solderability

solderability的基本解释

n.

软焊性, 可焊性

与solderability相关的网络例句 [注：此内容来源于网络，仅供参考]

The solderability of benzimidazole films on the surface of copper is investigated by solder float test. Several factors which influence solderability of the films are discussed.

采用上锡率法研究了咪唑化合物在铜表面所成保护膜的可焊性，并探讨了咪唑化合物类型、膜厚、再流焊次数及高温热冲击对该膜可焊性的影响。

Our process capability: Plates: FR4, High TG FR4, high CTI FR4, high frequency materials, halogen-free materials, aluminum and other low-rise Materials :2-20 layer of finished copper thickness :0.5-5 OZ finished thickness: 0.2 -6.0mm Minimum line width: 3mil Minimum line spacing: 3mil smallest shape tolerances:+/-0.1mm minimum finished diameter: 0.1mm maximum thickness aperture ratio: 12:1 wide minimum solder bridge: 4mil characters minimum line width: 5mil Minimum height of characters: 30mil Solder Mask Color: Green, black, blue, white, yellow, purple characters such as color: white, yellow, black and other surface processes: spray tin, lead-free HASL, Electroless gold plating Shuijin, OSP, chemical Shen tin, silver and other chemicals Shen Process: Goldfinger, blue gum, Blind-via/Buried-via, characteristic impedance control, rigid-flexible combination of reliability testing such as: Open / Short testing, impedance testing, solderability testing, thermal shock testing, metallographic analysis of micro-slice curvature Isoptera: 0.7% flame retardant Level: 94V-0

我们公司的制程能力：板材：FR4、高TG FR4、高CTI FR4、高频材料、无卤素材料、铝基材料等层数：2-20层成品铜厚：0.5-5 OZ成品板厚：0.2-6.0mm最小线宽：3mil最小线间距：3mil最小外形公差：+/-0.1mm最小成品孔径：0.1mm最大板厚孔径比：12：1最小阻焊桥宽：4mil最小字符线宽：5mil最小字符高度：30mil阻焊颜色：绿色、黑色、蓝色、白色、黄色、紫色等字符颜色：白色、黄色、黑色等表面工艺：喷锡，无铅喷锡、化学沉金、电镀水金、OSP、化学沉锡、化学沉银等其它工艺：金手指、蓝胶、盲埋孔、特性阻抗控制、刚柔结合等可靠性测试：开/短路测试、阻抗测试、可焊性测试、热冲击测试、金相微切片分析等翅曲度：≤0.7%阻燃等级：94V-0

Our main products are: 130 polyester enamelled copper round wire, 155 modified polyester enamelled copper round wire, 180 polyester-imide enamelled round copper wire, 200 polyester-imide / PA ester imide compound enamelled copper round wire, high strength acetal enamelled round copper to grade, B grade, F grade, H-class straight Solderability enamelled copper round wire polyurethane.

我们的主要产品有：130级聚酯漆包铜圆线、155级改性聚酯漆包铜圆线、180级聚酯亚胺漆包铜圆线、200级聚酯亚胺/聚酰胺酯亚胺复合漆包铜圆线、高强度缩醛漆包铜圆、以级、B级、F级、H级的直焊性聚氨酯漆包铜圆线。

与solderability相关的网络解释 [注：此内容来源于网络，仅供参考]

edge-board contact：板边金手指

Edge-Board Connector板边(金手指)承接器. | Edge-Board Contact板边金手指. | Edge-Dip Solderability Test板边焊锡性测试.

edge-board contact：板边金手指.LYm电子资料网

Edge-Board Connector板边(金手指)承接器.LYm电子资料网 | Edge-Board Contact板边金手指.LYm电子资料网 | Edge-Dip Solderability Test板边焊锡性测试.LYm电子资料网

Relow Soldering Pre-conditioning：回流焊前处理

Description 内容 | Relow Soldering Pre-conditioning 回流焊前处理 | Wave soldering Solderability Test 波峰焊可焊性试验