烧结收缩

词组短语

thermal shrinkage

与烧结收缩相关的网络例句 [注：此内容来源于网络，仅供参考]

In the study of microwave sintering of BaTiO〓 PTC ceramics, when the applied microwave power are above than a certain value, the abnormal axial shrinkage of the sintered sample will occur, by the analysis of SEM and XRD, it is found the microstructure and phase are different with conventionally sintered sample, the reason for this phenomenon is due to orientational grain growth by the action of electric field in the microwave sintering process.

微波烧结BaTiO〓电子陶瓷时，当所加的微波功率超过一定值时，首次发现烧结样品出现轴向异常收缩现象，采用SEM、XRD等分析发现其微观结构与常规烧结有巨大的差异，这是BaTiO〓材料的晶粒在微波场中受电场力作用而发生的取向生长造成的。

Shockproof additive is added order to restrict the shrinkage at high temperature and the formation of crazing.

加入防缩剂，防止衬体在高温下因烧结而产生收缩，导致龟裂的现象。

The results show that increasing the solids loading of slurry up to 45% allows minimizing deformation of green sheets during drying and sintering process effectively. When the content of monomers in shurry is 2%-4%, and the content of plasticizer in shurry is 3%-6%, green sheets with good strength and flexibility are obtained. The microstructures and the electric characteristics of PTCR chip thermistors were investigated. A five-layer chip PTCR thermistor with room resistance of 0.8Ω, temperature coefficient of resistance of 13.40%/℃, and ratio of maximum to minimum of resistance larger than 10^5 is successfully fabricated.

研究表明：浆料固相体积分数对坯体的乾燥及烧结行为有较大影响，当浆料固相体积分数在45%以上时，可有效避免制品乾燥和烧结过程中收缩过大而产生的变形开裂缺陷；当有机单体的质量分数为2%~4%，丙三醇的体积分数为3%~6%时，可获得有一定强度和柔韧性的生坯；研究了注凝成型PTCR陶瓷的微观结构及陶瓷元件的PTCR性能，成功地制备了层数为5、室温电阻为0.8Ω、电阻温度系数为13.40%/℃、升阻比大於10^5的多层片式PTCR元件。

The results show that increasing the solids loading of slurry up to 45% allows minimizing deformation of green sheets during drying and sintering process effectively. When the content of monomers in shurry is 2%-4%, and the content of plasticizer in shurry is 3%-6%, green sheets with good strength and flexibility are obtained. The microstructures and the electric characteristics of PTCR chip thermistors were investigated. A five-layer chip PTCR thermistor with room resistance of 0.8 Ω, temperature coefficient of resistance of 13.40%/℃, and ratio of maximum to minimum of resistance larger than 105 is successfully fabricated.

研究表明：浆料固相体积分数对坯体的干燥及烧结行为有较大影响，当浆料固相体积分数在45%以上时，可有效避免制品干燥和烧结过程中收缩过大而产生的变形开裂缺陷；当有机单体的质量分数为2％~4%，丙三醇的体积分数为3％~6%时，可获得有一定强度和柔韧性的生坯；研究了注凝成型PTCR陶瓷的微观结构及陶瓷元件的PTCR性能，成功地制备了层数为5、室温电阻为0.8 Ω、电阻温度系数为13.40%/℃、升阻比大于105的多层片式PTCR元件。

Decrease of the sintering and infiltrating temperature reduced the shrinkage but didn't compromise strength in this study.

降低烧结和渗透温度均可以减小收缩，而且在本实验条件下对强度影响不大。

The mean grain size of W phase in the hot pressed alloy from nanoscaled W-Cu powder is 0.5 μm at 1 200℃, and its relative density is 98%.

纳米W-Cu化学混合粉在H2热压烧结时最大收缩速率对应温度为930℃；1 200℃烧结合金的平均晶粒为0.5 μm，相对密度为98%。

In order to make these silver paste successfully used in commercial, a clear understanding is required for the complex relation between different parameters such as particles size, solid volume fraction, packing density on suspension printing and deformation and the mechanism of silver powder sintering shrinkage and the inorganic adhesive effect under the batch manufacture condition.The main emphasis of our researches was to improve the silver paste properties by developing a reliable, screen-printing paste suitable for fine lines and lower sintering porosity and good interface between thick film and glass substrate.

为开发电学性能稳定、高导电率、具有良好细线印刷性能及优良附着性的高性能电子浆料，本研究着眼于对影响参数进行详细剖析，找到关键控制参数，通过研究微观结构与粉末参数的对应关系，找到如何能制备出具有致密的厚膜结构与较低的孔隙率，并且其浆体与有机载体的界面区也要有明显的改善的电子浆体；同时对批量生产的银粉的形态与粉末烧结反应的收缩现象，无铅玻璃体系对银膜致密化等过程进行研究，获得致密高导的无铅银浆料。