英语人>词典>英汉 : holding device的中文,翻译,解释,例句
holding device的中文,翻译,解释,例句

holding device

holding device的基本解释
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夹持装置, 夹紧器, 夹具, 吸持装置

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更多 网络例句 与holding device相关的网络例句 [注:此内容来源于网络,仅供参考]

As the track space increasing, the holding power which flexible holding parts act on sugarcane is dropping off. As the canvas layers and length of flexible holding part increasing, the track space is also increased when flexible holding parts act on sugarcane same holding power. As the length of flexible holding part increasing, the rate of slope of holding power following the track space to change would be decreased, so holding power would vary slowly. The holding power has a better linear relationship with the track space. Holding sugarcane stalk on knot or not on knot, sugarcane stalk having leaves or without leaves, the holding power would have not significant difference. Considering the structure of device and stress of sugarcane, 4-layers canvas conveyer belt was used as flexible holding part, while its length is 120mm, 160mm, or 200mm, the corresponding maximum track space is 135mm, 183mm, or 235mm. Experimental investigation of sugarcane windrowing was done on the arc-track-type flexible holding and conveying test mechanism.

随着轨道间距的增大,柔性夹持元件施加给甘蔗的夹持力逐渐减少;施加给甘蔗相同的夹持力,随着柔性夹持元件帆布帘层数和长度的增加,对应的轨道间距增加;随着柔性夹持元件长度的增大,柔性夹持元件施加给甘蔗的夹持力随轨道间距变化的斜率减小,夹持力大小的变化越缓慢;柔性夹持元件提供的夹持力与轨道间距均呈线性关系;柔性夹持元件夹在甘蔗节上还是不夹在节上,甘蔗有叶还是无叶,其施加给甘蔗的夹持力无显著差异;从夹持输送装置结构以及甘蔗的受力情况来考虑,选择4层帆布帘输送带作为柔性夹持元件更能平稳、柔和地夹持输送甘蔗,4层帆布帘120mm、160mm、200mm长的柔性夹持元件夹持甘蔗所需最大轨道间距为135mm 、183mm、235mm。

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With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业,不在行,求高手帮忙。谢谢!具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

更多网络解释 与holding device相关的网络解释 [注:此内容来源于网络,仅供参考]

holding power of ground tackle:锚设备抓力

holding power of anchoring 锚泊系留力 | holding power of ground tackle 锚设备抓力 | holding power to weight ratio 抓重比

bank holding company:金融控股公司

金融控股公司:financial holding company | 金融控股公司:bank holding company | 控股公司模式:holding company model

holding furnace:保温炉,混合炉

holding function 动作功能 | holding furnace 保温炉,混合炉 | holding gun 保持电子枪,保存电子枪