automated operator interface

automated operator interface的基本解释

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[计] 自动操作

与automated operator interface相关的网络例句 [注：此内容来源于网络，仅供参考]

Op1 + op2 The addition operator will add two numbers. op1 - op2 The subtraction operator will subtract two numbers. op1 * op2 The multiplication operator will multiply two numbers. op1 / op2 The division operator will divide two numbers. op1 % op2 The modulus operator will return the remainder of the division of two integer operands. op1 xx op2 The exponentiation operator will raise op1 to the power of op2.++op1 The pre-increpment operator will increase the value of op1 first, then assign it. op1++ The post-increment operator will increase the value of op1 after it is assigned.--op1 The pre-decrement operator will decrease the value of op1 before it is assigned. op1-- The post-decrement operator will decrease the value of op1 after it is assigned.

op1 + op2 对两个数值做加法操作 op1 - op2 对两个数值做减法操作 op1 * op2 对两个数值做乘法操作 op1 / op2 对两个数值做除法操作 op1 % op2 求两个整型数值的余数 op1 xx op2 求幂操作：求 op1 的 op2 次幂++op1 前加操作： op1 的值先增加，然后将值赋给自身 op1++后加操作： op1 的值先赋给自身，再增加值--op1 前减操作： op1 的值先减少，然后将值赋给自身 op1—后减操作： op1 的值先赋给自身，再减少值

It has a microcontroller peripheral devices are connected to high-speed bus connections within the connection interface and memory card connection interface, the micro-controller memory card interface, high speed bus interface to connect external devices and virtual within the integrated drive electronics interface module, and the virtual integrated drive electronics interface module includes an integrated drive electronics interface to the virtual host and virtual device side, and when the host side of the card reader connected to the memory card storage or read the instructions issued, the command will be sent to Xuni integrated Shi-driven electronic interface module, and in which the instruction to complete, while the memory card of the information on the transmission to achieve high speed Waiwei components provided within the connecting bus transfer rate, and the host will think that reader is integrated drive electronics interface devices, not just within the high-speed peripheral devices connected bus devices.

其具有微控制器分别连接有高速外围元件内连接总线连接接口及存储卡连接接口，而微控制器具有存储卡接口、高速外围元件内连接总线接口及虚拟整合式驱动电子接口模块，且虚拟整合式驱动电子接口模块包括有整合式驱动电子接口的虚拟主控端及虚拟装置端，而当主机端对读卡机所连接的存储卡下达储存或读取的指令时，该指令会传送至虚拟整合式驱动电子接口模块，并在其中将指令完成，而存储卡内的资料于传输时可达到高速外围元件内连接总线所提供的传输速率，且主控端会认为读卡机为整合式驱动电子接口装置，而非单纯的高速外围元件内连接总线装置。

The main factors affecting the soil-structure interface behaviors were found experimentally and theoretically, including: 1 the thickness of the interface that is five to six times the average grain size of the soil; 2 the aeolotropy of interface, which is responsible for anisotropic response of the stress-strain response of the interface; 3 two physical states, including crashing and compression of the soil near the structure surface, which govern the stress-strain response of the interface strongly; 4 two shear deformation components due to sliding and constraint of the structure surface relative to the soil respectively, which forms the deformation of the interface; 5 the volumetric strain due to dilatancy, which is found to be composed of a reversible dilatancy component and an irreversible dilatancy component. 4. A unified constitutive model of the interface, based on new elasto-plasticity damage theory, was developed. It was confirmed to be effective for the conditions considering monotonic and cyclic shearing, coupling effect of shear and volumetric strains, evolution of physical state, micro-structure aeolotropy of the soil and the resulting aeolotropy of the interface as well as the three normal boundary conditions stated above. 5. 2D and 3D finite element formulations of the present model were derived and incorporated into the FEM codes. They were applied to the evaluation of practical engineering problems with different typical interfaces between soil and structure. The new model was shown to be reasonable and effective.

确定了粗粒土与结构接触面厚度约为5～6倍的平均粒径，首次揭示了接触面的细观结构异向性以及由此所引起的宏观剪切异向性，发现了在单调和往返剪切荷载作用下土颗粒破碎和剪切压密两种物态变化机制共同支配着接触面力学性质的变化，通过细观分析证实了接触面的变形可分解为一般同时发生的土与结构交界面上的滑移变形以及结构面位移约束范围之内土体本身的剪切变形两部分，观测到接触面受剪时表现出明显的相对法向位移，并可分解为可逆性和不可逆性两个分量；(4)建立了第一个能够统一地描述单调与往返剪切特性、剪应变与体应变耦合特性、细观结构和宏观剪切异向性以及土颗粒破碎等物态变化特性的土与结构接触面弹塑性损伤本构数学模型，并采用多种法向边界条件复杂加载路径的试验成果验证了新模型的合理性和有效性；(5)提出了新模型的二、三维有限元格式并结合实际边值问题进行了应用计算分析，比较了不同接触面本构模型对计算结果的影响，证实了新模型及其有限元格式不仅能够合理地描述土与结构接触面的主要力学特性，还能够较好地反映土体与结构物在接触面处的滑移、脱开等不连续现象。

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