溅
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Nickel chromium alloy was cheaper than nickel, and its sputtering aggradation velocity was more than that of nickel, so the immediacy costs of sputtering nickel chromium alloy electrode was less than that of sputtering nickel electrode.
镍铬合金价格低于镍金属，溅射沉积速率也比镍金属要快，所以溅射镍铬电极的直接成本低于溅射镍电极。
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Investigation was made of the sputtering rate in glow discharge lamp with re-lation to constituent of 25 different specimens of 6 binary systems, namely, Cr-Fe, Bi-Sb,Cu-Zn, Ag-Cu, Al-Zn and Cd-Sn, by measuring mass loss after each sputtering under con-stant Ar pressure and voltage applied. The correlation, in general, between sputtering rate andconcentration of constituent of these non-intermetallic binary alloys obeys the hyperbolic lawunder steady state, yet may be approximately regarded as linear only on certain special condi-tion if the two components of the alloys with similar sputtering rates.
在恒定气压和电压条件下，用测量溅射减量的方法，系统研究了Cr—Fe，Bi-Sb，Cu—Zn，Ag—Cu，Al-Zn和Cd—Sn六个系统的25个试样在辉光放电灯中溅射率与组分的关系结果表明；阴极溅射在稳态时，二元合金的溅射率与组元浓度的普遍关系是双曲线，只有在某些特殊情况下，两组元的溅射率相差不大时，可以近似看成线性关系。
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Testing results showed that in a sputtering cycle the sputtering time for Cu/Ga target has greatest effect on the final element distributi
实验中发现，在一个溅射周期中，Cu/Ga合金靶溅射时间对最后成分影响最大，其次是In靶溅射时间，非溅射时间的长短对成分也有影响。
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In chapter 2, we systematically introduced the theory and process of radio frequency magnetron sputtering and ion beam deposition sputtering.
第二章较为系统地介绍了溅射机理以及磁控溅射镀膜和离子束溅射镀膜机理和工艺特点，薄膜的沉积过程。
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Finally, we hold that there were a large number of ions in the sputtering space, which would be bounded by Lorentz force and gradient magnetic field force and their interactive forces, thus resulting in the generation of the spots and loops.
最终我们认为，在我们的溅射空间中，存在着大量溅射靶材的离子，溅射靶材的离子在溅射过程中会受到洛仑兹力作用、梯度磁场力的作用，以及他们的相互作用力；导致了斑环的产生。
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We are also distributor of the following companies:Pfeiffer Vacuum-turbo molecular pump, other types of pumps, gauges, Helium leak detector, mass spectrometer; Maxtek, Inc-Quartz crystal thin film deposition controller and sensors; Telemark Inc-E-beam source and power supply, optical thin film monitor; Comdel, Inc-DC and RF power supply; Angstrom Sciences-Magnetron target and materials; Oxford Scientific Limited-Atom sources; Plasma Quest Ltd-Plasma systems for coating and etching; Sentech Instruments GmbH-Ellipsometers.
我们代理的产品包括德国普发真空的全线真空产品(分子泵等各种真空泵，真空计，检漏仪，质谱仪，各种真空零部件)；美国美泰克公司的石英晶体膜厚监测仪，传感器；美国泰利玛科公司的电子枪和光学膜厚控制仪等；美国康戴尔公司的射频，中频和直流电源；英国牛津科学公司的微波等离子体源，电子束蒸发源，原子源，高能电子衍射枪；英国PQL公司等离子体溅射镀膜设备，美国安斯超科学公司的磁控溅射阴极及溅射靶材，德国森泰科仪器公司的椭偏膜厚测量仪和等离子刻蚀沉积设备等。
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Results showed that the kinetics of photocatalytic degradation of ethylene by TiO2/ACF desoposited Pt in the simulated cold storage environment for horticultural products could be described using the pseudo first-order equation. The prepared TiO2/ACF-Pt, in the process of which Pt was initially deposited on the surface of ACF and then TiO2 was coated, would promote the activity of ethylene decomposing. When ion sputtering time was 60 seconds (Pt/Ti atomic concentration ratio was 0.112), the apparent rate constant of the reaction of TiO2/ACF-Pt was 1.16 times as much as that of TiO2/ACF. The micrographic structure of ACF was not damaged and an excessive porous structure, which was contributive to absorbing the diluted ethylene, was obtained by the way of ion sputtering Pt.
