decuples

与decuples相关的网络例句 [注：此内容来源于网络，仅供参考]

Compare it, poor nation, high out several decuples, this be: you nation

比之， 贫穷国家，高出几十倍，这就是：你们国家

Although the total production value of mold is not high, it can create the product value few decuples of each mold.

模具总产值虽然不高，但是每付模具可创造其售价数十倍之产品产值。

Video data can be compressed by several decuples, even several hundred folds, which dramatically promotes the development of video communications.

视频编码技术可以将视频数据压缩几十倍，甚至几百倍，有力地推动了视频通信的发展。

The results show that the best sintering process for SiC preform is 1100℃, 8 h in vacuum, by which the open porosity is 99.6% and the preform strength reaches 0.57MPa. The thermo-physical characteristics of 57% SiC/Al composites produced by this technique are as follows: the relative density is 98.7%; the thermal expansion coefficient is 7.5×10^(-6)℃^(-1) which almost matches those of GaAs and BeO; the thermal conductivity is 1.65×10^5W/K, which corresponds to that of Cu(15%)/W and decuples that of Kovar alloy; the density is close to that of aluminum and less than that of one fifth of Cu/W.

结果表明：经1100℃真空烧结8h的SiC预成形坯开孔率可以达到99.6%，抗压强度为0.57MPa；所制备的57%SiC/Al复合材料相对密度为98.7%，热膨胀系数为7.5×10^(-6)℃^(-1)，与GaAs、BeO的接近，热导率为1.65×10^5W/K，与传统Cu(l5%)/W相当，是柯伐合金的10倍，在密度上接近Al，不到Cu/W的1/5。

The results show that the best sintering process for SiC preform is 1100℃, 8 h in vacuum, by which the open porosity is 99.6% and the preform strength reaches 0.57 MPa. The thermo-physical characteristics of 57% SiCp/Al composites produced by this technique are as follows: the relative density is 98.7%; the thermal expansion coefficient is 7.5×10-6 ℃-1 which almost matches those of GaAs and BeO; the thermal conductivity is 1.65×105 W/K, which corresponds to that of Cu(15%)/W and decuples that of Kovar alloy; the density is close to that of aluminum and less than that of one fifth of Cu/W.

结果表明：经1 100 ℃真空烧结8 h的SiC预成形坯开孔率可以达到99.6%，抗压强度为0.57 MPa；所制备的57％SiCp/Al复合材料相对密度为98.7％，热膨胀系数为7.5×10-6 ℃-1，与GaAs、 BeO的接近，热导率为1.65×105 W/K，与传统Cu(15%)/W相当，是柯伐合金的10倍，在密度上接近Al，不到Cu/W的1/5。