bump ball

与bump ball相关的网络例句 [注：此内容来源于网络，仅供参考]

On the basis of the summarization of MCM-Cs main features and its assembly and packaging technologies, the paper puts stress on relatively deepgoing studies in practically advanced MCM-C assembly process technologies as gold ball wire bonding, IC chip gold ball stud bump making, IC flip chip bonding and underfilling, in high reliability MCM-C packaging process technologies as integral LTCC substrate packaging, hermetically metal sealing, and also in the basic technological process of MCM-C assembly and packaging. Later on, it presents the effectively engineering development of two high level actual module products--a high-density monolithic processor system MCM-C , a high-speed data collecting and processing system MCM-C. Lastly, it briefly introduces various common methods of quality inspection and reliability test of MCM-C assembly and packaging in engineering practice.

论文在综述MCM-C的主要特点及其组装封装技术的基础上，重点对金丝球引线键合、IC芯片金球凸点制作、IC芯片倒装焊与下填充等实用先进MCM-C组装工艺技术和LTCC基板与外壳及PGA引线的一体化封装、气密性金属封装等高可靠MCM-C封装工艺技术以及MCM-C组装封装基本工艺流程展开了较深入的研究，有效完成了高密度单片机系统MCM-C和高速数据采集控制系统MCM-C等两种高水平实际产品的工程化研制工作，扼要介绍了工程实践中MCM-C组装封装工艺常用的质量检验方法和可靠性试验方法。

Another group plays basketball - they bump the ball aimlessly for hours on end.

另外一群在玩篮球——他们漫无目的地连续几个小时在练习运球。

I advised Chris to bump the ball upward to lengthen and delay the swing in order to release the ball from a position that afforded greater thrust.

我请Chris稍为往上推球，加长及延缓摆荡，使离手时位置是在能够提供球最大能量的区域。

In the back of the printed substrate produced by the display means to replace the pin ball bump, substrate in the printing of a positive LSI chip assembly, and then molded resin or potting sealing methods.

在印刷基板的背面按陈列方式制作出球形凸点用以代替引脚，在印刷基板的正面装配LSI芯片，然后用模压树脂或灌封方法进行密封。

Drive out the 10 pin. I advised Chris to bump the ball upward to lengthen and delay the swing in order to release the ball from a position that afforded greater thrust.

虽然 early swing 的 release 不会有什麼不顺的感觉，但球的离手点稍稍过了强力的杠杆区会减少球的击瓶力度而留下10号瓶。