晶片

基本解释 (translations)

wafer  ·  subindividual  ·  wafered  ·  wafers

词组短语

crystal plate

与晶片相关的网络例句 [注：此内容来源于网络，仅供参考]

Hongyexing electronics CO., Ltd. primary responsible for selling the production of Taiwan Yukai science and technology incorporated company and Shenzhen CSG Technology holding CO., Ltd. Major at Chinese Mainland and Southeast Asia market. Productions including: lamination chip bead, flakiness aerial, filter, common mode choke coil etc.

宏业兴电子有限公司主要负责台湾钰铠科技股份有限公司及深圳南玻电子有限公司生产之产品的中国大陆及东南亚市场的销售，包括：叠层晶片磁珠、大电流叠层晶片磁珠、叠层晶片电感、叠层高频晶片电感、片状天线，滤波器、共模扼流圈等产品。

Our company relates to optics wafer treating right away starting from the 80's, In the field of wafer treating have accumulated large amount of the special field experience developing、giving birth to a child and managing. Grasp the various optics wafer Flat surface、Spherical surface、Cylindrical surface complete set processing technology.

本公司自八十年代初就开始涉及光学晶片加工，在晶片加工方面积累了大量开发、生产及管理的专业经验，掌握各种光学晶片平面、球面、柱面的全套加工技术。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

The reactor includes a reaction chamber sized and shaped for receiving the semiconductor wafer and a susceptor having an outer edge and a generally planar wafer receiving surface positioned in the reaction chamber for supporting the semiconductor wafer.

该反应器包括一个反应室，其大小和形状可用来接纳半导体晶片；和一个衬托器，它有一个外边和一个位在反应室内一般为平面的晶片接纳表面可用来支承半导体晶片。

Often called planar transistors, they are built on the surface of a silicon wafer by using a manufacturing process that precisely deposits and then etches away different insulating, conducting and semiconducting materials with such precision that the industry is now approaching the ability to place individual molecules.

当今制造微处理器和记忆晶片的电晶体有数抳鹜荂C通常被称为「平面电晶体」，运用一个将电晶体精确放置在晶片的表面，蚀刻掉不同绝缘、导体和半导体材料的制程，以此精密技术业界将能够在晶片上面放置个别分子大小的材料。

With the requirement of JiYuan Irish diamond factory, the automatic sorting machine of quartz crystal wafer is studied on by using the international advanced technique of full automatic sorting machine of quartz crystal wafer, which is based on the semi-automatic sorting machine of quartz crystal wafer.

本项目应济源市水晶厂的要求，在原有半自动石英晶片分选机的基础上，借鉴国外全自动石英晶片分选机的先进技术对石英晶片自动分选机进行了研制。

PLZT bimorph deflexed to the maxima under irradiation when there was no mechanical load, whereas bimorph did not do work; part of the incident energy was wasted, and the other converted into electrical and mechanical energy and stored in the bi- morph driver.

从材料力学角度推导出双晶片执行器在紫外光照射下产生的最大偏移量和最大驱动力，无机械负载时双晶片在光照下产生最大变形，此时双晶片执行器不对外做功，入射光能一部分损失掉，其余转化成电能和机械能，并存储在双晶片执行器中。

A study is presented concerning the three different structural levels of isotactic polypropylene.

本文应用光学显微镜，扫描和透射电子显微镜从三种不同层次的结构水平上研究了α和β两种晶型的全同立构聚丙烯的球晶和晶片形态结构，特别是应用四氧化钌染色技术直接观察到两种不同晶型聚丙烯球晶中单独分离的晶片形态。

The aim of this research is to study the technology of photoelectric component, the high reliability process of 8 inch infrared ray absorption type of filter, and its market analysis. Filter is the key component of various optical systems. In general, color filter is fabricated by coating method. This study presents the novel method for filter fabrication by high temperature sintering of Si, B, Al2O3, and other materials. Compared with conventional filter, the absorption type of filter have more stable spectrum because of its properties of invisible light absorption.

中文摘要本研究是针对光电介面元件技术，高可靠度八吋红外线吸收式滤光片制程研究及其市场价值分析，光学滤光片为许多光学系统以及影像撷取系统不可缺少之重要元件，一般常见光学滤光片都是以镀膜方式，本实验针对矽、硼、三氧化二铝等材料以高温烧结方式制造光学滤光晶片，以材料特性吸收不可见光之光波，来得到所需光学滤光片之光谱特性，此吸收式光学滤光晶片之光谱稳定性高。

Encapsulant was driven by capillary force into the space between the chip and substrate. Underfill technique can protect the electrical device and prevent the device from destroying because of external force. Underfill has many defects including the fill time is too long, the situation of short shot and air trap are caused easily, the yield of product of Flip-Chip is not highest and the products are universal. Therefore, there are many factors being studied in this paper to sum up the influence of underfill of Flip-Chip process cause by model parameters.

覆晶接合技术为先进电子讯号连接技术中的一种，具有高I/O数、电子讯号路径短以及尺寸小等优点，而采用覆晶接合之电子元件大部分均以底部充填技术进行封装；底部充填是一种以毛细作用为驱动力在晶片与基板之间的间隙充填底胶的封装技术，可以确保晶片不受到外力的影响而损及封装体，但此技术具有充填时间长、容易产生短射与包风等缺点，使得覆晶封装制程良率不高，间接影响覆晶封装产品的普及率，因此本文将依各种可能之参数模型对覆晶封装底部充填制程的影响，以供业界参考。

与晶片相关的网络解释 [注：此内容来源于网络，仅供参考]

biochip：生物晶片

INFOPET是制造此类晶片的多家公司之一,它使用一种注射枪将所谓的[生物晶片](biochip)注入宠物的皮肤下面. 这种晶片可用扫描器读出其资料,并根据其上面不同的号码,可做成电脑档案储存. 这套系统甚至可以被人造卫星或大哥大(行动电话)的电波发射台追踪,

Chip Interconnection：晶片互连

Chip晶片(粒). | Chip Interconnection晶片互连. | Chip on Board晶片粘著板.

Microchip：微 晶 片

IBM表示,将与欧盟国的企业、学校合作研发新技术,侦测微晶片(microchip)瑕疵,以改善晶片的可靠度与效能,预计将能加快晶片生产、降低生产成本.

chip mounter：晶片安裝器

chip layout 晶片佈局 | chip mounter 晶片安裝器 | chip rate 碼片速率,晶片速度

chip on board：基板晶片焊接技术

chip burn-in 晶片老化测试 | chip on board 基板晶片焊接技术/ | COB chip on glass 玻璃基板晶片焊接术/

wafer prober：晶片检测仪、晶片探针

wafer printing 晶片光刻 | wafer prober 晶片检测仪、晶片探针 | wafer processing equipment 薄片加工装置

die sorter：裸片分類器,電路晶片分類器

die separation 裸片分離,印模分離 | die sorter 裸片分類器,電路晶片分類器 | die stacking 裸片疊層,晶片疊積

WAF wafer：晶片

wafer probing 晶圆测试,晶圆探测 | WAF wafer 晶片 | wafer 基片,晶片;开关片

transputer：晶片机

铁路信令系统用的采用晶片机(transputer)的安全节点中文题名: 铁路信令系统用的采用晶片机(transputer)的安全节点文摘: 介绍了铁路信令系统中用的采用晶片机(transputer)的新的安全节点,它可提供铁路信令系统所需的容错与安全反应.

seed plate：籽晶片,种晶片

seed crystal 籽晶,晶种 | seed plate 籽晶片,种晶片 | seed 种子,籽