scale coefficient
- scale coefficient的基本解释
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比例因子, 尺度系数
- 更多网络例句与scale coefficient相关的网络例句 [注：此内容来源于网络，仅供参考]
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Result The results showed that the cutting survival rate and propagation coefficient were higher in interlayer scale, the difference of which was not obvious between outside and inside scales. Compared with integrated scale, cross cutting and score cutting scale all could reduce scale propagation coefficient Treating scale with 0.1% HgCl2 could prevent scale rot effectively and increase propagation coefficient Integrated scale without segmentation was good for lily bud scale cutting.
结果］结果表明：中层鳞片的扦插成活率较高，繁殖系数也较高，外层与内层鳞片之间的差异不明显；与完整鳞片相比，横切鳞片和纵切鳞片都会降低鳞片繁殖系数；用0.1% HgCl2处理鳞片，可有效防止磷片腐烂，提高繁殖系数。
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The results show that the microstructure of ventra1 scale for python was composed of micro-convex and plank structure that was periodically arranged, it was mensurable and could be described by 9 characteristic parameters. Its surface was different in their forward and backward lean angle. The frictional coefficient of the ventra1 scale had closely relationship with moving direction, it decreased with the increasing load. The value of the frictional coefficient was about 0.07. The frictional coefficient while python moved backward and laterally were equal, and that was 33% more than that moved ahead. The frictional force of the ventra1 scale surface was caused by mechanical tooth function of micro-convex, acting intermolecular force and material's elastic hysteresis. The difference of forward and behind bevel for micro-convex was the anisotropy reason of frictional force.
结果表明：腹鳞表面的微观结构由指状微突体和板结构部分周期排列而成，其结构可用9个特征参数定量描述；腹鳞表面摩擦力由分子作用力、表面微突体的犁沟力、楔形作用力以及材料弹性滞后共同引起；腹鳞表面的摩擦系数在0.07左右并与运动方向有关，摩擦系数随载荷增加而减小；后向运动及左、右侧向运动时摩擦系数基本相等，比前向运动时高33%左右；腹鳞表面微突体不同方向上倾斜角度的差异是引起摩擦各向异性的主要原因。
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Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion in flip chip technology.
底层填充技术应用于倒装芯片热膨胀系数配合的最小化，它也被扩展应用到增加CSP(Chip Scale Package 芯片级封装)的机械强度。
- 更多网络解释与scale coefficient相关的网络解释 [注：此内容来源于网络，仅供参考]
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CTE :coefficient of thermal expansion：热膨胀系数
CSP :chip scale package 芯片尺寸构装 | CTE :coefficient of thermal expansion 热膨胀系数 | DIP :dual in-line package 双内线包装(泛指手插组件)
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average wage scale coefficient：平均工资
average wage index 平均工资指数 | average wage rate 平均工资率 | average wage scale coefficient 平均工资
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scale beam：秤杆
scale 标度 | scale beam 秤杆 | scale coefficient 生垢因数