- 更多网络例句与共熔合金相关的网络例句 [注：此内容来源于网络，仅供参考]
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It's a eutectic alloy .
这是低共熔合金。
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If this alloy is homogenized at 700℃ for 6h and slow cooled, the structure is that of large grains of α with twins, surrounded by coarse α+δ eutectoid.
这个合金如果在700℃均质化6小时，它的结构成为大颗粒的α孪晶相，周围包裹着粗糙的α+δ共熔相。
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The process and mechanism of primary silicon growth in the Al-Si hypereutectic melt were studied by quench interrupting.
摘 要：利用等温液淬的方法，研究了Al-18%Si过共晶合金熔体中初生硅的生长行为及机制。
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By using the calculated results of EET theory, the local valence electron structure elements of residual chemical bonds of Al-Si and Mg-Al alloy melts, that is, the residual bond structure models, were established. From the viewpoint of effect of pressure on melt structure, the essential reason of deviation phenomenon for maximum solution point and eutectic point in thermodynamics equilibrium phase diagram was analysed. Moreover, under pressure condition, the change of thermodynamics equilibrium phase diagram was macroscopic reflection of microstructure change of alloy melt.
运用固体与分子经验电子理论的计算结果分别建立Al-Si、Mg-Al两种合金熔体的剩余化学键的局域价电子结构基本单元即残余键结构模型，从压力对熔体结构作用的层面，分析热力学平衡相图中最大固溶点和共晶点发生偏移的本质原因，并指出压力作用下热力学平衡相图的变化是合金熔体微观结构信息变化的宏观反映。
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Its rapidsolidification behaviour during recalescence was studied by means of high speed cinematography andrapid infrared pyrometry,It is found that interface heterogeneous nucleation takes place in preferenceto homogeneous nucleation even at an undercooling above the previously accepted critical undercool-ing 0.2T_mfor homogeneous nucleatio...
采用高速摄影及快速红外测温技术研究了深过冷熔体的快速凝固行为。发现尽管过冷度超过了以往认为的均质形核临界过冷度0.2T_m，但是 Ni-32.5%Sn 共晶合金仍然优先发生界面异质形核，再辉过程中瞬时凝固速度最大可达784mm/s。
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The powder consists of spheroidal particle with size in the range of from 15 to 70 μm and average size of 45μm.
采用熔体'枪喷溅'激冷技术使Cu-Ag共晶合金系在几乎所有成分范围内获得单相固溶体[1]。
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The dynamic viscosity of In-55wt﹪Sb hypoeutectic alloy melt was measured in a wide temperature range above liquidus in heating and cooling processes by using a torsional oscillation viscometer.
利用回转振动粘度仪在液相线以上较大温度范围内，测量了In-55﹪Sb亚共晶合金熔体在不同的升降温过程中的粘度。
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Effects of the pretreatment of catalysis, reaction temperature, the ratio of the reactants, the substrate-catalyst ratio and the content of the promoter on the reaction properties of NaK catalysts has been studied in a wide range.
本实验用超声波技术激活金属钾钠合金低共熔物催化剂，考察了催化剂预处理，反应温度，原料配比，催化剂用量以及加入助剂用量等因素对钾钠液态低共熔物催化剂上邻二甲苯与1，3-丁二烯合成OTP反应转化率的影响。
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ABSTRACT in the first part of this thesis, the interaction between cu-sn and ni-sn interfacial reactions in a soldering system has been studied by using a ni-sn3.5ag-cu sandwich structure. a layer of cu-sn intermetallic compound was observed at the interface of the ni foil after 30 seconds reflowing.
在电子元件高功率及及轻、薄、短、小化的要求下，热一直是造成电子元件失效的原因之一，BGA封装的主要失效原因是作为接点的锡铅共熔合金（63Sn-37Pb；或称锡球）的疲劳破裂，这是导因於封装体不同材料间热膨胀系数的差异所造成的热应变。
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Self-fluxing Fe-Cr-Ni-B-Si alloy prowders are laser clad on medium carbon steel substrate of dimensions 80×35×10mm〓. The investigation results of this clad layer are: micro-defects, micro-cavity and occluded forin substance, are the micro-cracks and crack resourses in clad layer; crack of coating propagates along the boundary of two kinds of eutectic sutructure; The included angle θ between the cracking direction and laser scanning direction in multitrack overlapping clad is smaller than that in one-track clad because of crack propagating along crystalline growth direction and crystalline direction in overlapping zone being different from it in one-track clad.
在调质态的45〓钢表面，采用预置粉末法进行FeCrNiBSi合金的多道搭接激光熔覆，对其熔覆层进行分析表明：多道搭接激光熔覆层裂纹扩展方向与激光扫描方向间的夹角θ与单道熔覆时相比明显变小，前者θ0°，后者θ角基本都为90°，这主要是因为多道搭接时，搭接区结晶方向发生了变化以及裂纹沿结晶方向扩展所致；激光熔覆层裂纹大多是以覆层与基材交界面的孔洞、熔覆层内不同方向共晶团间的显微缩孔、夹杂物的边界等三种显微缺陷作为裂纹源，并沿低熔点物相形成元素偏析造成弱化膜的共晶团界面扩展延伸。
- 更多网络解释与共熔合金相关的网络解释 [注：此内容来源于网络，仅供参考]
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plastic deformation：金属塑性
金属的相融、相融温度、晶体反应及合金在共晶合金、固熔孻共晶合金及偏晶反应的比较 Equilibrium Comparision | 金属塑性 Plastic Deformation | 滑动面 Slip Plan
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ductility：展性
(2)展性(Ductility)良好,可呈现极佳的抗疲劳性(Fatigue Resistance),甚至还优於锡铅之共熔合金. 锡铅二元合金之焊料,事实上是锡熔进铅中,而所谓的Solder即是二者之"溶液"而已. 高温焊接中板面承垫中的铜份也会融入铅与锡中,
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eutectic alloy：低共熔合金
eutectic 共晶 | eutectic alloy 低共熔合金 | eutectic mixture 低共熔混合物
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eutectic preform：共晶合金盘料
eutectic die bonder 共晶芯片焊接装置 | eutectic preform 共晶合金盘料 | eutectic solder 易熔质焊料
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Eutectic alpax：共晶铝-硅合金
共晶铝硅合金:eutectic Al-Si alloys | 共晶铝-硅合金:Eutectic alpax | 低共熔体系:low eutectic system
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Hypoeutectic：低级低共熔体
hypoestrinemia 血雌激素过少 | hypoeutectic 低级低共熔体 | hypoeutecticalloy 亚共晶合金
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hypoeutectoid：亚共析 低级低共熔体 低易融质
hypoeutecticalloy 亚共晶合金 | hypoeutectoid 亚共析 低级低共熔体 低易融质 | hypoeutectoidsteel 亚共析钢