焊合
- 与 焊合 相关的网络解释 [注：此内容来源于网络，仅供参考]
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fusing
熔合
其中1~5μ 之间的发热区,可用于电路板的熔合(Fusing)或组装板的熔焊(Reflow). 而 1~ 2.5μ 的高温区因距可见光区(0.3~0.72μ)较近,故称为" 近红外线",所含辐射热能量极大. 另有 Medium IR 及 Far IR ,其热量则较低.
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incompletely filled groove
未焊满
incomplete tusion 未溶合(61) | incompletely filled groove 未焊满(61) | indented wire 刻痕钢丝(29)
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bond lift off
键合处剥离
bond interface 焊接界面 | bond lift off 键合处剥离 | bond pad definition 焊盘图象形成
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stick-out weld
未熔合点焊接头
standard reinforced fillet weld标准加强角焊缝 | stick-out weld未熔合点焊接头 | stitch-and-seam weld点线焊
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welded joint
熔合接头
welded electronic circuit 焊接的电子电路 | welded joint 熔合接头 | welded junction 焊口
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Scuffing
胶合
刮伤(Scoring)与"擦伤"相同原因形成的严重擦痕,又称划伤胶合(Scuffing)两摩擦表面发生固相"焊合"而此起的局部损伤,但没有发生局部表面熔合. 咬死(Seizure)摩擦表面发生严重粘附或转移,使相对运动停止或不能运动. 又称咬粘.
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faying surface
贴合面
电极接触面 electrode contact surface | 贴合面 faying surface | 焊点 welding spot
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laminator
压合机
133.Laminate void板材空洞 | 134.Laminator 压合机 | 135.Liquid photoimagible solder mask 液态感光防焊绿漆=LPT=LPSM
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Vacuoles
焊洞
Urethane胺基甲酸乙脂. | Vacuoles焊洞. | Vacuum Lamination真空压合.
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Vacuoles
焊洞.LYm电子资料网
Urethane胺基甲酸乙脂.LYm电子资料网 | Vacuoles焊洞.LYm电子资料网 | Vacuum Lamination真空压合.LYm电子资料网
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