optionally laminated with an electrically conductive metal, exposing the plate resistant ink to actinic and/or particle beam radiation to effect polymerisation, adding one or more metal layers by electrolytic or electroless deposition, the upper layer of which is an etchresistant metal, removing the polymerised plate-resistant ink with alkali and finally removing the electrically conductive metal which are optionally directly laminated to the dielectric substrate and not protected by an upper layer of etch-resistant metal by chemical etching wherein the plate-resistant ink is substantially solvent-free and comprises: A 30 to 90 parts acrylate functional monomers free from acid groups comprising mono- or higher functionality wherein 5 to 95% by weight are mono-functional monomers; B 1 to 30 parts acrylate functional monomer containing one or more acid groups; C 0 to 20 parts polymer or prepolymer; D 0 to 20 parts radical initiator; E 0 to 5 parts colorant; F 0 to 5 parts surfactant; and where the ink has a viscosity of not greater than 30 cPs at 40 DEG C and all parts are by weight.

一种制备电子装置的方法，所述方法包括以下步骤：通过喷墨印刷在任选层压了一种或多种导电金属的介电底材的选定区域涂覆非水的阻沉积油墨，将所述阻沉积油墨暴露在光化辐射和/或微粒束辐射中以完成聚合，通过电解沉积或无电沉积增加一层或多层金属层，其中最上层的金属层为一种或多种阻蚀刻金属，用碱除去聚合的阻沉积油墨，最后通过化学蚀刻将任选直接层压在所述介电底材上并且不被一种或多种阻蚀刻金属的上层保护的导电金属除去，其中所述阻沉积油墨基本不含溶剂，并且包含以下组分：A30-90份不含酸基团的丙烯酸酯功能性单体，所述单体包括单官能或多官能单体，其中5-95％重量为单官能单体；B1-30份包含一个或多个酸基团的丙烯酸酯功能性单体；C0-20份聚合物或预聚物；D0-20份自由基引发剂；E0-5份着色剂；和F0-5份表面活性剂；其中所述油墨的粘度在40℃下不高于30cPs，并且所有的份数以重量计。

与电沉积相关的网络解释 [注：此内容来源于网络，仅供参考]

Electroless Deposition：无电镀,化学镀 (台) 无电电镀,化学镀,非电解电镀

Electro - deposited Photoresist 电着光阻,电泳光阻 (台) 电沉积光致抗蚀剂 | Electroless Deposition 无电镀,化学镀 (台) 无电电镀,化学镀,非电解电镀 | Electro - phoresis 电泳动,电渗,电子构装 (台) 电泳

electrodeposit：电沉积

electrode 电极 | electrodeposit 电沉积 | electrodermal 皮电活动的

Jet electrodeposit：喷射电沉积

旋喷泵:Roto-Jet pump | 喷射电沉积:Jet electrodeposit | 数码喷墨:Ink-jet inks

Scan electrodeposit：扫描电沉积

平移扫描:translation scan | 扫描电沉积:Scan electrodeposit | 源代码扫描:Source Scan

Electrodeposition：电沉积

电沉积(electrodeposition)是金属或合金从其化合物水溶液、非水溶液或熔盐中电化学沉积的过程. 是金属电解冶炼、电解精炼、电镀、电铸过程的基础. 这些过程在一定的电解质和操作条件下进行,金属电沉积的难易程度以及沉积物的形态与沉积金属的性质有关,

metal electrodeposition：金属电沉积

冲击电流Striking current | 金属电沉积Metal electrodeposition | 金属喷镀Metal spraying

electrodeposition analysis：电沉积分析

electrodeposition 电解沉积,电附着=>電着,電析 | electrodeposition analysis 电沉积分析 | electrodeposition method 電着法

Pulse electrodeposition：脉冲电沉积

超短脉冲:ultrafast pulse | 脉冲电沉积:Pulse electrodeposition | 脉宽不准确:pulse imprecision

sedimentation potential：沉积电势

sedimentation pond 沉降池 | sedimentation potential 沉积电势 | sedimentation test 沉降试验

cermet electrodeposited coating：陶瓷金属电沉积涂层

CERL || Central Electricity Research Laboratories 中央电业研究实验室(CEGB) | cermet electrodeposited coating || 陶瓷金属电沉积涂层 | cermet mold || 金属陶瓷模