peelable
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The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.
该方法包括以下步骤:在硅衬底上形成可剥离树脂层;在所述可剥离树脂层上形成布线衬底;将半导体芯片安装在所述布线衬底上;通过用密封树脂密封所述多个半导体芯片来形成半导体器件;通过从密封树脂侧将这些半导体器件切分但是保留硅衬底来使这些半导体器件个体化;将每个个体化半导体器件在所述硅衬底和可剥离树脂层之间从硅衬底上剥离;并且通过形成穿过可剥离树脂层的孔或者通过除去可剥离树脂层来使布线衬底上的端子暴露。
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And claims, such as the availability of effective peelable grades, are difficult to substantiate.
和索赔,如提供有效的可剥职系,是难以证实。
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Peelable lid for the European single-serve food market.
可剥盖子的欧洲单一服务的食品市场。
- 更多网络解释 与peelable相关的网络解释 [注:此内容来源于网络,仅供参考]
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Peelable:剥离强度
Peelable 可剥性 | Peelable 剥离强度 | Peelable Mask 可脱油
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Peelable:可剥性
Peel strength 剥离强度 | Peelable 可剥性 | Peelable 剥离强度
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peelable resist:可剥性
193.Pattern plating图形电镀 | 194.peelable resist可剥性 | 195.phenolic酚醛树脂
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Peelable mask:可剥胶
12钻嘴Drill bit | 13可剥胶Peelable mask | 14针床(治具)Fixture
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Peelable mask:可脱油
Peelable 剥离强度 | Peelable Mask 可脱油 | Peeling 剥离
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