结果表明：在模拟园艺产品冷藏环境中，TiO2 /ACF-Pt光催化降解乙烯的动力学可用表观一级速率方程来描述；ACF表面先溅射沉积Pt，再进行TiO2附着方案，能提高降解乙烯的能力，当溅射时间为60 s（Pt/Ti原子浓度比为0.112）时，表观一级速率常数是未溅射Pt的1.16倍；TiO2/ACF-Pt的制备方法，对ACF形貌结构没有破坏，并能得到有利于对微量乙烯的吸附的多孔结构。
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The invention uses the normal glass as the basal board , the studded target made of the indium metal mixing into molybdenum or tungstenic, and applies the responsive direct current magnetron sputtering technique under the condition of the basal board temperature equals room temperature, and also, under the appropriate state for the sputtering pressure, the oxygen partial pressure, the sputtering current, and the sputtering voltage to achieve the non-crystal structure In2O3:M film.
本发明以普通玻璃为基板，利用铟金属掺钼或钨的镶嵌靶，在基板温度为室温的条件下采用反应直流磁控溅射技术，在适当的溅射压强、氧分压、溅射电流和溅射电压的条件下制备获得具有非晶结构的In2O3：M薄膜。
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There are two vacuum plating methods. One is CVD. The other is PVD. PVD includes evaporation plating (arc, electronic gun and resistance wire) and sputtering plating (DC magnetron Mid-frequency and RF).
真空镀膜技术中经常使用的方法主要有：蒸发镀膜（包括电弧蒸发、电子枪蒸发、电阻丝蒸发等技术）、溅射镀膜（包括直流磁控溅射、中频磁控溅射、射频溅射等技术），这些方法统称物理气相沉积，简称为PVD。
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Although forest canopy layer could prevent splash erosion effectively, clay was taken away by overland flow and run off easily, the erosion amount became less after removing the forest canopy and surface soil, while the splash erosion still produced in the surface layer; the splash function weakened after having water current, the starting particles were less than bareland, so removing the surface disturbed soil made the erosion amount and clay less, silty sand more than bareland, but unsteady, the wear and tear energy used by raindrop splash and current function for overcoming sediments separating and starting were comparatively large, sediments were very difficult to be started and transported, it explained that forest root systems could increase anti-erosion capability of forest vegetation, make rainfall-current system splash and export finer particles than bareland.
虽然林冠层能有效防止溅蚀的发生，但坡面流还是能带走粘粒部分，粘粒还是容易流失。去除林冠和表层土后，侵蚀量变得更少，但表层还是会被溅蚀，有水流后，溅蚀作用减弱，颗粒起动的比裸地的少，所以，去除表层扰动土后，侵蚀量更少，粉沙多，粘粒比裸地更少一些，但不稳定，雨滴击溅和水流作用用于克服泥沙分离起动损耗的能量较大，很难被起动输移，这说明森林植被根系的作用增加了林地植被的抗蚀力，使降雨一水流系统仅能溅起输出比裸地坡面更细小的泥沙颗粒。
- 更多网络解释与溅相关的网络解释 [注：此内容来源于网络，仅供参考]
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bespatter：溅/溅污/诋毁
bespangle /以小亮片装饰/ | bespatter /溅/溅污/诋毁/ | bespeak /预约/订/显示/
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magnetron sputtering：磁控溅射沉积技术
中频磁控溅射:medium frequency magnetron sputtering | 磁控溅射沉积技术:magnetron sputtering | 直流磁控溅射:DC magnetron sputtering
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Magnetron spattering：磁控溅射
磁控溅射:Magnetron-sputter | 磁控溅射:Magnetron spattering | 磁控溅射:magnetron sputteringdeposition
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splasher：防溅板;折焰板;溅洒器
splashdown 溅落 | splasher 防溅板;折焰板;溅洒器 | splashguard 防溅罩
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spurting：溅散
spurious signal假信号 | spurting溅散 | sputter喷溅、溅射、溅蚀、喷镀、爆裂
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sputter etching：溅泼蚀刻
"sputtered coating","溅泼法护膜" | "sputter etching","溅泼蚀刻" | "sputter-iron pump","溅泼离子帮浦"
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sputter deposition：溅射淀积
sputter cleaning 溅射清洗 | sputter deposition 溅射淀积 | sputter etching 溅射蚀刻
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sputtering yield：溅射效率,溅镀率,溅镀系数,溅射率,溅射系数
sputtering target 溅射靶 | sputtering yield 溅射效率,溅镀率,溅镀系数,溅射率,溅射系数 | sputum examination for tubercle bacillus 痰结核菌检查
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sprayproof：防溅防溅的
sprayproof 防溅 | sprayproof 防溅防溅的 | sprayproof 防溅的
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splash back：防溅挡板
splash 溅 溅水 冲浪 泼 喷溅 | splash-back 防溅挡板 | splash-guardring 防溅环