k.w.h.
- k.w.h.的基本解释
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[计] 千瓦小时, 度
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Efforts to pronounce the pinyin "w" as any english "w" misinterprets the fact that a pinyin "w" is merely a spelling convention. wiki
但无论怎样，都是声门音，而不是那样的软腭音（g和k是软腭塞音，所以拼音表里面把g k h放在一起）。
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The results show that the best sintering process for SiC preform is 1100℃, 8 h in vacuum, by which the open porosity is 99.6% and the preform strength reaches 0.57MPa. The thermo-physical characteristics of 57% SiC/Al composites produced by this technique are as follows: the relative density is 98.7%; the thermal expansion coefficient is 7.5×10^(-6)℃^(-1) which almost matches those of GaAs and BeO; the thermal conductivity is 1.65×10^5W/K, which corresponds to that of Cu(15%)/W and decuples that of Kovar alloy; the density is close to that of aluminum and less than that of one fifth of Cu/W.
结果表明：经1100℃真空烧结8h的SiC预成形坯开孔率可以达到99.6%，抗压强度为0.57MPa；所制备的57%SiC/Al复合材料相对密度为98.7%，热膨胀系数为7.5×10^(-6)℃^(-1)，与GaAs、BeO的接近，热导率为1.65×10^5W/K，与传统Cu(l5%)/W相当，是柯伐合金的10倍，在密度上接近Al，不到Cu/W的1/5。
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The results show that the best sintering process for SiC preform is 1100℃, 8 h in vacuum, by which the open porosity is 99.6% and the preform strength reaches 0.57 MPa. The thermo-physical characteristics of 57% SiCp/Al composites produced by this technique are as follows: the relative density is 98.7%; the thermal expansion coefficient is 7.5×10-6 ℃-1 which almost matches those of GaAs and BeO; the thermal conductivity is 1.65×105 W/K, which corresponds to that of Cu(15%)/W and decuples that of Kovar alloy; the density is close to that of aluminum and less than that of one fifth of Cu/W.
结果表明：经1 100 ℃真空烧结8 h的SiC预成形坯开孔率可以达到99.6%，抗压强度为0.57 MPa；所制备的57％SiCp/Al复合材料相对密度为98.7％，热膨胀系数为7.5×10-6 ℃-1，与GaAs、 BeO的接近，热导率为1.65×105 W/K，与传统Cu(15%)/W相当，是柯伐合金的10倍，在密度上接近Al，不到Cu/W的1/5。
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Government Economist：政府经济顾问
邓广尧先生 Mr K Y TANG | 政府经济顾问 Government Economist | 何永 先生 Mr Frederick W H HO
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L C H：建筑系友仔,跑来挖我们计算机的墙角
W K 贴身友仔,话题很多共同点很少. | L C H 建筑系友仔,跑来挖我们计算机的墙角. | O X 五年缘分,聊得不多但感觉很熟.
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Dr C.H. Hui：許振興博士
何冠彪博士 Dr K.P. Ho | 許振興博士 Dr C.H. Hui | 黎活仁博士 Dr W.Y. Lai