- 更多网络例句与深蚀刻相关的网络例句 [注：此内容来源于网络，仅供参考]
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Depth of field The distande between the nearest and furthest points of the subject which are acceptably sharp.
1测深计，(2)字尺：(1)量度印刷版的蚀刻深度的测微尺。
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The transition pressure calculated by the model is much closer than that calculated by the existing model. A modified model of squeeze film air damping is developed for the design of high-aspect-ratio damping holes formed by deep RIE process.
本文还提出了开有高深宽比的阻尼孔的多孔板的压膜阻尼的修正模型，为采用深反应离子刻蚀技术制作的阻尼孔的设计提供了手段。
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Resistance pure water system, 3-waste treatment system, and shock-proof working-table, and about 80 sets of micro-electrical-mechanical technical equipment are installed, including AMS200 ICP plasma etching system, ICP-2B etching machine, AWB04 bonding machine, MA6/BA6 Karlsus double-face photolithography machine/bonding machine, POLI-400 chemical-mechanical-polishing tool, WL2040 aluminum-wire press welder, OPTI CAOT 22i decktop precision spin coasting system, ZSH406 automatic dicing saw system, DQ-500 plasma photoresist-removing machine, HXS150S automatic centrifugal spinner, AXTRON MOCVD metal organic chemical vapor deposit system, 4470 micro-control 4-tube diffusing furnace, type 4371 LPCVD low pressure chemical vapor deposit system, OMICRON MBE molecular beam epitaxy system, JS-3X100B magnet-control spattering equipment, PECVD-2E plasma deposit apparatus, ZZSX500C electron-beam vapor equipment, JC500-3/D magnet-control spattering-coating machine, H63-14/ZM quartz-tube cleaning machine. Measurement instruments include OLS1100 Confocal Laser Scanning Microscope, DEKTAKIII Surface Profiler, D41-11A/ZN 4-probe resistance test instrument, Nikon L150 metallurgical microscope, and so on.
中心现有80多台各种微机电工艺设备，如AMS 200深硅等离子体刻蚀系统、ICP-2B刻蚀机、AWB04键合机、MA6/BA6 Karlsuss双面光刻机和键合机、POLI-400化学机械抛光机、WL2040铝丝压焊机、OPTI CAOT 22i喷涂胶机系统、ZSH406全自动划片机、DQ-500等离子去胶机、全自动清洗甩干机、AXTRON MOCVD金属有机物化学气相沉积系统、4470微控四管扩散炉、4371LPCVD低压化学沉积系统、OMICRON分子束外延系统、JS-3X100B磁控溅射台、PECVD-2E等离子淀积台、ZZSX500C电子束蒸发台、JC500-3/D磁控溅射镀膜机、石英管清洗机，以及多种常用测试仪器，如OLS1100激光共聚焦显微镜、DEKTAK-III台阶测量仪、D41-11A/ZN四探针电阻测试仪、Nikon L150金相显微镜等。
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This paper introduced principle, process, characteristics and controlling deep slot of spiral groove movable ring of photoetching in the liquid hydrodynamic seal.
主要介绍了流体动力密封螺旋槽动环光刻工艺的特点、原理、工艺过程、工艺流程、槽深控制方法以及应用情况，提出了采用高能束流刻蚀螺旋槽动环的新途径。
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The invention discloses a method to integrate single CMOS with bulk silicon microelectromechanical system, its technical project: 1 forming isolating groove: adopting deep-groove etching, and SiO2 and polycrystal silicon filling to realize the insulation of MEMS structure and CMOS circuit; 2 making standard CMOS circuit; 3 using SiO2 and Si3N4 as mask, etching silicon on the back until exposing SiO2 at the bottom of the isolating groove, to complete the thickness control for MEMS silicon structure layer; 4 completing metalizing the CMOS circuit and masking the MEMS structure: MEMS structure region uses Al as mask and CMOS circuit region uses thick photoetching glue as mask, using DRIE to release silicon structure.
