dicing saw
- dicing saw的基本解释
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钻石轮划片机
- 相关歌词
- The Harvest
- 相关中文词汇
- 钻石轮划片机
- 更多网络例句与dicing saw相关的网络例句 [注：此内容来源于网络，仅供参考]
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Resistance pure water system, 3-waste treatment system, and shock-proof working-table, and about 80 sets of micro-electrical-mechanical technical equipment are installed, including AMS200 ICP plasma etching system, ICP-2B etching machine, AWB04 bonding machine, MA6/BA6 Karlsus double-face photolithography machine/bonding machine, POLI-400 chemical-mechanical-polishing tool, WL2040 aluminum-wire press welder, OPTI CAOT 22i decktop precision spin coasting system, ZSH406 automatic dicing saw system, DQ-500 plasma photoresist-removing machine, HXS150S automatic centrifugal spinner, AXTRON MOCVD metal organic chemical vapor deposit system, 4470 micro-control 4-tube diffusing furnace, type 4371 LPCVD low pressure chemical vapor deposit system, OMICRON MBE molecular beam epitaxy system, JS-3X100B magnet-control spattering equipment, PECVD-2E plasma deposit apparatus, ZZSX500C electron-beam vapor equipment, JC500-3/D magnet-control spattering-coating machine, H63-14/ZM quartz-tube cleaning machine. Measurement instruments include OLS1100 Confocal Laser Scanning Microscope, DEKTAKIII Surface Profiler, D41-11A/ZN 4-probe resistance test instrument, Nikon L150 metallurgical microscope, and so on.
中心现有80多台各种微机电工艺设备，如AMS 200深硅等离子体刻蚀系统、ICP-2B刻蚀机、AWB04键合机、MA6/BA6 Karlsuss双面光刻机和键合机、POLI-400化学机械抛光机、WL2040铝丝压焊机、OPTI CAOT 22i喷涂胶机系统、ZSH406全自动划片机、DQ-500等离子去胶机、全自动清洗甩干机、AXTRON MOCVD金属有机物化学气相沉积系统、4470微控四管扩散炉、4371LPCVD低压化学沉积系统、OMICRON分子束外延系统、JS-3X100B磁控溅射台、PECVD-2E等离子淀积台、ZZSX500C电子束蒸发台、JC500-3/D磁控溅射镀膜机、石英管清洗机，以及多种常用测试仪器，如OLS1100激光共聚焦显微镜、DEKTAK-III台阶测量仪、D41-11A/ZN四探针电阻测试仪、Nikon L150金相显微镜等。
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The dicing machine for semiconductor and OPTO is the front-end equipment of back-end packaging process, and possessing about 9% among the equipment for die saw, die bond, wire bond, mold and mark. The market share of dicing machine was just subordinate to the equipment of die bond and wire bond, and was the main equipment of packaging process.
半导体和光电产业使用的切割机为封装后段封装制程中的前段设备，在晶圆切割、黏晶、焊线、封胶、盖印等设备中，所占的比例约为9%，市场仅次於黏晶、焊线设备属封装制程的主制程设备。
- 更多网络解释与dicing saw相关的网络解释 [注：此内容来源于网络，仅供参考]
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dicing saw：切割锯
dicing 切割 | dicing saw 切割锯 | didymium glass standard 钕镨玻璃标准
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dicing saw：划片机
dichroscope 二色镜 | dicing saw 划片机 | dicinnamlalcetone 二苯基壬四烯酮
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dicing saw：晶圆切割机
晶粒黏着机Die Bonder | 晶圆切割机Dicing Saw | 静电防制Static Eliminator