- 更多网络例句与封装的相关的网络例句 [注：此内容来源于网络，仅供参考]
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Experimental accuracy and repetition of FBG temperature sensitivity and compensation were discussed.have selected several materials which has bigger coefficient of expansion to do packaging components, have made many temperature experiments, there have not flaws, such as aging, crackle, absciss layer, packaging materials have good temperature sensitivity and compatibility with optical fiber;have designed the simple and practical packaging components, have performed a serials of experiments about accuracy and repetition of FBG wave-length, have obtained the first step conclusion;have analyzed the result and made comparison between the result of different experiment, have summarized the best packaging effect and several rules to reduce mistskes.
本文所做的主要工作包括以下几个内容：一、选取了常见的热膨胀系数大的材料制作封装元件，经过多次一80℃到80℃反复测试，封装元件没有出现老化开裂、封装裂纹、空洞、离层等缺陷，封装材料具有良好的温敏稳定性及复用性，与光纤相容性较好；二、对光纤光栅进行简单、实用的封装处理，就封装效果的优劣性、波长测量的准确度、重复性和封装时产生的波长损失等方面进行了一系列的实验，得出了初步的结论；三、对温敏和温度补偿式封装的实验数据进行了详细的分析和对比，从数字上对温变过程中光纤光栅中心波长的改变及温变曲线进行了定量的分析，在大量实验数据分析结果的基础上，总结出哪种材料封装效果更好，以及如何有效的减小实验误差。
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The new decal wizard enhancements will significantly decrease the time to create a new decal, while increasing the accuracy.
新的封装精灵不仅保留以往的功能，又减少了建立封装所耗费的时间，同时也提升了建立封装的正确性。
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Assembly of Advanced packages such as Ball Grid Array and Chip Size Package.
先进封装的装配，如球形焊点阵列和芯片尺寸封装。
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One way to do that is to hijack the mechanisms used for wrapping a class with virtual functions.
一个方法是，在封装带虚函数的类时，劫持用于封装的机制。
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This invention relates to the manufacture of a substrate, such as a package substrate or an interposer substrate, of an integrated circuit package.
本发明涉及集成电路封装的衬底诸如封装衬底或插入衬底的制造。
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Electronics, therm al, therm odynamics asp ects, reliability analysis, testing and
封装的可靠性分析、测试方法和实验方法，微电子和微系统封装的选择原则及封
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The structure and of encapsulating agent model was designed and the flow of resource encapsulated was introduced.
建立了用于资源封装的移动Agent资源封装模型和流程，通过对制造资源的移动Agent封装，实现将制造资源封装成为平台的资源服务结点。
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It also described the basic technology of the RF system's packaging and a System-In-Packagemodule of RF system with LNA, PPA, filter and antenna switch.
对高速数据处理和高密度封装技术的特点及对射频系统封装的特殊要求进行论述，介绍了射频系统封装的基本技术和一种包含LAN、PPA、滤波器、天线开关等的射频系统级封装组件。
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In addition, the stress/strain responses of lead-free Flip Chip on Board under packaging process and thermal cycling was simulated with finite element method.
利用有限元仿真的方法，模拟了无铅倒装封装器件封装的工艺及可靠性测试。
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Compare with tunable filter detection technique, the wavelength measurement technique using tunable source is analyzed theoretically. We design a kind of all-fiber sensing interrogation system, by using long-period fiber grating as edge filter to interrogate the sensing signal of the FBG sensor. The wavelength resolution of the sensing measurement is 0.05nm.A novel FBG Bourdon tube sensor has been constructed, utilizing the pressure mechanic amplify function of Bourdon tube. The measured pressure sensitivity is two orders of magnitude higher than a simple monomode fiber with an in-fiber grating. Especially the pressure sensitivity of the sensor can be determined by changing the parameters of the cantilever beam. Adopting polymer package technique, we coat fiber Bragg grating by using polymer with different mechanic properties.
利用波登管对于压力的机械放大作用，研制了一种新颖的光纤光栅波登管压力传感器，将FBG的压力灵敏度提高了两个数量级，特别是这一传感器的压力灵敏度的大小可以通过改变悬臂梁自身的参数灵活控制；采用聚合物封装技术，将FBG封装于具有不同力学特性的有机聚合物基底中，利用基底的带动作用，将FBG对压力的灵敏度分别提高了20倍和31.7倍，由于我们采用了特殊的工艺，封装后的FBG不出现任何光栅啁啾；在成功封装的基础上对封装光栅的蠕变效应、FBG与封装材料之间的防滑处理等进行了实验研究；设计了外加圆柱形铝管的聚合物封装光纤光栅，将FBG的压力灵敏度提高了1430倍，可用于对微小压力变化的精确测量。
- 更多网络解释与封装的相关的网络解释 [注：此内容来源于网络，仅供参考]
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Allow Editing of Footprint：可直接编辑封装的组成部件
Instantaneous Reconnection Mode-进入重新连线模式 | Allow Editing of Footprint-可直接编辑封装的组成部件 | Copper Pour Preferences-与铺铜相关的设置
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Different footprints：元件封装的改变
◆Different types 出现不同的标准 | ◆Different footprints 元件封装的改变 | ◆Extra channel classes 多余的通道类
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housed：封装的
housed pump 箱式泵 | housed 封装的 | household registration 户口登记
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housed joint：封装接头,嵌槽接头
housed 封装的 | housed joint 封装接头,嵌槽接头 | housed string 暗楼梯基
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potted：封装的
parabola 抛物线 | potted 封装的 | filter 滤波器
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SIP：单列直插式封装
电子元器件 单列直插式封装(SIP)引脚从封装一个侧面引出,排列成一条直线. 通常,它们是通孔式的,管脚插入印刷电路板的金属孔内. 当装配到印刷基板上时封装呈侧立状. 这种形式的一种变化是锯齿型单列式封装(ZIP),
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unefficient：无效的
unedible 非食用的;不可食用的 | unefficient 无效的 | unencapsulated 未密封的;未用塑料封装的
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unequable：未调匀的;不稳定的;易变的;无规律的
unencapsulated 未密封的;未用塑料封装的 | unequable 未调匀的;不稳定的;易变的;无规律的 | unequal fission 不等分裂
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Epoxies for Potting：(用于封装的环氧树脂)
Epoxies for Potting(用于封装的环氧树脂) | General Purpose Epoxies For Electronic Potting Applications(电子填充的通用环氧树脂) | B.Epoxy Based Potting Compound XS-531(用灌注混合物XS-531制造的环氧树脂...
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General Purpose Epoxies For Electronic Potting Applications：(电子填充的通用环氧树脂)
Epoxies for Potting(用于封装的环氧树脂) | General Purpose Epoxies For Electronic Potting Applications(电子填充的通用环氧树脂) | B.Epoxy Based Potting Compound XS-531(用灌注混合物XS-531制造的环氧树脂...