minimum limit

minimum limit的基本解释

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最小限度

与minimum limit相关的网络例句 [注：此内容来源于网络，仅供参考]

Based on the system feedback archetype mode theory, the dissertation introduce the upper limit stepwise generation and elimination method of the system pullulate upper limit mode, construct the five upper limit archetype mode such as: market demand upper limit archetype mode, human resource upper limit archetype mode; fund upper limit archetype modes; technology innovation upper limit archetype mode; government support upper limit archetype mode ;By combining the five upper limit archetype mode ,we can attain a electronic information industry developmental pattern system upper limit archetype mode.

利用系统科学反馈基模分析理论，提出了系统成长上限模型上限逐步生成与消除法，通过构建江西电子信息产业市场需求成长上限子基模、人力资源不足成长上限子基模、政府支持有限成长上限子基模、资金不足成长上限子基模、创新能力不足成长上限子基模等5个基模，并对其做并运算，得到了江西电子信息产业系统成长上限基模，刻画了资金、市场、技术创新、人才与政府支持相互制约的关联关系。

Thus, evaluation of the minimum zone circle could be solved effectively.Three methods of assessment of roundness error were proposed in this dissertation. Based on the criteria of the minimum zone circle, minimum circumscribed circle and maximum inscribed circle and convex hull, a unified approach was proposed to evaluate roundness error of the minimum zone circle, minimum circumscribed circle and maximum inscribed circle. Evaluation of the minimum zone circle, minimum circumscribed circle and maximum inscribed circle was fulfilled with rotation based the contact pattern. The minimum circumscribed circle and maximum inscribed circle were evaluated with curvature and the curvature circle.

本文提出了三种圆度误差评定的方法：根据最小区域圆、最小外接圆、最大内接圆在极坐标系下的判别准则，利用计算几何中的凸壳理论，提出了一种统一的评定方法，实现了对最小区域圆、最小外接圆、最大内接圆的误差评定；基于接触斑点的检验原理，利用旋转法，实现了最小区域圆、最小外接圆和最大内接圆的误差评定；利用曲率和曲率圆，实现了对最小外接圆和最大内接圆的误差评定。

Our process capability: Plates: FR4, High TG FR4, high CTI FR4, high frequency materials, halogen-free materials, aluminum and other low-rise Materials :2-20 layer of finished copper thickness :0.5-5 OZ finished thickness: 0.2 -6.0mm Minimum line width: 3mil Minimum line spacing: 3mil smallest shape tolerances:+/-0.1mm minimum finished diameter: 0.1mm maximum thickness aperture ratio: 12:1 wide minimum solder bridge: 4mil characters minimum line width: 5mil Minimum height of characters: 30mil Solder Mask Color: Green, black, blue, white, yellow, purple characters such as color: white, yellow, black and other surface processes: spray tin, lead-free HASL, Electroless gold plating Shuijin, OSP, chemical Shen tin, silver and other chemicals Shen Process: Goldfinger, blue gum, Blind-via/Buried-via, characteristic impedance control, rigid-flexible combination of reliability testing such as: Open / Short testing, impedance testing, solderability testing, thermal shock testing, metallographic analysis of micro-slice curvature Isoptera: 0.7% flame retardant Level: 94V-0

我们公司的制程能力：板材：FR4、高TG FR4、高CTI FR4、高频材料、无卤素材料、铝基材料等层数：2-20层成品铜厚：0.5-5 OZ成品板厚：0.2-6.0mm最小线宽：3mil最小线间距：3mil最小外形公差：+/-0.1mm最小成品孔径：0.1mm最大板厚孔径比：12：1最小阻焊桥宽：4mil最小字符线宽：5mil最小字符高度：30mil阻焊颜色：绿色、黑色、蓝色、白色、黄色、紫色等字符颜色：白色、黄色、黑色等表面工艺：喷锡，无铅喷锡、化学沉金、电镀水金、OSP、化学沉锡、化学沉银等其它工艺：金手指、蓝胶、盲埋孔、特性阻抗控制、刚柔结合等可靠性测试：开/短路测试、阻抗测试、可焊性测试、热冲击测试、金相微切片分析等翅曲度：≤0.7%阻燃等级：94V-0

与minimum limit相关的网络解释 [注：此内容来源于网络，仅供参考]

minimum material condition：最少留料情况

"最小极限尺寸","minimum limit size" | "最少留料情况","minimum material condition" | "最小螺纹根弧半径","minimum material limit"

Limes inferior lower limit; infimum limit：下限;最大下界

Limes limit 极限 | Limes inferior lower limit; infimum limit 下限;最大下界 | Limes superior supremum limit; upper limit 最小上界;上极限

minimum entropy principle：最小熵原理

minimum deviation 最小偏差 | minimum entropy principle 最小熵原理 | minimum limit of size 最小极限尺寸