本发明公开了一种将单片CMOS与体硅微机械系统集成的方法，其技术方案为：1形成隔离槽：采用深槽刻蚀，SiO 2 和多晶硅填充，实现MEMS结构和CMOS电路的绝缘；2完成隔离槽后进行标准CMOS电路的加工；3用SiO 2 和Si 3 N 4 作掩膜，从背面腐蚀硅，直至暴露出隔离槽底部的SiO 2 ，完成MEMS硅结构层的厚度控制；4完成CMOS电路金属化和MEMS结构掩膜：MEMS结构区用铝作掩膜，CMOS电路区用厚光刻胶作掩膜，用DRIE释放硅结构。用本发明方法不仅获得了较大的质量块，而且用本发明较高的深宽比制作出的结构电容，同时实现了体硅微机械与CMOS电路的集成，显著提高MEMS传感器的精度和稳定性，具有前沿性和重要实用价值。
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A potassium hydroxide etch process can produce deep high aspect ratio trenches in (110) oriented silicon substrates.
一种氢氧化钾蚀刻工艺，能在(110)定向硅衬底上产生深度大的深宽比的沟槽。
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Specialized processes the stainless steel etching and each kind of combination craft, this company uses the craft for the most perfect photosensitive etching craft, this company etching's product is different in the market condition the common silk India plate, produces stainless steel etching line smooth non-tooth India, the design is precise, is perfect, suits the width is 10mm-1500mm, the length is 4000mm, the etching depth is deepest may achieve 0.35mm.
专业加工不锈钢蚀刻及各种组合工艺，本公司所采用的工艺为最完美的感光蚀刻工艺，本公司蚀刻的产品不同于市面上一般的丝印板材，所生产的不锈钢蚀刻线条平滑无齿印，图案精确、完美，适合宽度为10mm-1500mm，长度为4000mm，蚀刻深度最深可达到0.35mm。
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Carving gravure of business card printing and membership card making production and offset business card printing and membership card making, and so on are very different, first of all the manuscripts submitted to approx 10 times, the perimeter line by hand is decisived on top of a piece of zinc tablet with a smaller machine to get an outside line back into the original large carved in a piece about an inch of eight brass, and copper strip it is some anticorrosive toppedwith films, because of copper strip is triggered from the perimeter line, so the rough body by hand for the film, when removed, and then use the medicine to the erosion of deep water, and proto-end knife with a magnifying glass and, thetolerant to the edge, sharp corners repaired, such as location on a layer of chrome, it's a printing plate.
雕刻凹版的制卡和会员卡制作制作与柯式制卡和会员卡制作等有很大的分别，首先把来稿放大约十倍，把外围线用手工刻划在一块锌片之上，再用一部缩细机械把外线缩回原大刻在一块约八份一寸的铜片上，而这件铜片上是涂有一些防腐蚀薄膜的，因为铜片只是勾上字的外围线，所以要用手工将粗身地上的薄膜刮去，然后用药水将印纹蚀深，最后仍要用放大镜及雕刻刀，耐性地将线边、尖角等位置修好，再镀上一层铬，这印版便大功告成。
- 更多网络解释与深蚀刻相关的网络解释 [注：此内容来源于网络，仅供参考]
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diameter：孔径
均需要透过黄光显影与蚀刻步骤形成Via,目前则以深反应离子蚀刻(Deep Reactive Ion Etching;DRIE)技术为主,Via孔径(Diameter)多在20μm以下,受限目前技术孔径 ...3-3 后制程步骤与结果 依据MEMS元件在CMOS标准制程中制作的先后顺 序分类,
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thurible：(天主教)香炉
Goblet: 高脚杯、无柄酒杯 | Thurible: (天主教)香炉 | Etch: 蚀刻蚀镂,深印、鲜明描述
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ectypography：一种线条蚀刻不深的版画技术
echocardiography n. [医]心回波描记术,超声波心动描记术 | ectypography 一种线条蚀刻不深的版画技术 | electrocardiography n. 心电图学(心电图描记术)
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hypsographic curve：陆高海深曲线
陆地刻蚀 land sculpture | 陆高海深曲线 hypsographic curve | 陆龟 Testudo