- 更多网络例句与微空洞相关的网络例句 [注：此内容来源于网络，仅供参考]
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In this dissertation, i has used inverse microemulsions technique to synthesize nano-magnetic particles . This method made nanometer sized cages formed by dissolving surfactant molecules in an apolar organic solvent. The chemical reactions were carried out inside the cages to synthesize nanoparticles. Because the growth of the naoparticles are limited in the cages, the particles were nanometer sized particles.
论文中本人以逆微乳化法去合成磁性奈米粒子，这个方式主要是利用在非极性有机溶液当中使溶解的界面活性剂构成一个奈米级的空洞，控制化学反应在空洞中反应合成粒子，也因为粒子生成受到空洞的限制，以致生成的粒子为奈米粒子。
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The micro mechanism considers that the inclusion in material, called micro defect crack, is the nucleus of internal crack initiation, interaction, between the stress field of the micro defect crack tip as loading and strain field of crystal lattice caused by crystal point passim (as vacancies or interstitial atom, H, O, N et al), will trap the point passim, and cause the enrichment of point passim around the micro defect crack.
其中疲劳裂纹内部萌生的核心是材料中的第二相粒子、夹杂物或微空洞，称为微裂纹；而微裂纹的长大是材料中间歇原子或空位等点缺陷在微裂纹尖端富集沉淀的过程，微裂纹的长大速率受到点缺陷富集扩散速率和疲劳载荷的双重影响。
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The effect of hydrogen on the change from ductile to brittle is to prevent nanocracks in DFZs from blunting into voids.
即氢使奥氏体不锈钢由韧变脆的根本原因是氢抑制了DFZ中纳米级微裂纹向空洞的转化。
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The relationship of FPDs and magic denuded zone in CZ silicon wafers was discussed after pre-RTA in different atmosphere.
硅中空洞型微缺陷和金属杂质的存在对硅材料的性能和器件的成品率都有重要影响。
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During SCC of type 310 austenitic stainless steel in MgCl〓 solution at 115℃, corrosion process can enhance dislocation emission, multiplication and motion. Stress corrosion microcrack nucleates in the dislocation free zone or at the tip of the crack when the corrosion-enhanced dislocation emission and motion develop to the critical condition.
本文所得主要结论如下： 1.310不锈钢在沸腾MgCl〓溶液中SCC时，腐蚀过程能促进位错的发射、增殖和运动，当其达到临界条件时，SCC微裂纹就会在无位错区中不连续形核或从原裂纹顶端连续形核；由于介质的作用，纳米级微裂纹并不钝化成空洞和缺口，而是解理扩展。
- 更多网络解释与微空洞相关的网络解释 [注：此内容来源于网络，仅供参考]
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dimple fracture：韧窝断口
韧窝断口(dimple fracture) 韧窝是金属塑性断裂的主要微观特征. 它是材料在微区范围内塑性变形产生的显微空洞,经形核、长大、聚集最后相互连接而导致断裂后,在断口表面上所留下的痕迹. 韧窝的大小包括平均直 ...
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Seam：缝隙
但当微细孔的孔径进一步细小至75 m以下时,若再采用原有方法进行微孔电镀,就会出现孔口与表面b的沉积速率超过微孔底部铜a的情况,使微孔填充不均匀,在中间部位留下空洞(void)或缝隙(seam),这不仅降低了电路板讯号的传输速率,