flip chip

flip chip的基本解释

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叨焊晶片, 倒装晶片, 倒装法, 叼焊晶片

与flip chip相关的网络例句 [注：此内容来源于网络，仅供参考]

In this paper, the bump patterns for flip-chip packages are discussed first, then an experiment is setup to study the dispensing phenomena for different bump patterns, and the CAE software is used to analyze and identify with experiment mutually. From these thorough comparisons and analytical analysis, the existence of channel could slow down the flow, the high density of bump could speed up the flow, and it could avoid the air trap by modified the bump and channel's arrangement on flip-chip package. Then flows in rectangular microchannels driven by capillary force and gravity are discussed; furthermore, the theoretical model of flow in microchannel driven by capillary force and gravity is formulated from the Navier-Stokes equations.

本文首先针对覆晶底部充填进行相关理论推导、实验与模拟，探讨不同凸块配置模型所造成的波前不平滑现象对底部充填流动的影响；即依据相关参数建立模型进行底部充填实验，同时以CAE(Computer-Aided Engineering)模流分析软体进行模拟，在完成理论探讨、实验与模拟分析之后，交叉比较理论、实验与模拟分析结果，归纳出影响底胶充填流动之因素，由结果显示在凸块密集度较高的区域，凸块可以帮助流动，但是在凸块区后方的沟槽区域则因为凸块区所提供之流量不足，所以会造成波前落后的现象，另外藉由修改凸块与沟槽配置的关系，可以有效的控制波前形状的变化情形，避免产生包风现象。

Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion in flip chip technology.

底层填充技术应用于倒装芯片热膨胀系数配合的最小化，它也被扩展应用到增加CSP(Chip Scale Package 芯片级封装)的机械强度。

Encapsulant was driven by capillary force into the space between the chip and substrate. Underfill technique can protect the electrical device and prevent the device from destroying because of external force. Underfill has many defects including the fill time is too long, the situation of short shot and air trap are caused easily, the yield of product of Flip-Chip is not highest and the products are universal. Therefore, there are many factors being studied in this paper to sum up the influence of underfill of Flip-Chip process cause by model parameters.

覆晶接合技术为先进电子讯号连接技术中的一种，具有高I/O数、电子讯号路径短以及尺寸小等优点，而采用覆晶接合之电子元件大部分均以底部充填技术进行封装；底部充填是一种以毛细作用为驱动力在晶片与基板之间的间隙充填底胶的封装技术，可以确保晶片不受到外力的影响而损及封装体，但此技术具有充填时间长、容易产生短射与包风等缺点，使得覆晶封装制程良率不高，间接影响覆晶封装产品的普及率，因此本文将依各种可能之参数模型对覆晶封装底部充填制程的影响，以供业界参考。

与flip chip相关的网络解释 [注：此内容来源于网络，仅供参考]

Flip chip：覆晶

华宸科技成立於1998年,为联华电子转投资之关系企业,传承自美国 Aptos Corp.生产制造技术及专业品质,提供 IC 覆晶(Flip Chip)、金凸块(Gold Bumping)封装完整服务(Turnkey Solution),成为国内主要TFT-LCD厂商的供应大厂.

flip chip on glass：玻璃衬底倒装片

flip chip on board 板衬底倒装片 | flip chip on glass 玻璃衬底倒装片 | flip chip on substrate 基片衬底倒装片

flip chip in package：倒装片封装

flip chip bump 倒装片[焊接]凸点,倒装片对准点 | flip chip in package 倒装片封装 | flip chip on board 板衬底倒装片