混合集成电路

基本解释 (translations)

hic  ·  HIC

词组短语

hybrid integrated circuit · hybrid intergrated circuit

与混合集成电路相关的网络例句 [注：此内容来源于网络，仅供参考]

Timer is a kind of multipurpose numeral- imitate the hybrid integrated circuit, in addition to constituting single multivibrator, astable multivibrator, Schmitt trigger , can also connect many useful electric circuit, all got the application in the creation and varieties of a wave form, measure and control, home appliances, the electronics toy wait many realms.

555定时器是一种多用途的数字-模拟混合集成电路，除了可以组成单谐振荡器、多谐振荡器、施密特触发器以外，还可以接成许多种有用电路，在波形的产生与变化、测量与控制、家用电器、电子玩具等许多领域中都得到了应用。

Perform challenging IC mask design of advanced analog mixed signal and flash memory IC's; Develop layout floor plans to optimize die size and circuit performance; Plan and construct circuits, including critical signals and power bussing to analog layout guidelines; Perform DRC and LVS verification of layout

完成高级模拟混合信号以及闪存芯片的集成电路掩膜设计；进行芯片布局规划以优化芯片尺寸和电路功能；进行电路规划和构造，包括关键信号，电源走线以及模拟布局方针等；进行布局的DRC和LVS验证。

Compensate current sources are added to the tail current transistors of each dummy input differential pairs for lower gm variation.

低电压、高共模输入范围使电路适应不同的共模偏置，并满足模拟与数字混合集成电路的应用需要。

Major products of electron industry have bipolar digital IC, small exterior plastic sealing IC, single slice IC, integrated function module, thin and thick module composed IC, integration pressure sensor, semiconductor plastic down-lead frame, bipolar electrostatic induction transistor BSIT, power commutation diode SBD, microwave scanning frequency test system, ultrahigh frequency test system, waveguide coaxial system and satellite communications aerial etc.

电子行业主要产品有双极型数字集成电路、小外型塑封集成电路、单片集成电路、集成化功能模块、薄厚膜混合集成电路、集成压力传感器、半导体塑料引线框架、双极静电感应晶体管 BSIT 、功率肖特基整流二级管 SBD 、微波扫频测试系统、超高频测试系统、波导同轴系统、卫星通讯天线等。

The laser diode and the chip of the laser diode driver and the 4∶1 multiplexer,which are realized in different materials and processes,are fabricated on one same ceramic substrate using a film circuit to make up one opto-electronic integrated circuit,i.e.,an OEIC.The chip and the diode are realized with a 0.35μm CMOS process and with wet etching,polymer planar, and lift-off technologies, respectively.The module is encapsulated with a wing shell.

该发射机采用薄膜电路和激光焊接耦合技术将高速集成电路和光电子器件进行混合集成，其中高速集成电路是采用0.35μm硅CMOS工艺实现的单片4∶1复接器加激光驱动器芯片，光电子器件是采用湿法腐蚀、聚合物平坦和lift-off等技术实现的激光器芯片，最终混合集成模块采用蝶形管壳进行封装，体积小、性能优良。

With the developing of the Integrated Circuit technology and the minishing of the device size, the electronic system in future must be the application of the System-on-chip, which is also a mixed signal system.

随着集成电路工艺的持续发展和器件特征尺寸的持续减小，未来的电子系统将是系统级芯片的应用，即一个混合信号系统。

与混合集成电路相关的网络解释 [注：此内容来源于网络，仅供参考]

hybrid circuit board：混合集成电路板

hybrid chip 混合集成电路芯片 | hybrid circuit board 混合集成电路板 | hybrid component 混合集成电路元件

hybrid circuit board：混合集成电路

hybrid chip 混合集成电路芯片 | hybrid circuit board 混合集成电路 | hybrid component 混合集成电路元件

hic：混合集成电路

浙江省混合集成电路(HIC)行业产销分析二、浙江省混合集成电路(HIC)行业盈利能力分析三、浙江省混合集成电路(HIC)行业偿债能力分析四、浙江省混合集成电路(HIC)行业营运能力分析第三部分 混合集成电路(HIC)行业融资及竞争分析

HIC HybridIntegratedCircuit：混合集成电路

HIBCC HealthIndustryBusinessCommunicationsCouncil 保健业商务通信委员会 | HIC HybridIntegratedCircuit 混合集成电路 | HICS HierarchicalInformationControlSystem 分级信息控制系统

hybrid integrated circuit：混合集成电路

混合集成电路(Hybrid Integrated Circuit)是由半导体集成工艺与厚(薄)膜工艺结合而制成的集成电路. 混合集成电路是在基片上用成膜方法制作厚膜或薄膜元件及其互连线,并在同一基片上将分立的半导体芯片、单片集成电路或微型元件混合组装,再外加封装而成.

MIC：单片集成电路

微波功率IC等)低噪声IC(低频低噪声、微波低噪声IC)按器件结构划分双极-MOS兼容ICBiMOSBiCMOSMOS ICPMOSNMOSE/D MOSCMOS双极IC按工艺材料划分混合集成电路(HIC)薄膜IC厚膜IC薄、厚膜IC多芯片组件单片集成电路(MIC)GaAsIC硅IC

hybrid microcircuit：混合微型电路

hybrid microassembly 混合集成电路微组 | hybrid microcircuit 混合微型电路 | hybrid microelectronics 混合微电子学

hybrid microcircuit：混合微电路

hybrid integrated circuit 混合集成电路 | hybrid microcircuit 混合微电路 | hybrid network 混合网络

sic：半导体集成电路

文章摘要:简要介绍了厚膜混合集成电路(HIC)贯彻国军标用金属管不汽含量和盐雾试验3的现状,重点探讨了半导体集成电路(SIC)贯军标塑封的可靠性、塑封材料的吸水性、热膨胀系数和模化合物的组份等.

HICS HybridIntegratedCircuit：混合集成电路

HFI HybridFiberCoaxialNetwork 混合光纤同轴网络 | HICS HybridIntegratedCircuit 混合集成电路 | HIO HybridIntegratedNetwork 混合综合网络