查询词典 chip out

face down bonding：倒装焊接

face centred cubic lattice 面心立方晶格 | face down bonding 倒装焊接 | face down chip 倒装芯片

face down bonding：倒装焊接,侧焊

face down 面向下 | face down bonding 倒装焊接,侧焊=>フェースダウンボンディング | face down chip 倒装芯片

face down chip：倒装芯片

face down bonding 倒装焊接 | face down chip 倒装芯片 | face down integrated circuit 倒装芯片集成电路

face down chip：倒装芯片WwL中国学习动力网

face down bonding 倒装焊接WwL中国学习动力网 | face down chip 倒装芯片WwL中国学习动力网 | face down integrated circuit 倒装芯片集成电路WwL中国学习动力网

face down integrated circuit：倒装芯片集成电路

face down chip 倒装芯片 | face down integrated circuit 倒装芯片集成电路 | faceplate 面板

face down integrated circuit：倒装芯片集成

face down chip 倒装芯片 | face down integrated circuit 倒装芯片集成 | faceplate 面板

face down integrated circuit：倒装芯片集成电路WwL中国学习动力网

face down chip 倒装芯片WwL中国学习动力网 | face down integrated circuit 倒装芯片集成电路WwL中国学习动力网 | faceplate 面板WwL中国学习动力网

Fade：右曲球

(失误)右曲球(Fade)球稍稍向左,下降时轻微偏右. (并非失误,有实际需要)右飞球(Push)球直飞向右侧(失误)右旋球(Slice)球先飞向左方,然后右旋至右方(失误)切击(Chip)球以低弹道飞行短距离,然后球滚动三、四倍距离.

失效分析(念FEMA)：FMEA Failure Mode and Effects Analysis

FCPGA Flip Chip Pin Grid Array 覆晶型插針矩陣(IC) | FMEA Failure Mode and Effects Analysis 失效分析(念FEMA) | FTA Failure Tree Analysis 失誤樹分析

digital filtering：软件滤波

digital chip 数字芯片 | digital filtering软件滤波 | digital multimeter 数字多用表

Permanently mounted to American-made 3/4" hose bibb：永久安装在美国制造的3 / 4 "软管比伯

Features: 特点: | Permanently mounted to American-made 3/4" hose bibb永久安装在美国制造的3 / 4 "软管比伯 | Editorial Review: 编辑审查:

Exhale ,forward：呼,前屈

Bend your knees,inhale,reach up to utkatasana;屈膝,吸,双臂上举,幻椅式 | Exhale ,forward; 呼,前屈 | inhale, lift your spine, hands connected; 吸,伸展脊柱,手连接(地面或小腿)