solder joint
- solder joint的基本解释
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钎焊缝, 钎焊接头
- 更多网络例句与solder joint相关的网络例句 [注：此内容来源于网络，仅供参考]
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Practicability of Surface Evolver in evolving prediction of SMT solder joint is reviewed and validated. Chapter five: finite element analysis method based on minimal energy principle with application of Surface Evolver is firstly used in evolving prediction of the kind of BGA solder joint shape.
基于最小能量原理的有限元数值分析方法与边界值积分数学分析方法相比，能更有效地求解各类SMT焊点三维形态成形预测问题，并具有很好的热应力分析延续性和良好的分析精度。
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The influence of the size of pad and solder bump, the volume of eutectic solder and reflow temperature on the geometry of duplex SnPb solder joint with high Pb solder bump and eutectic SnPb fillet was simulated by finite element method with the software of SURFACE EVOLVER.
应用SurfaceEvolver软件，对含高铅焊料芯片凸点和共晶SnPb焊料形成的复合焊点的形态进行了有限元模拟，考察了焊盘大小、芯片凸点尺寸、焊料体积、焊接温度等焊点的设计及工艺参数对焊点形态的影响。
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The effects of electroplated Ni layer and electroless plated Ni-P layer on the diffusion behavior in Sn-Ag/Cu solder joint were studied. The results by EPMA analysis showed that the electroless plated Ni-P layer acted as a good diffusion barrier between Sn-Ag solder and Cu substrate. However, the electroplated Ni layer can not hinder the inter-diffusion and reaction between molten Sn-Ag solder and Cu substrate when reflowing, and there was a layer of IMC (Cu6Sn5) at interface of Sn-Ag/C u solder joint.
摘 要：研究了电镀Ni层和化学镀Ni-P合金层对Sn-Ag/Cu焊点扩散行为的影响，电子探针分析表明：化学镀Ni-P合金层能很好地阻止Sn-Ag/Cu焊点在焊接过程中的Cu，Sn互扩散和相互反应；而电镀Ni层则不能阻止Sn-Ag/Cu焊点在焊接过程中的Cu，Sn互扩散和相互反应，界面反应产物仍以Cu6Sn5为主。
- 更多网络解释与solder joint相关的网络解释 [注：此内容来源于网络，仅供参考]
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coefficient of thermal expansion (CTE)：热澎胀系数
coating error 防焊覆盖错误 | coefficient of thermal expansion (CTE) 热澎胀系数 | cold solder joint 冷焊点
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soldered joint：焊接接头; 点焊接合
solder-type head 易溶元件洒水喷头 | soldered joint 焊接接头; 点焊接合 | soldering iron 烙铁
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half-and-half joint：对拼接头
half-and-half bearing ==> 半轴承 | half-and-half joint ==> 对拼接头 | half-and-half solder ==> 锡铅各半的焊料,铅锡各半软钎料